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H01L2224/83399

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83399Material

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Patents Grantslast 30 patents

Information Patent Grant
Jointing material, fabrication method for semiconductor device usin...
- Patent number 11,476,399
- Issue date Oct 18, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidetoshi Kitaura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method
- Patent number 8,828,804
- Issue date Sep 9, 2014
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic device on leadframe
- Patent number 8,642,394
- Issue date Feb 4, 2014
- Infineon Technologies AG
- Abdul Rahman Mohamed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including a semiconductor chip and a carrier and fabrication...
- Patent number 8,637,379
- Issue date Jan 28, 2014
- Infineon Technologies AG
- Hannes Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including a power semiconductor chip electrically coupled to...
- Patent number 8,410,590
- Issue date Apr 2, 2013
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 7,754,533
- Issue date Jul 13, 2010
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230119406
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd
- Pilsung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20130234298
- Publication date Sep 12, 2013
- Kabushiki Kaisha Toshiba
- Satoshi MITSUGI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE INCLUDING A SEMICONDUCTOR CHIP AND A CARRIER AND FABRICATION...
- Publication number 20110084369
- Publication date Apr 14, 2011
- INFINEON TECHNOLOGIES AG
- Hannes Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING A POWER SEMICONDUCTOR CHIP
- Publication number 20100078784
- Publication date Apr 1, 2010
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20100055839
- Publication date Mar 4, 2010
- INFINEON TECHNOLOGIES AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20090273066
- Publication date Nov 5, 2009
- INFINEON TECHNOLOGIES AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING
- Publication number 20090189259
- Publication date Jul 30, 2009
- INFINEON TECHNOLOGIES AG
- Abdul Rahman Mohamed
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Jointing material, fabrication method for semiconductor device usin...

Semiconductor device and method

Method of manufacturing electronic device on leadframe

Device including a semiconductor chip and a carrier and fabrication...

Device including a power semiconductor chip electrically coupled to...

Method of manufacturing a semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

DEVICE INCLUDING A SEMICONDUCTOR CHIP AND A CARRIER AND FABRICATION...

DEVICE INCLUDING A POWER SEMICONDUCTOR CHIP

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING