Materials of terminal

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CPC
H05K2201/10909

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10909Materials of terminal

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Solderless BGA interconnect
- Patent number 11,811,182
- Issue date Nov 7, 2023
- Intel Corporation
- Tyler Leuten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly with electronic surface mount device and mou...
- Patent number 11,785,711
- Issue date Oct 10, 2023
- Honeywell International Inc.
- Scott A. Peters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical component and a method for producing an electrical compo...
- Patent number 11,342,126
- Issue date May 24, 2022
- EPCOS AG
- Markus Koini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly with electronic surface mount device and mou...
- Patent number 11,219,121
- Issue date Jan 4, 2022
- Honeywell International Inc.
- Scott A. Peters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connection contact for a ceramic component, a ceramic co...
- Patent number 10,943,740
- Issue date Mar 9, 2021
- EPCOS AG
- Markus Koini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter-chip alignment
- Patent number 10,410,989
- Issue date Sep 10, 2019
- University of Notre Dame du Lac
- Douglas C. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connection contact for a ceramic component, a ceramic co...
- Patent number 10,395,843
- Issue date Aug 27, 2019
- Epcos AG
- Markus Koini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component having a connection element
- Patent number 10,249,435
- Issue date Apr 2, 2019
- Robert Bosch GmbH
- Thomas Peuser
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Methods for connecting a wire to a feedthrough pin and apparatus in...
- Patent number 10,064,288
- Issue date Aug 28, 2018
- Advanced Bionics AG
- Lin Li
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Connection structure of circuit member, connection method, and conn...
- Patent number 9,999,123
- Issue date Jun 12, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer ceramic capacitor having terminal electrodes and board h...
- Patent number 9,842,699
- Issue date Dec 12, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material and bonded structure
- Patent number 9,789,569
- Issue date Oct 17, 2017
- Panasonic Intellectual Property Managment Co., Ltd
- Akio Furusawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board for memory card
- Patent number 9,788,438
- Issue date Oct 10, 2017
- LG Innotek Co., Ltd
- Seol Hee Lim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming a surface mount component having magnetic layer t...
- Patent number 9,460,866
- Issue date Oct 4, 2016
- Intel Corporation
- Haixiao Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing surface mount device
- Patent number 9,392,702
- Issue date Jul 12, 2016
- Fujitsu Component Limited
- Takeshi Okuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder material and bonded structure
- Patent number 9,199,340
- Issue date Dec 1, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Akio Furusawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit comprising at least one ceramic component
- Patent number 9,198,295
- Issue date Nov 24, 2015
- LABINAL POWER SYSTEMS
- Tony Lhommeau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mount device
- Patent number 9,106,005
- Issue date Aug 11, 2015
- Fujitsu Component Limited
- Takeshi Okuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Terminal assembly with regions of differing solderability
- Patent number 8,969,734
- Issue date Mar 3, 2015
- Advanced Interconnections Corp.
- James V. Murphy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pb-free solder-connected structure
- Patent number 8,907,475
- Issue date Dec 9, 2014
- Renesas Electronics Corporation
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inter-chip communication
- Patent number 8,623,700
- Issue date Jan 7, 2014
- University of Notre Dame du Lac
- Gary H. Bernstein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component, board unit, and information-processing device
- Patent number 8,547,706
- Issue date Oct 1, 2013
- Fujitsu Limited
- Hiroaki Tamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pb-free solder-connected structure and electronic device
- Patent number 8,503,189
- Issue date Aug 6, 2013
- Renesas Electronics Corporation
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low profile compliant leads
- Patent number 8,481,862
- Issue date Jul 9, 2013
- General Dynamics Advanced Information Systems, Inc.
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mount component having magnetic layer thereon and method of...
- Patent number 8,378,228
- Issue date Feb 19, 2013
- Intel Corporation
- Haixiao Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a contact
- Patent number 8,373,091
- Issue date Feb 12, 2013
- DDK, Ltd.
- Hiroyuki Moriuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Probe card assembly and kit, and methods of making same
- Patent number 8,373,428
- Issue date Feb 12, 2013
- FormFactor, Inc.
- Benjamin N. Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with the leads projected from sealing body
- Patent number 8,338,927
- Issue date Dec 25, 2012
- Renesas Electronics Corporation
- Hiroyuki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting test method
- Patent number 8,199,320
- Issue date Jun 12, 2012
- Fujitsu Limited
- Hideaki Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Terminal assembly with regions of differing solderability
- Patent number 8,119,926
- Issue date Feb 21, 2012
- Advanced Interconnections Corp.
- James V. Murphy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20240276656
- Publication date Aug 15, 2024
