Material

Industry

CPC
H01L2224/85359

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85359Material

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method for preparing semiconductor device with wire bond
- Patent number 12,113,046
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Wei-Zhong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device with wire bond
- Patent number 11,876,072
- Issue date Jan 16, 2024
- NANYA TECHNOLOGY CORPORATION
- Wei-Zhong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device
- Patent number 11,031,254
- Issue date Jun 8, 2021
- Renesas Electronics Corporation
- Yasuhiko Akaike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 10,658,272
- Issue date May 19, 2020
- Kabushiki Kaisha Toshiba
- Hiroaki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free soldering method and soldered article
- Patent number 10,002,845
- Issue date Jun 19, 2018
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,972,598
- Issue date May 15, 2018
- Renesas Electronics Corporation
- Yuki Yagyu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH WIRE BOND
- Publication number 20240063175
- Publication date Feb 22, 2024
- NANYA TECHNOLOGY CORPORATION
- WEI-ZHONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING
- Publication number 20230110402
- Publication date Apr 13, 2023
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH WIRE BOND
- Publication number 20230061312
- Publication date Mar 2, 2023
- NANYA TECHNOLOGY CORPORATION
- WEI-ZHONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20200144075
- Publication date May 7, 2020
- RENESAS ELECTRONICS CORPORATION
- Yasuhiko AKAIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200091044
- Publication date Mar 19, 2020
- Kabushiki Kaisha Toshiba
- Hiroaki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180082977
- Publication date Mar 22, 2018
- RENESAS ELECTRONICS CORPORATION
- Yuki YAGYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE SOLDERING METHOD AND SOLDERED ARTICLE
- Publication number 20170012018
- Publication date Jan 12, 2017
- Fuji Electric Co., Ltd.
- Hirohiko WATANABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for low pressure wirebond
- Publication number 20050098605
- Publication date May 12, 2005
- International Business Machines Corporation
- Daniel C. Edelstein
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for preparing semiconductor device with wire bond

Method for preparing semiconductor device with wire bond

Method for manufacturing a semiconductor device

Method for manufacturing semiconductor device

Lead-free soldering method and soldered article

Method of manufacturing semiconductor device

Patents Applicationslast 30 patents

METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH WIRE BOND

SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING

METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH WIRE BOND

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

LEAD-FREE SOLDERING METHOD AND SOLDERED ARTICLE

Apparatus and method for low pressure wirebond