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CPC
H01L2224/81399

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81399Material

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Patents Grantslast 30 patents

Information Patent Grant
Interconnect structures and methods of making the same
- Patent number 9,173,282
- Issue date Oct 27, 2015
- Georgia Tech Research Corporation
- Pulugurtha Markondeya Raj
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder interconnect by addition of copper
- Patent number 8,580,621
- Issue date Nov 12, 2013
- LSI Corporation
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder interconnect by addition of copper
- Patent number 8,378,485
- Issue date Feb 19, 2013
- LSI Corporation
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure formed from using removable mandrel
- Patent number 8,119,516
- Issue date Feb 21, 2012
- Tessera Interconnect Materials, Inc.
- Kimitaka Endo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of attaching a solder ball and method of repairing a memory...
- Patent number 8,070,048
- Issue date Dec 6, 2011
- Samsung Electronics Co., Ltd.
- Nam-Yong Oh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230146085
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230134201
- Publication date May 4, 2023
- Samsung Electronics Co., Ltd.
- Hye Jin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER INTERCONNECT BY ADDITION OF COPPER
- Publication number 20130149857
- Publication date Jun 13, 2013
- LSI Corporation
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS OF MAKING THE SAME
- Publication number 20130107485
- Publication date May 2, 2013
- Georgia Tech Research Corporation
- Pulugurtha Markondeya Raj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ATTACHING A SOLDER BALL AND METHOD OF REPAIRING A MEMORY...
- Publication number 20110068151
- Publication date Mar 24, 2011
- Samsung Electronics Co., Ltd.
- Nam-Yong OH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER INTERCONNECT BY ADDITION OF COPPER
- Publication number 20110006415
- Publication date Jan 13, 2011
- LSI Corporation
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Structure With Multiple Layers And Method Of Manufacture
- Publication number 20100206602
- Publication date Aug 19, 2010
- BARUN ELECTRONICS CO., LTD.
- Sang Chul Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Process for forming a bump structure and bump structure
- Publication number 20090121351
- Publication date May 14, 2009
- Tessera Interconnect Materials, Inc.
- Kimitaka Endo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interconnect structures and methods of making the same

Solder interconnect by addition of copper

Solder interconnect by addition of copper

Bump structure formed from using removable mandrel

Method of attaching a solder ball and method of repairing a memory...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SOLDER INTERCONNECT BY ADDITION OF COPPER

INTERCONNECT STRUCTURES AND METHODS OF MAKING THE SAME

METHOD OF ATTACHING A SOLDER BALL AND METHOD OF REPAIRING A MEMORY...

SOLDER INTERCONNECT BY ADDITION OF COPPER

Bump Structure With Multiple Layers And Method Of Manufacture

Process for forming a bump structure and bump structure