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H01L2224/485

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/485Material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and inspection device
- Patent number 12,040,303
- Issue date Jul 16, 2024
- Kabushiki Kaisha Toshiba
- Mitsuaki Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 12,027,465
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated copper bonding wire, wire bonding structure, semic...
- Patent number 11,876,066
- Issue date Jan 16, 2024
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding methods for light emitting diodes
- Patent number 11,854,810
- Issue date Dec 26, 2023
- Meta Platforms Technologies, LLC
- Stephan Lutgen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder joints on nickel surface finishes without gold plating
- Patent number 11,676,926
- Issue date Jun 13, 2023
- Schlumberger Technology Corporation
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip, method for producing a power semiconducto...
- Patent number 11,664,335
- Issue date May 30, 2023
- Semikron Elektronik GmbH & Co., KG
- Wolfgang-Michael Schulz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding methods for light emitting diodes
- Patent number 11,631,587
- Issue date Apr 18, 2023
- Meta Platforms Technologies, LLC
- Stephan Lutgen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid-bonded and run-out compensated light emitting diodes
- Patent number 11,569,091
- Issue date Jan 31, 2023
- Meta Platforms Technologies, LLC
- Stephan Lutgen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 11,532,568
- Issue date Dec 20, 2022
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 11,462,504
- Issue date Oct 4, 2022
- Mitsubishi Electric Corporation
- Koichi Tokubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 11,456,255
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,430,726
- Issue date Aug 30, 2022
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding methods for light emitting diodes
- Patent number 11,430,658
- Issue date Aug 30, 2022
- Meta Platforms Technologies, LLC
- Stephan Lutgen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eutectic electrode structure of flip-chip LED chip and flip-chip LE...
- Patent number 11,393,967
- Issue date Jul 19, 2022
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Anhe He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 11,342,299
- Issue date May 24, 2022
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Wire bonding structure
- Patent number 11,335,661
- Issue date May 17, 2022
- Nippon Telegraph and Telephone Corporation
- Miwa Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,270,971
- Issue date Mar 8, 2022
- Renesas Electronics Corporation
- Kenji Ikura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with terminal pattern for increased channel d...
- Patent number 11,211,315
- Issue date Dec 28, 2021
- Texas Instruments Incorporated
- Casey Thomas Morrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,998,288
- Issue date May 4, 2021
- Renesas Electronics Corporation
- Tadatoshi Danno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electrical contact and method of forming a chi...
- Patent number 10,978,418
- Issue date Apr 13, 2021
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated wire
- Patent number 10,960,498
- Issue date Mar 30, 2021
- Heraeus Materials Singapore Pte., Ltd.
- Il Tae Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical image capturing module
- Patent number 10,914,924
- Issue date Feb 9, 2021
- Ability Opto-Electronics Technology Co., Ltd.
- Yeong-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eutectic electrode structure of flip-chip LED chip and flip-chip LE...
- Patent number 10,916,688
- Issue date Feb 9, 2021
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Anhe He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with radiation shield
- Patent number 10,916,508
- Issue date Feb 9, 2021
- TOSHIBA MEMORY CORPORATION
- Yasuo Takemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device
- Patent number 10,896,996
- Issue date Jan 19, 2021
- Rohm Co., Ltd.
- Tomoichiro Toyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods for forming a semiconductor device
- Patent number 10,867,893
- Issue date Dec 15, 2020
- Infineon Technologies AG
- Sergey Ananiev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,840,208
- Issue date Nov 17, 2020
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board having insulating metal oxide layer covering...
- Patent number 10,770,384
- Issue date Sep 8, 2020
- Samsung Electronics Co., Ltd.
- Soo-jae Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING
- Publication number 20230110402
- Publication date Apr 13, 2023
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...
- Publication number 20230088776
- Publication date Mar 23, 2023
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD
- Anhe HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20230082767
- Publication date Mar 16, 2023
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20230020310
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING BASED MANUFACTURE OF LIGHT EMITTING DIODES
- Publication number 20220399203
- Publication date Dec 15, 2022
- Meta Platforms Technologies, LLC
- Stephan LUTGEN
- G02 - OPTICS
Information Patent Application
BONDING METHODS FOR LIGHT EMITTING DIODES
- Publication number 20220262637
- Publication date Aug 18, 2022
- Facebook Technologies, LLC
- Stephan LUTGEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20220108971
- Publication date Apr 7, 2022
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SOLDER JOINTS ON NICKEL SURFACE FINISHES WITHOUT GOLD PLATING
- Publication number 20220059489
- Publication date Feb 24, 2022
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRENGTHENED WIRE-BOND
- Publication number 20220020717
- Publication date Jan 20, 2022
- Semiconductor Components Industries, LLC
- WuXing Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20220013460
- Publication date Jan 13, 2022
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20210375783
- Publication date Dec 2, 2021
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PALLADIUM-COATED COPPER BONDING WIRE, WIRE BONDING STRUCTURE, SEMIC...
- Publication number 20210366867
- Publication date Nov 25, 2021
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND INSPECTION DEVICE
- Publication number 20210296279
- Publication date Sep 23, 2021
- Kabushiki Kaisha Toshiba
- Mitsuaki KATO
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20210280554
- Publication date Sep 9, 2021
- Mitsubishi Electric Corporation
- Koichi TOKUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20210167005
- Publication date Jun 3, 2021
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...
- Publication number 20210126176
- Publication date Apr 29, 2021
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD
- Anhe HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
- Publication number 20210082861
- Publication date Mar 18, 2021
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Bonding Structure
- Publication number 20200395331
- Publication date Dec 17, 2020
- Nippon Telegraph and Telephone Corporation
- Miwa Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...
- Publication number 20200313059
- Publication date Oct 1, 2020
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD
- Anhe HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20200243444
- Publication date Jul 30, 2020
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...
- Publication number 20200211931
- Publication date Jul 2, 2020
- RENESAS ELECTRONICS CORPORATION
- Masahiro MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200135687
- Publication date Apr 30, 2020
- RENESAS ELECTRONICS CORPORATION
- Kenji IKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL IMAGE CAPTURING MODULE
- Publication number 20200096737
- Publication date Mar 26, 2020
- ABILITY OPTO-ELECTRONICS TECHNOLOGY CO., LTD.
- YEONG-MING CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20200083171
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE
- Publication number 20200013747
- Publication date Jan 9, 2020
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190287922
- Publication date Sep 19, 2019
- Toshiba Memory Corporation
- Yasuo TAKEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20190198477
- Publication date Jun 27, 2019
- RENESAS ELECTRONICS CORPORATION
- Tadatoshi Danno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE
- Publication number 20190164927
- Publication date May 30, 2019
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Chip, Method for Producing a Power Semiconducto...
- Publication number 20190148318
- Publication date May 16, 2019
- SEMIKRON Elektronik GmbH & Co., KG
- Wolfgang-Michael SCHULZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH TERMINAL PATTERN FOR INCREASED CHANNEL D...
- Publication number 20190115292
- Publication date Apr 18, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Casey Thomas Morrison
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and inspection device

