MCT - MOSFET Controlled Thyristor - It contains two additional FET structures for on/off control

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CPC
H01L2924/13026

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/13026MCT - MOSFET Controlled Thyristor - It contains two additional FET structures for on/off control

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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Semiconductor device package
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Information Patent Grant
Method for fabricating a semiconductor device package
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- Issue date Feb 14, 2012
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Patents Applicationslast 30 patents

Information Patent Application
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INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
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MCT - MOSFET Controlled Thyristor - It contains two additional FET structures for on/off control

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming integrated circuit package

Integrated circuit package and method of forming same

Integrated circuit package and method of forming same

Integrated circuit package and method of forming same

Chip package and a method for manufacturing a chip package

Semiconductor device package

Method for fabricating a semiconductor device package

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE

SEMICONDUCTOR DEVICE PACKAGE