Material

Industry

CPC
H01L2224/80359

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80359Material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Pre-plated substrate for die attachment
- Patent number 9,893,027
- Issue date Feb 13, 2018
- NXP USA, INC.
- David F. Abdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of sealing and contacting substrates using laser light and e...
- Patent number 9,171,822
- Issue date Oct 27, 2015
- Corelase Oy
- Jarno Kangastupa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pad bonding employing a self-aligned plated liner for adhesion enha...
- Patent number 8,492,265
- Issue date Jul 23, 2013
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad bonding employing a self-aligned plated liner for adhesion enha...
- Patent number 8,482,132
- Issue date Jul 9, 2013
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240014166
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Youngdeuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING STACKED INTEGRATED CIRCUITS USING SELECTIVE THER...
- Publication number 20220077104
- Publication date Mar 10, 2022
- The Regents of the University of California
- Mike Breeden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-PLATED SUBSTRATE FOR DIE ATTACHMENT
- Publication number 20180012855
- Publication date Jan 11, 2018
- NXP USA, Inc.
- David F. Abdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-PLATED SUBSTRATE FOR DIE ATTACHMENT
- Publication number 20170294393
- Publication date Oct 12, 2017
- FREESCALE SEMICONDUCTOR, INC.
- David F. Abdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20150130085
- Publication date May 14, 2015
- Mitsubishi Electric Corporation
- Yasunari HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING OF ELECTRONIC COMPONENTS
- Publication number 20150060898
- Publication date Mar 5, 2015
- Reactive NanoTechnologies, Inc
- David Van Heerden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SEALING AND CONTACTING SUBSTRATES USING LASER LIGHT AND E...
- Publication number 20130070428
- Publication date Mar 21, 2013
- CORELASE OY
- Jarno Kangastupa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PAD BONDING EMPLOYING A SELF-ALIGNED PLATED LINER FOR ADHESION ENHA...
- Publication number 20120190187
- Publication date Jul 26, 2012
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING OF ELECTRONIC COMPONENTS
- Publication number 20110089462
- Publication date Apr 21, 2011
- David Van Heerden
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PAD BONDING EMPLOYING A SELF-ALIGNED PLATED LINER FOR ADHESION ENHA...
- Publication number 20110084403
- Publication date Apr 14, 2011
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Pre-plated substrate for die attachment

Method of sealing and contacting substrates using laser light and e...

Pad bonding employing a self-aligned plated liner for adhesion enha...

Pad bonding employing a self-aligned plated liner for adhesion enha...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

METHODS OF FORMING STACKED INTEGRATED CIRCUITS USING SELECTIVE THER...

PRE-PLATED SUBSTRATE FOR DIE ATTACHMENT

PRE-PLATED SUBSTRATE FOR DIE ATTACHMENT

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD FOR LOW TEMPERATURE BONDING OF ELECTRONIC COMPONENTS

METHOD OF SEALING AND CONTACTING SUBSTRATES USING LASER LIGHT AND E...

PAD BONDING EMPLOYING A SELF-ALIGNED PLATED LINER FOR ADHESION ENHA...

METHOD FOR LOW TEMPERATURE BONDING OF ELECTRONIC COMPONENTS

PAD BONDING EMPLOYING A SELF-ALIGNED PLATED LINER FOR ADHESION ENHA...