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H01L2224/86399

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Microelectronic device including fiber-containing build-up layers
- Patent number 11,664,313
- Issue date May 30, 2023
- Intel Corporation
- Sri Chaitra Jyotsna Chavali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device including fiber-containing build-up layers
- Patent number 11,004,792
- Issue date May 11, 2021
- Intel Corporation
- Sri Chaitra Jyotsna Chavali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on film and display device including the same
- Patent number 10,971,438
- Issue date Apr 6, 2021
- LG Display Co., Ltd.
- Jihun Song
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC DEVICE INCLUDING FIBER-CONTAINING BUILD-UP LAYERS
- Publication number 20210242132
- Publication date Aug 5, 2021
- Intel Corporation
- Sri Chaitra Jyotsna CHAVALI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON FILM AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20180151536
- Publication date May 31, 2018
- LG Display Co., Ltd.
- Jihun SONG
- H01 - BASIC ELECTRIC ELEMENTS