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H01L2224/75312

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/75312Material

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Patents Grantslast 30 patents

Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,705,425
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
- Patent number 11,651,983
- Issue date May 16, 2023
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding head and a bonding apparatus having the same
- Patent number 11,456,273
- Issue date Sep 27, 2022
- Samsung Electronics Co., Ltd.
- Jaecheol Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and related techniques for handling aligned substrate pairs
- Patent number 11,183,401
- Issue date Nov 23, 2021
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating the electronic component, and method for tra...
- Patent number 11,069,638
- Issue date Jul 20, 2021
- AU OPTRONICS CORPORATION
- Yi-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,024,595
- Issue date Jun 1, 2021
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding and placement tools for bonding machines, bonding machines...
- Patent number 11,011,493
- Issue date May 18, 2021
- Kulicke and Soffa Industries, Inc.
- Ai Jun Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
- Patent number 10,825,705
- Issue date Nov 3, 2020
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, transposing component, method for fabricating...
- Patent number 10,438,911
- Issue date Oct 8, 2019
- AU OPTRONICS CORPORATION
- Yi-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jig for bonding a semiconductor chip, apparatus for bonding a semic...
- Patent number 10,410,990
- Issue date Sep 10, 2019
- Samsung Electronics Co., Ltd.
- Man-Hee Han
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Press fitting head and semiconductor manufacturing apparatus using...
- Patent number 10,388,625
- Issue date Aug 20, 2019
- J-DEVICES CORPORATION
- Minoru Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for simultaneously bonding multiple chips of different heigh...
- Patent number 10,147,702
- Issue date Dec 4, 2018
- Palo Alto Research Center Incorporated
- Brent S. Krusor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounted substrate, mounted-substrate production method, and mounted...
- Patent number 10,136,570
- Issue date Nov 20, 2018
- Sharp Kabushiki Kaisha
- Katsuhiro Yamaguchi
- G02 - OPTICS
Information Patent Grant
Bonding head and die bonding apparatus having the same
- Patent number 9,620,476
- Issue date Apr 11, 2017
- Semes Co., Ltd.
- Hang Lim Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic device and electronic device
- Patent number 8,389,328
- Issue date Mar 5, 2013
- Sumitomo Bakelite Co., Ltd.
- Toru Meura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 8,286,853
- Issue date Oct 16, 2012
- Tokyo Electron Limited
- Naoki Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus
- Patent number 8,210,417
- Issue date Jul 3, 2012
- Tokyo Electron Limited
- Naoki Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal compressive bond head
- Patent number 8,177,862
- Issue date May 15, 2012
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien Ling Hwang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
BOND HEAD DESIGN FOR THERMAL COMPRESSION BONDING
- Publication number 20230317676
- Publication date Oct 5, 2023
- Intel Corporation
- Michael Baker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOFT TOUCH EUTECTIC SOLDER PRESSURE PAD
- Publication number 20230268312
- Publication date Aug 24, 2023
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Peter M. Wallace
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING T...
- Publication number 20230163094
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Euisun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230142695
- Publication date May 11, 2023
- Fuji Electric Co., Ltd.
- Yuichiro HINATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS
- Publication number 20210233887
- Publication date Jul 29, 2021
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS
- Publication number 20210013079
- Publication date Jan 14, 2021
- SUSS MICROTEC LITHOGRAPHY GMBH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING HEAD AND A BONDING APPARATUS HAVING THE SAME
- Publication number 20200343215
- Publication date Oct 29, 2020
- Samsung Electronics Co., Ltd.
- JAECHEOL KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Jig for Bonding a Semiconductor Chip, Apparatus for Bonding a Semic...
- Publication number 20190103376
- Publication date Apr 4, 2019
- Samsung Electronics Co., Ltd.
- Man-Hee Han
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SIMULTANEOUSLY BONDING MULTIPLE CHIPS OF DIFFERENT HEIGH...
- Publication number 20180114772
- Publication date Apr 26, 2018
- Palo Alto Research Center Incorporated
- Brent S. Krusor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFERRING MEMBER AND PRESSURE APPLYING UNIT
- Publication number 20170069592
- Publication date Mar 9, 2017
- Shindengen Electric Manufacturing Co., Ltd.
- Ryo MATSUBAYASHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL COMPRESSION HEAD FOR FLIP CHIP BONDING
- Publication number 20130175324
- Publication date Jul 11, 2013
- Advanced Semiconductor Engineering, Inc.
- Hui-Shan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20120091186
- Publication date Apr 19, 2012
- TOKYO ELECTRON LIMITED
- Naoki AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20120091187
- Publication date Apr 19, 2012
- TOKYO ELECTRON LIMITED
- Naoki AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Compressive Bond Head
- Publication number 20120088362
- Publication date Apr 12, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE
- Publication number 20110221075
- Publication date Sep 15, 2011
- SUMITOMO BAKELITE CO., LTD.
- Toru Meura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thermocompression bond tips and related apparatus and methods

Apparatus, system, and method for handling aligned wafer pairs

Bonding head and a bonding apparatus having the same

System and related techniques for handling aligned substrate pairs

Method for fabricating the electronic component, and method for tra...

Thermocompression bond tips and related apparatus and methods

Bonding and placement tools for bonding machines, bonding machines...

Apparatus, system, and method for handling aligned wafer pairs

Electronic component, transposing component, method for fabricating...

Jig for bonding a semiconductor chip, apparatus for bonding a semic...

Press fitting head and semiconductor manufacturing apparatus using...

Method for simultaneously bonding multiple chips of different heigh...

Mounted substrate, mounted-substrate production method, and mounted...

Bonding head and die bonding apparatus having the same

Method of manufacturing electronic device and electronic device

Bonding apparatus and bonding method

Bonding apparatus

Thermal compressive bond head

Patents Applicationslast 30 patents

BOND HEAD DESIGN FOR THERMAL COMPRESSION BONDING

SOFT TOUCH EUTECTIC SOLDER PRESSURE PAD

APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING T...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS

APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS

BONDING HEAD AND A BONDING APPARATUS HAVING THE SAME

Jig for Bonding a Semiconductor Chip, Apparatus for Bonding a Semic...

METHOD FOR SIMULTANEOUSLY BONDING MULTIPLE CHIPS OF DIFFERENT HEIGH...

TRANSFERRING MEMBER AND PRESSURE APPLYING UNIT

THERMAL COMPRESSION HEAD FOR FLIP CHIP BONDING

BONDING APPARATUS

BONDING APPARATUS AND BONDING METHOD

Thermal Compressive Bond Head

METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE