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H01L2224/45599

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45599Material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module and power conversion apparatus
- Patent number 12,224,220
- Issue date Feb 11, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating nanostructures and nanowires and devices fab...
- Patent number 9,881,999
- Issue date Jan 30, 2018
- The Regents of the University of California
- Arun Majumdar
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Localized alloying for improved bond reliability
- Patent number 9,331,050
- Issue date May 3, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus with a multi-layer coating and method of forming the same
- Patent number 9,055,700
- Issue date Jun 9, 2015
- Semblant Limited
- Mark Robson Humphries
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic assembly with impedance controlled wirebond and con...
- Patent number 8,994,195
- Issue date Mar 31, 2015
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with step mold and method of ma...
- Patent number 8,633,058
- Issue date Jan 21, 2014
- Stats Chippac Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with impedance controlled wirebond and con...
- Patent number 8,575,766
- Issue date Nov 5, 2013
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with impedance controlled wirebond and con...
- Patent number 8,269,357
- Issue date Sep 18, 2012
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized alloying for improved bond reliability
- Patent number 8,105,933
- Issue date Jan 31, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TFCC (TM) and SWCC (TM) thermal flex contact carriers
- Patent number 7,944,028
- Issue date May 17, 2011
- Don Saunders
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for stacked die package with insulated wire bonds
- Patent number 7,939,928
- Issue date May 10, 2011
- Microsemi Corporation
- James Zaccardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with impedance controlled wirebond and con...
- Patent number 7,923,851
- Issue date Apr 12, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnections resistant to wicking
- Patent number 7,901,995
- Issue date Mar 8, 2011
- Gabe Cherian
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of fabricating nanostructures and nanowires and devices fab...
- Patent number 7,834,264
- Issue date Nov 16, 2010
- The Regents of the University of California
- Arun Majumdar
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method and apparatus for stacked die package with insulated wire bonds
- Patent number 7,718,471
- Issue date May 18, 2010
- White Electronic Designs Corporation
- James Zaccardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package that prevents damage to semiconductor...
- Patent number 7,705,468
- Issue date Apr 27, 2010
- Hynix Semiconductor Inc.
- Cheol Ho Joh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating nanostructures and nanowires and devices fab...
- Patent number 7,569,847
- Issue date Aug 4, 2009
- The Regents of the University of California
- Arun Majumdar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating nanostructures and nanowires and devices fab...
- Patent number 7,569,941
- Issue date Aug 4, 2009
- The Regents of the University of California
- Arun Majumdar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonder for ball bonding insulated wire and method of using same
- Patent number 7,360,675
- Issue date Apr 22, 2008
- Microbonds, Inc.
- John I. Persic
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Iridium oxide nanowires and method for forming same
- Patent number 7,255,745
- Issue date Aug 14, 2007
- Sharp Laboratories of America, Inc.
- Fengyan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing or eliminating semiconductor device wire sweep...
- Patent number 7,179,688
- Issue date Feb 20, 2007
- Kulicke and Soffa Industries, Inc.
- Rakesh Batish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting spring elements on semiconductor devices, and wafer-level...
- Patent number 7,142,000
- Issue date Nov 28, 2006
- FormFactor, Inc.
- Benjamin N. Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making dual gauge leadframe
- Patent number 7,033,866
- Issue date Apr 25, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Wai Wong Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating nanostructures and nanowires and devices fab...
- Patent number 6,996,147
- Issue date Feb 7, 2006
- The Regents of the University of California
- Arun Majumdar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual gauge leadframe
- Patent number 6,917,097
- Issue date Jul 12, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Wai Wong Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonder for ball bonding insulated wire and method of using same
- Patent number 6,896,170
- Issue date May 24, 2005
- Microbonds, Inc.
- Robert J. Lyn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nanowires, nanostructures and devices fabricated therefrom
- Patent number 6,882,051
- Issue date Apr 19, 2005
- The Regents of the University of California
- Arun Majumdar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for burning-in semiconductor devices in wafer...
- Patent number 6,655,023
- Issue date Dec 2, 2003
- FormFactor, Inc.
- Benjamin N. Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and methods for coupling conductive leads of semiconducto...
- Patent number 6,602,778
- Issue date Aug 5, 2003
- Micron Technology, Inc.
- Troy A. Manning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring boards, semiconductor devices and their production processes
- Patent number 6,469,260
- Issue date Oct 22, 2002
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160126209
- Publication date May 5, 2016
- Fuji Electric Co., Ltd.
- Yuichiro HINATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CON...
- Publication number 20140103500
- Publication date Apr 17, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STEP MOLD AND METHOD OF MA...
- Publication number 20120241979
- Publication date Sep 27, 2012
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED ALLOYING FOR IMPROVED BOND RELIABILITY
- Publication number 20120153464
- Publication date Jun 21, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL FLEX CONTACT CARRIERS #2
- Publication number 20120012365
- Publication date Jan 19, 2012
- GABE CHERIAN
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Apparatus with a Multi-Layer Coating and Method of Forming the Same
- Publication number 20110253429
- Publication date Oct 20, 2011
- Semblant Global Limited
- Mark Robson Humphries
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SIMULTANEOUSLY FORMING A MECHANICAL AND ELECTRICAL CONNE...
- Publication number 20110217877
- Publication date Sep 8, 2011
- Torsten Linz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110156225
- Publication date Jun 30, 2011
- RENESAS ELECTRONICS CORPORATION
- Hiroshi Hozoji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CON...
- Publication number 20110101535
- Publication date May 5, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CON...
- Publication number 20110095408
- Publication date Apr 28, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CON...
- Publication number 20100230828
- Publication date Sep 16, 2010
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Stacked Die Package with Insulated Wire Bonds
- Publication number 20100176501
- Publication date Jul 15, 2010
- WHITE ELECTRONIC DESIGNS CORPORATION
- James Zaccardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR STACKED DIE PACKAGE WITH INSULATED WIRE BONDS
- Publication number 20100117243
- Publication date May 13, 2010
- WHITE ELECTRONIC DESIGNS CORPORATION
- James Zaccardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100059876
- Publication date Mar 11, 2010
- Shinko Electric Industries Co., Ltd.
- Hiroshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FABRICATING NANOSTRUCTURES AND NANOWIRES AND DEVICES FAB...
- Publication number 20100003516
- Publication date Jan 7, 2010
- THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
- Arun Majumdar
- G02 - OPTICS
Information Patent Application
MULTI-LAYERED WIRING SUBSTRATE, METHOD FOR PRODUCING THE SAME, AND...
- Publication number 20090145649
- Publication date Jun 11, 2009
- Shinko Electric Industries Co., Ltd.
- Michio HORIUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE THAT PREVENTS DAMAGE TO SEMICONDUCTOR...
- Publication number 20090096075
- Publication date Apr 16, 2009
- Cheol Ho JOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TFCC (TM) & SWCC (TM) thermal flex contact carriers
- Publication number 20090032915
- Publication date Feb 5, 2009
- Gabe Cherian
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MEMORY DEVICES INCLUDING SEPARATING INSULATING STRUCTURES ON WIRES...
- Publication number 20080296780
- Publication date Dec 4, 2008
- SAMSUNG ELECTRONICS CO., LTD.
- Cheol-joon Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED ALLOYING FOR IMPROVED BOND RELIABILITY
- Publication number 20080179745
- Publication date Jul 31, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of fabricating nanostructures and nanowires and devices fab...
- Publication number 20080092938
- Publication date Apr 24, 2008
- Arun Majumdar
- G02 - OPTICS
Information Patent Application
HIGH PERFORMANCE IC PACKAGE AND METHOD
- Publication number 20080048344
- Publication date Feb 28, 2008
- Robert Lyn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO-WICK(TM) 2 INTERCONNECTIONS
- Publication number 20070284706
- Publication date Dec 13, 2007
- Gabe Cherian
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Methods of fabricating nanostructures and nanowires and devices fab...
- Publication number 20070164270
- Publication date Jul 19, 2007
- Arun Majumdar
- G02 - OPTICS
Information Patent Application
METHOD FOR REDUCING OR ELIMINATING SEMICONDUCTOR DEVICE WIRE SWEEP...
- Publication number 20070096342
- Publication date May 3, 2007
- Rakesh Batish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mounting Spring Elements on Semiconductor Devices, and Wafer-Level...
- Publication number 20070046313
- Publication date Mar 1, 2007
- FormFactor, Inc.
- Benjamin N. Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
High performance IC package and method
- Publication number 20060175712
- Publication date Aug 10, 2006
- Microbonds, Inc.
- Robert Lyn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Iridium oxide nanowires and method for forming same
- Publication number 20060086314
- Publication date Apr 27, 2006
- Sharp Laboratories of America, Inc.
- Fengyan Zhang
- C30 - CRYSTAL GROWTH
Information Patent Application
Methods of fabricating nanostructures and nanowires and devices fab...
- Publication number 20050161662
- Publication date Jul 28, 2005
- Arun Majumdar
- G02 - OPTICS
Information Patent Application
Wire bonder for ball bonding insulated wire and method of using same
- Publication number 20050139637
- Publication date Jun 30, 2005
- John I. Persic
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor module and power conversion apparatus

