Means for aligning

Industry

CPC
H01L2224/787

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/787Means for aligning

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding apparatus and alignment method
- Patent number 12,080,679
- Issue date Sep 3, 2024
- Shinkawa Ltd.
- Toru Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for linearly moving movable body relative to o...
- Patent number 11,410,866
- Issue date Aug 9, 2022
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frame feeder
- Patent number 11,315,808
- Issue date Apr 26, 2022
- Shinkawa Ltd.
- Kazuaki Nagano
- F24 - HEATING RANGES VENTILATING
Information Patent Grant
Driving system having reduced vibration transmission
- Patent number 11,205,937
- Issue date Dec 21, 2021
- ASM Technology Singapore Pte. Ltd.
- Keng Yew Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for positioning first object in relation to secon...
- Patent number 11,139,193
- Issue date Oct 5, 2021
- Shinkawa Ltd.
- Tetsuya Utano
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Wire bonding tool including a wedge tool
- Patent number 11,121,114
- Issue date Sep 14, 2021
- Fuji Electric Co., Ltd.
- Takanori Sugiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bond clamp design and lead frame capable of engaging with same
- Patent number 10,861,777
- Issue date Dec 8, 2020
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 10,818,581
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Toshiyuki Hata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive pattern printer for downhole tools
- Patent number 10,799,908
- Issue date Oct 13, 2020
- Halliburton Energy Services, Inc.
- Robert L. Reynolds
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Clamping system, wire bonding machine, and method for bonding wires
- Patent number 10,770,423
- Issue date Sep 8, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Qi Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods of operating wire bonding machines including cl...
- Patent number 10,763,236
- Issue date Sep 1, 2020
- Kulicke and Soffa Industries, Inc.
- Peter J. Klaerner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Curtain airbag device mounting structure and curtain airbag deploym...
- Patent number 10,723,306
- Issue date Jul 28, 2020
- Toyota Jidosha Kabushiki Kaisha
- Takamichi Komura
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Capillary jig for wire bonding and method of installing a capillary
- Patent number 10,679,962
- Issue date Jun 9, 2020
- Texas Instruments Incorporated
- Mohd Azri Hashim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method
- Patent number 10,600,754
- Issue date Mar 24, 2020
- Kaijo Corporation
- Hideki Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and method of estimating position of landing poin...
- Patent number 10,586,781
- Issue date Mar 10, 2020
- Shinkawa Ltd.
- Shigeru Hayata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of operating a wire bonding machine to improve clamping of...
- Patent number 10,541,223
- Issue date Jan 21, 2020
- Kulicke and Soffa Industries, Inc.
- Wong Hing Kuong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, and alternator and power conversion device wh...
- Patent number 10,319,849
- Issue date Jun 11, 2019
- Hitachi Power Semiconductor Device, Ltd.
- Tetsuya Ishimaru
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Wire bonding apparatus and wire bonding method
- Patent number 10,262,968
- Issue date Apr 16, 2019
- Shinkawa Ltd.
- Shigeru Hayata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible window clamp
- Patent number 10,147,700
- Issue date Dec 4, 2018
- Carsem (M) Sdn. Bhd.
- Wong Chee Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing wire bonding structure, wire bonding struc...
- Patent number 10,115,699
- Issue date Oct 30, 2018
- Rohm Co., Ltd.
- Kazuya Ikoma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatus for improved bonding
- Patent number 10,050,009
- Issue date Aug 14, 2018
- Semiconductor Components Industries, LLC
- Nobuhisa Onai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Window clamp
- Patent number 9,997,490
- Issue date Jun 12, 2018
- Texas Instruments Incorporated
- Ruby Ann Maya Merto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,972,598
- Issue date May 15, 2018
- Renesas Electronics Corporation
- Yuki Yagyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a functional inlay
- Patent number 9,780,062
- Issue date Oct 3, 2017
- Assa Abloy AB
- Stephane Ayala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,754,865
- Issue date Sep 5, 2017
- Renesas Electronics Corporation
- Takanori Yamashita
