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  • H01L2224/78309
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/78309Material
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Patents Grantslast 30 patents

  • Information Patent Grant

    Ceramic material and wire bonding capillary
    • Patent number 11,964,915
    • Issue date Apr 23, 2024
    • Industrial Technology Research Institute
    • Tien-Heng Huang
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor device
    • Patent number 10,163,850
    • Issue date Dec 25, 2018
    • Rohm Co., Ltd.
    • Motoharu Haga
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor device
    • Patent number 9,780,069
    • Issue date Oct 3, 2017
    • Rohm Co., Ltd.
    • Motoharu Haga
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding apparatus
    • Patent number 9,339,888
    • Issue date May 17, 2016
    • Kaijo Corporation
    • Shuichi Takanami
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding tool with polymer coating
    • Patent number 7,077,304
    • Issue date Jul 18, 2006
    • Kulicke & Soffa Investments, Inc.
    • Benjamin Sonnenreich
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding tool with polymer coating
    • Patent number 6,729,527
    • Issue date May 4, 2004
    • Kulicke & Soffa Investments, Inc.
    • Benjamin Sonnenreich
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Protection of semiconductor wire bonding capillary from spark erosion
    • Patent number 4,513,190
    • Issue date Apr 23, 1985
    • Small Precision Tools, Inc.
    • Kenneth W. Ellett
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    WIRE BONDING CAPILLARY
    • Publication number 20230311239
    • Publication date Oct 5, 2023
    • CRAFTSTECH, INC.
    • Jeffrey C. Roberts
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Ceramic material and wire bonding capillary
    • Publication number 20220204409
    • Publication date Jun 30, 2022
    • Industrial Technology Research Institute
    • Tien-Heng HUANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING APPARATUS
    • Publication number 20140305996
    • Publication date Oct 16, 2014
    • KAIJO CORPORATION
    • Shuichi Takanami
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR PACKAGE WITH PRE-FORMED BALL BONDS
    • Publication number 20110068469
    • Publication date Mar 24, 2011
    • FREESCALE SEMICONDUCTOR, INC.
    • Kai Yun Yow
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF FORMING BALL BOND
    • Publication number 20100059883
    • Publication date Mar 11, 2010
    • FREESCALE SEMICONDUCTOR, INC.
    • Kai Yun Yow
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Bonding tool with polymer coating
    • Publication number 20050077339
    • Publication date Apr 14, 2005
    • Benjamin Sonnenreich
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Bonding tool with polymer coating
    • Publication number 20040164129
    • Publication date Aug 26, 2004
    • Benjamin Sonnenreich
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Bonding tool with polymer coating
    • Publication number 20020100790
    • Publication date Aug 1, 2002
    • Benjamin Sonnenreich
    • H01 - BASIC ELECTRIC ELEMENTS