- ACTRON TECHNOLOGY CORPORATION
- Hsin-Chang Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20240130042
- Publication date Apr 18, 2024
- Murata Manufacturing Co., Ltd.
- Kumiko ISHIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ESD SUPPRESSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20220418095
- Publication date Dec 29, 2022
- SFI Electronics Technology Inc.
- CHING HOHN LIEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY WITH ELECTRONIC SURFACE MOUNT DEVICE AND MOU...
- Publication number 20220110208
- Publication date Apr 7, 2022
- Honeywell International Inc.
- Scott A. Peters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD ASSEMBLY WITH ELECTRONIC SURFACE MOUNT DEVICE AND MOU...
- Publication number 20210212200
- Publication date Jul 8, 2021
- HONEYWELL INTERNATIONAL INC.
- Scott A. Peters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL COMPONENT AND METHOD OF FORMING SAME
- Publication number 20200154567
- Publication date May 14, 2020
- Medtronic, Inc.
- Chunho KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERLESS BGA INTERCONNECT
- Publication number 20200119467
- Publication date Apr 16, 2020
- Intel Corporation
- Tyler LEUTEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTION CONTACT FOR A CERAMIC COMPONENT, A CERAMIC CO...
- Publication number 20190304702
- Publication date Oct 3, 2019
- EPCOS AG
- Markus Koini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTION CONTACT FOR A CERAMIC COMPONENT, A CERAMIC CO...
- Publication number 20180047507
- Publication date Feb 15, 2018
- EPCOS AG
- Markus Koini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT HAVING A CONNECTION ELEMENT
- Publication number 20170236643
- Publication date Aug 17, 2017
- ROBERT BOSCH GmbH
- Thomas PEUSER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR CONNECTING A WIRE TO A FEEDTHROUGH PIN AND APPARATUS IN...
- Publication number 20170202092
- Publication date Jul 13, 2017
- ADVANCED BIONICS AG
- Lin Li
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
PRINTED CIRCUIT BOARD FOR MEMORY CARD AND METHOD OF MANUFACTURING T...
- Publication number 20140369016
- Publication date Dec 18, 2014
- Seol Hee Lim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Pb-FREE SOLDER-CONNECTED STRUCTURE
- Publication number 20130286621
- Publication date Oct 31, 2013
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE MOUNT COMPONENT HAVING MAGNETIC LAYER THEREON AND METHOD OF...
- Publication number 20130163142
- Publication date Jun 27, 2013
- Haixiao Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT COMPRISING AT LEAST ONE CERAMIC COMPONENT
- Publication number 20130146348
- Publication date Jun 13, 2013
- HISPANO-SUIZA
- Tony Lhommeau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL ASSEMBLY WITH REGIONS OF DIFFERING SOLDERABILITY
- Publication number 20120196493
- Publication date Aug 2, 2012
- ADVANCED INTERCONNECTIONS CORP.
- James V. Murphy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE MOUNT DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120193139
- Publication date Aug 2, 2012
- FUJITSU COMPONENT LIMITED
- Takeshi Okuyama
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CONDUCTIVE CONTACT TERMINAL FOR SURFACE MOUNTING ON SUBSTRATE
- Publication number 20120118608
- Publication date May 17, 2012
- DOOSUNG INDUSTRIAL CO., LTD.
- Seon Tae Kim
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CLAD MATERIAL FOR WIRING CONNECTION AND WIRING CONNECTION MEMBER PR...
- Publication number 20120006884
- Publication date Jan 12, 2012
- NEOMAX MATERIALS CO., LTD
- Kazuhiro Shiomi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20110316137
- Publication date Dec 29, 2011
- RENESAS ELECTRONICS CORPORATION
- Hiroyuki NAKAMURA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC COMPONENT, BOARD UNIT, AND INFORMATION-PROCESSING DEVICE
- Publication number 20110075386
- Publication date Mar 31, 2011
- Fujitsu Limited
- Hiroaki Tamura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SURFACE MOUNT COMPONENT HAVING MAGNETIC LAYER THEREON AND METHOD OF...
- Publication number 20110056733
- Publication date Mar 10, 2011
- Intel Corporation
- Haixiao Sun
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
TERMINAL ASSEMBLY WITH REGIONS OF DIFFERING SOLDERABILITY
- Publication number 20100252311
- Publication date Oct 7, 2010
- ADVANCED INTERCONNECTIONS CORP.
- James V. Murphy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pb-free solder-connected structure and electronic device
- Publication number 20100214753
- Publication date Aug 26, 2010
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR FLAT PACKAGE DEVICE AND METHOD FOR MANUFACTURING THE...
- Publication number 20100078803
- Publication date Apr 1, 2010
- NEC ELECTRONICS CORPORATION
- HIDEKO ANDOU
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SURFACE MOUNT CONTACT
- Publication number 20100068901
- Publication date Mar 18, 2010
- Kitagawa Industries Co., Ltd.
- Hideo YUMI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC COMPONENT FOR SURFACE MOUNTING
- Publication number 20100060108
- Publication date Mar 11, 2010
- NIHON DEMPA KOGYO CO., LTD.
- Hiroaki Yamada
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MOUNTING TEST METHOD
- Publication number 20100053626
- Publication date Mar 4, 2010
- FUJITSU LIMITED
- Hideaki TAKAHASHI
- G01 - MEASURING TESTING
Information Patent Application
CHIP COMPONENT AND METHOD FOR PRODUCING THE SAME AND COMPONENT BUIL...
- Publication number 20090316329
- Publication date Dec 24, 2009
- Murata Manufacturing Co., Ltd.
- Masato Nomura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20090317948
- Publication date Dec 24, 2009
- Renesas Technology Corp.
- Hiroyuki NAKAMURA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Materials of terminal

