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H01L2224/767

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/767Means for aligning

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor package structure and semico...
- Patent number 12,100,686
- Issue date Sep 24, 2024
- Advanced Semiconductor Engineering, Inc.
- Yun Di Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus and method of manufacturing a semicondu...
- Patent number 12,002,700
- Issue date Jun 4, 2024
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip bond semiconductor packages and assembly tools
- Patent number 11,676,934
- Issue date Jun 13, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Albert Louis Bove
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adsorption device, method for making same, and transferring system...
- Patent number 11,498,779
- Issue date Nov 15, 2022
- Century Technology (Shenzhen) Corporation Limited
- Po-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive pattern printer for downhole tools
- Patent number 10,799,908
- Issue date Oct 13, 2020
- Halliburton Energy Services, Inc.
- Robert L. Reynolds
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Fluid-suspended microcomponent harvest, distribution, and reclamation
- Patent number 10,242,977
- Issue date Mar 26, 2019
- eLux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode connection structure and electrode connection method
- Patent number 9,601,448
- Issue date Mar 21, 2017
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diodes and a method of packaging the same
- Patent number 9,418,979
- Issue date Aug 16, 2016
- Renssealer Polytechnic Institute
- Robert F. Karlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for assembling electric components on a flexib...
- Patent number 9,338,894
- Issue date May 10, 2016
- Nederlandse Organisatie voor Toegepast-Natuurwetenschappelijk Onderzoek TNO
- Jeroen Van Den Brand
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting diodes and a method of packaging the same
- Patent number 9,245,875
- Issue date Jan 26, 2016
- Rensselaer Polytechnic Institute
- Robert F. Karlicek
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICO...
- Publication number 20220139866
- Publication date May 5, 2022
- Advanced Semiconductor Engineering, Inc.
- Yun Di HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluid-Suspended Microcomponent Harvest, Distribution, and Reclamation
- Publication number 20180102352
- Publication date Apr 12, 2018
- eLux Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ASSEMBLING ELECTRIC COMPONENTS ON A FLEXIB...
- Publication number 20140069697
- Publication date Mar 13, 2014
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETEN
- Jeroen Van Den Brand
- H01 - BASIC ELECTRIC ELEMENTS

Means for aligning

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing semiconductor package structure and semico...

Substrate bonding apparatus and method of manufacturing a semicondu...

Clip bond semiconductor packages and assembly tools

Adsorption device, method for making same, and transferring system...

Electrically conductive pattern printer for downhole tools

Fluid-suspended microcomponent harvest, distribution, and reclamation

Electrode connection structure and electrode connection method

Light emitting diodes and a method of packaging the same

Method and apparatus for assembling electric components on a flexib...

Light emitting diodes and a method of packaging the same

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICO...

Fluid-Suspended Microcomponent Harvest, Distribution, and Reclamation

METHOD AND APPARATUS FOR ASSEMBLING ELECTRIC COMPONENTS ON A FLEXIB...