Methods of fabricating nanostructures and nanowires and devices fab...

Localized alloying for improved bond reliability

Apparatus with a multi-layer coating and method of forming the same

Microelectronic assembly with impedance controlled wirebond and con...

Integrated circuit packaging system with step mold and method of ma...

Microelectronic assembly with impedance controlled wirebond and con...

Microelectronic assembly with impedance controlled wirebond and con...

Localized alloying for improved bond reliability

TFCC (TM) and SWCC (TM) thermal flex contact carriers

Method and apparatus for stacked die package with insulated wire bonds

Microelectronic assembly with impedance controlled wirebond and con...

Interconnections resistant to wicking

Methods of fabricating nanostructures and nanowires and devices fab...

Method and apparatus for stacked die package with insulated wire bonds

Stacked semiconductor package that prevents damage to semiconductor...

Methods of fabricating nanostructures and nanowires and devices fab...

Methods of fabricating nanostructures and nanowires and devices fab...

Wire bonder for ball bonding insulated wire and method of using same

Iridium oxide nanowires and method for forming same

Method for reducing or eliminating semiconductor device wire sweep...

Mounting spring elements on semiconductor devices, and wafer-level...

Method for making dual gauge leadframe

Methods of fabricating nanostructures and nanowires and devices fab...

Dual gauge leadframe

Wire bonder for ball bonding insulated wire and method of using same

Nanowires, nanostructures and devices fabricated therefrom

Method and apparatus for burning-in semiconductor devices in wafer...

Apparatus and methods for coupling conductive leads of semiconducto...

Wiring boards, semiconductor devices and their production processes

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CON...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STEP MOLD AND METHOD OF MA...

LOCALIZED ALLOYING FOR IMPROVED BOND RELIABILITY

THERMAL FLEX CONTACT CARRIERS #2

Apparatus with a Multi-Layer Coating and Method of Forming the Same

METHOD FOR SIMULTANEOUSLY FORMING A MECHANICAL AND ELECTRICAL CONNE...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CON...

MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CON...

MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CON...

Method and Apparatus for Stacked Die Package with Insulated Wire Bonds

METHOD AND APPARATUS FOR STACKED DIE PACKAGE WITH INSULATED WIRE BONDS

ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHODS OF FABRICATING NANOSTRUCTURES AND NANOWIRES AND DEVICES FAB...

MULTI-LAYERED WIRING SUBSTRATE, METHOD FOR PRODUCING THE SAME, AND...

STACKED SEMICONDUCTOR PACKAGE THAT PREVENTS DAMAGE TO SEMICONDUCTOR...

TFCC (TM) & SWCC (TM) thermal flex contact carriers

MEMORY DEVICES INCLUDING SEPARATING INSULATING STRUCTURES ON WIRES...

LOCALIZED ALLOYING FOR IMPROVED BOND RELIABILITY

Methods of fabricating nanostructures and nanowires and devices fab...

HIGH PERFORMANCE IC PACKAGE AND METHOD

NO-WICK(TM) 2 INTERCONNECTIONS

Methods of fabricating nanostructures and nanowires and devices fab...

METHOD FOR REDUCING OR ELIMINATING SEMICONDUCTOR DEVICE WIRE SWEEP...

Mounting Spring Elements on Semiconductor Devices, and Wafer-Level...

High performance IC package and method

Iridium oxide nanowires and method for forming same

Methods of fabricating nanostructures and nanowires and devices fab...

Wire bonder for ball bonding insulated wire and method of using same