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solderless BGA interconnect

Circuit board assembly with electronic surface mount device and mou...

Electrical component and a method for producing an electrical compo...

Circuit board assembly with electronic surface mount device and mou...

Electrical connection contact for a ceramic component, a ceramic co...

Inter-chip alignment

Electrical connection contact for a ceramic component, a ceramic co...

Electronic component having a connection element

Methods for connecting a wire to a feedthrough pin and apparatus in...

Connection structure of circuit member, connection method, and conn...

Multilayer ceramic capacitor having terminal electrodes and board h...

Solder material and bonded structure

Printed circuit board for memory card

Method of forming a surface mount component having magnetic layer t...

Method of manufacturing surface mount device

Solder material and bonded structure

Printed circuit comprising at least one ceramic component

Surface mount device

Terminal assembly with regions of differing solderability

Pb-free solder-connected structure

Inter-chip communication

Electronic component, board unit, and information-processing device

Pb-free solder-connected structure and electronic device

Low profile compliant leads

Surface mount component having magnetic layer thereon and method of...

Method of manufacturing a contact

Probe card assembly and kit, and methods of making same

Semiconductor device with the leads projected from sealing body

Mounting test method

Terminal assembly with regions of differing solderability

Patents Applicationslast 30 patents

CIRCUIT SUBSTRATE AND ELECTRONIC DEVICE

CIRCUIT BOARD

ESD SUPPRESSOR AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD ASSEMBLY WITH ELECTRONIC SURFACE MOUNT DEVICE AND MOU...

CIRCUIT BOARD ASSEMBLY WITH ELECTRONIC SURFACE MOUNT DEVICE AND MOU...

ELECTRICAL COMPONENT AND METHOD OF FORMING SAME

SOLDERLESS BGA INTERCONNECT

ELECTRICAL CONNECTION CONTACT FOR A CERAMIC COMPONENT, A CERAMIC CO...

ELECTRICAL CONNECTION CONTACT FOR A CERAMIC COMPONENT, A CERAMIC CO...

ELECTRONIC COMPONENT HAVING A CONNECTION ELEMENT

METHODS FOR CONNECTING A WIRE TO A FEEDTHROUGH PIN AND APPARATUS IN...

PRINTED CIRCUIT BOARD FOR MEMORY CARD AND METHOD OF MANUFACTURING T...

Pb-FREE SOLDER-CONNECTED STRUCTURE

SURFACE MOUNT COMPONENT HAVING MAGNETIC LAYER THEREON AND METHOD OF...

PRINTED CIRCUIT COMPRISING AT LEAST ONE CERAMIC COMPONENT

TERMINAL ASSEMBLY WITH REGIONS OF DIFFERING SOLDERABILITY

SURFACE MOUNT DEVICE AND METHOD OF MANUFACTURING THE SAME

CONDUCTIVE CONTACT TERMINAL FOR SURFACE MOUNTING ON SUBSTRATE

CLAD MATERIAL FOR WIRING CONNECTION AND WIRING CONNECTION MEMBER PR...

METHOD FOR MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

ELECTRONIC COMPONENT, BOARD UNIT, AND INFORMATION-PROCESSING DEVICE

SURFACE MOUNT COMPONENT HAVING MAGNETIC LAYER THEREON AND METHOD OF...

TERMINAL ASSEMBLY WITH REGIONS OF DIFFERING SOLDERABILITY

Pb-free solder-connected structure and electronic device

SEMICONDUCTOR FLAT PACKAGE DEVICE AND METHOD FOR MANUFACTURING THE...

SURFACE MOUNT CONTACT

ELECTRONIC COMPONENT FOR SURFACE MOUNTING

MOUNTING TEST METHOD

CHIP COMPONENT AND METHOD FOR PRODUCING THE SAME AND COMPONENT BUIL...

METHOD FOR MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE