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H01L2224/797

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/797Means for aligning

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Patents Grantslast 30 patents

Information Patent Grant
Adsorption device, method for making same, and transferring system...
- Patent number 11,498,779
- Issue date Nov 15, 2022
- Century Technology (Shenzhen) Corporation Limited
- Po-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for transferring semiconductor devices from a...
- Patent number 11,183,478
- Issue date Nov 23, 2021
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive pattern printer for downhole tools
- Patent number 10,799,908
- Issue date Oct 13, 2020
- Halliburton Energy Services, Inc.
- Robert L. Reynolds
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Apparatus and method for transfering semiconductor devices from a s...
- Patent number 10,529,685
- Issue date Jan 7, 2020
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD FOR STACKING SEMICONDUCTOR DEVICES
- Publication number 20200135688
- Publication date Apr 30, 2020
- Rohinni, LLC.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR STACKING SEMICONDUCTOR DEVICES
- Publication number 20180226376
- Publication date Aug 9, 2018
- Rohinni, LLC.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS