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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/156Material

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Patents Grantslast 30 patents

Information Patent Grant
Methods of manufacturing stacked semiconductor die assemblies with...
- Patent number 11,776,877
- Issue date Oct 3, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component having a transistor and interdigitated fingers...
- Patent number 10,957,639
- Issue date Mar 23, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Benoit Thollin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing stacked semiconductor die assemblies with...
- Patent number 9,691,746
- Issue date Jun 27, 2017
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having electrode interconnections within a con...
- Patent number 9,252,346
- Issue date Feb 2, 2016
- LG Electronics Inc.
- Byungjoon Rhee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20230395463
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20220013434
- Publication date Jan 13, 2022
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT HAVING A TRANSISTOR AND INTERDIGITATED FINGERS...
- Publication number 20200135638
- Publication date Apr 30, 2020
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Benoit THOLLIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20160013173
- Publication date Jan 14, 2016
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150115433
- Publication date Apr 30, 2015
- Bridge Semiconductor Corporation
- Charles W.C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150054019
- Publication date Feb 26, 2015
- LG ELECTRONICS INC.
- Byungjoon Rhee
- H01 - BASIC ELECTRIC ELEMENTS