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H01L2224/29599

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Devices for metallization
- Patent number 9,006,893
- Issue date Apr 14, 2015
- Lam Research Corporation
- Artur Kolics
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods, devices, and materials for metallization
- Patent number 8,518,815
- Issue date Aug 27, 2013
- Lam Research Corporation
- Artur Kolics
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SENSOR DEVICE AND METHOD FOR MANUFACTURING SENSOR DEVICE
- Publication number 20240387437
- Publication date Nov 21, 2024
- MITSUMI ELECTRIC CO., LTD.
- Soichiro SUZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOUNTING SEMICONDUCTOR SENSOR DEVICE
- Publication number 20150235980
- Publication date Aug 20, 2015
- MITSUMI ELECTRIC CO., LTD.
- Shinya YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, DEVICES, AND MATERIALS FOR METALLIZATION
- Publication number 20140054776
- Publication date Feb 27, 2014
- LAM RESEARCH CORPORATION
- Artur KOLICS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, DEVICES, AND MATERIALS FOR METALLIZATION
- Publication number 20120007239
- Publication date Jan 12, 2012
- Artur Kolics
- H01 - BASIC ELECTRIC ELEMENTS