Chip package, method of forming a chip package and method of formin...

Impedance controlled electrical interconnection employing meta-mate...

Palladium-coated copper bonding wire, wire bonding structure, semic...

Bonding methods for light emitting diodes

Solder joints on nickel surface finishes without gold plating

Power semiconductor chip, method for producing a power semiconducto...

Bonding methods for light emitting diodes

Hybrid-bonded and run-out compensated light emitting diodes

Electronic package

Semiconductor apparatus

Impedance controlled electrical interconnection employing meta-mate...

Semiconductor module

Bonding methods for light emitting diodes

Eutectic electrode structure of flip-chip LED chip and flip-chip LE...

Bonding wire for semiconductor devices

Wire bonding structure

Semiconductor device and method of manufacturing the same

Semiconductor package with terminal pattern for increased channel d...

Method of manufacturing a semiconductor device

Method of forming an electrical contact and method of forming a chi...

Coated wire

Optical image capturing module

Eutectic electrode structure of flip-chip LED chip and flip-chip LE...

Semiconductor device package with radiation shield

Optical device

Semiconductor devices and methods for forming a semiconductor device

Bonding wire for semiconductor device

Semiconductor integrated circuit device

Printed circuit board having insulating metal oxide layer covering...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING

Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...

ELECTRONIC PACKAGE

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

HYBRID BONDING BASED MANUFACTURE OF LIGHT EMITTING DIODES

BONDING METHODS FOR LIGHT EMITTING DIODES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

SOLDER JOINTS ON NICKEL SURFACE FINISHES WITHOUT GOLD PLATING

STRENGTHENED WIRE-BOND

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

ELECTRONIC PACKAGE

PALLADIUM-COATED COPPER BONDING WIRE, WIRE BONDING STRUCTURE, SEMIC...

SEMICONDUCTOR DEVICE AND INSPECTION DEVICE

SEMICONDUCTOR APPARATUS

SEMICONDUCTOR MODULE

Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...

Wire Bonding Structure

Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

OPTICAL IMAGE CAPTURING MODULE

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE

Power Semiconductor Chip, Method for Producing a Power Semiconducto...

SEMICONDUCTOR PACKAGE WITH TERMINAL PATTERN FOR INCREASED CHANNEL D...