Membership
Tour
Register
Log in
Material
Follow
Industry
CPC
H01L2224/84379
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/84379
Material
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
High density and durable semiconductor device interconnect
Patent number
11,756,923
Issue date
Sep 12, 2023
Infineon Technologies AG
Marian Sebastian Broll
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
HIGH DENSITY AND DURABLE SEMICONDUCTOR DEVICE INTERCONNECT
Publication number
20230063259
Publication date
Mar 2, 2023
INFINEON TECHNOLOGIES AG
Marian Sebastian Broll
H01 - BASIC ELECTRIC ELEMENTS