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wire-pull test location identification on a wire of a microelectron...
- Patent number 9,551,640
- Issue date Jan 24, 2017
- International Business Machines Corporation
- Mark T. W. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,530,723
- Issue date Dec 27, 2016
- Renesas Electronics Corporation
- Akira Muto
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Bonding device
- Patent number 9,437,571
- Issue date Sep 6, 2016
- Shibuya Kogyo Co., Ltd.
- Hiroyuki Yasuyoshi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Positioning system
- Patent number 9,076,856
- Issue date Jul 7, 2015
- Lite-On Electronics (Guangzhou) Limited
- Yan-Yi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame support plate and window clamp for wire bonding machines
- Patent number 9,070,762
- Issue date Jun 30, 2015
- ASM Technology Singapore Pte. Ltd.
- Phui Phoong Chuang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING APPARATUS, BONDING METHOD, AND COMPUTER READABLE STORAGE ME...
- Publication number 20240304592
- Publication date Sep 12, 2024
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...
- Publication number 20240105672
- Publication date Mar 28, 2024
- SHINKAWA LTD.
- Shigeru HAYATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND ALIGNMENT METHOD
- Publication number 20240105673
- Publication date Mar 28, 2024
- SHINKAWA LTD.
- Toru MAEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20230178510
- Publication date Jun 8, 2023
- SHINKAWA LTD.
- Shigeru HAYATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FRAME FEEDER
- Publication number 20210242045
- Publication date Aug 5, 2021
- SHINKAWA LTD.
- Kazuaki NAGANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR LINEARLY MOVING MOVABLE BODY RELATIVE TO OBJECT
- Publication number 20200411352
- Publication date Dec 31, 2020
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVING SYSTEM HAVING REDUCED VIBRATION TRANSMISSION
- Publication number 20200028407
- Publication date Jan 23, 2020
- ASM Technology Singapore Pte Ltd
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR WIRE PREPARATION
- Publication number 20190372294
- Publication date Dec 5, 2019
- The Charles Stark Draper Laboratory, Inc.
- Mitchell W. Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING SYSTEMS FOR WIRE BONDING TOOLS, WIRE BONDING MACHINES INCL...
- Publication number 20190237427
- Publication date Aug 1, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Peter Klaerner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS OF OPERATING WIRE BONDING MACHINES INCLUDING CL...
- Publication number 20190214363
- Publication date Jul 11, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Peter J. Klaerner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING METHOD
- Publication number 20190164928
- Publication date May 30, 2019
- KAIJO CORPORATION
- Hideki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEDGE TOOL AND WEDGE BONDING METHOD
- Publication number 20190088616
- Publication date Mar 21, 2019
- Fuji Electric Co., Ltd.
- Takanori SUGIYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Window Clamp
- Publication number 20180261568
- Publication date Sep 13, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Ruby Ann Maya Merto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Window Clamp
- Publication number 20180261567
- Publication date Sep 13, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Ruby Ann Maya Merto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND WIRE BONDING METHOD
- Publication number 20180090464
- Publication date Mar 29, 2018
- SHINKAWA LTD.
- Shigeru HAYATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180082977
- Publication date Mar 22, 2018
- RENESAS ELECTRONICS CORPORATION
- Yuki YAGYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170323848
- Publication date Nov 9, 2017
- RENESAS ELECTRONICS CORPORATION
- Takanori Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capillary Jig For Wire Bonding And Method Of Installing A Capillary
- Publication number 20170229419
- Publication date Aug 10, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Mohd Azri Hashim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND APPARATUS FOR IMPROVED BONDING
- Publication number 20170077061
- Publication date Mar 16, 2017
- Semiconductor Components Industries, LLC
- Nobuhisa ONAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRE BONDING STRUCTURE, WIRE BONDING STRUC...
- Publication number 20170062381
- Publication date Mar 2, 2017
- Kazuya IKOMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A FUNCTIONAL INLAY
- Publication number 20170005066
- Publication date Jan 5, 2017
- ASSA ABLOY AB
- Stephane AYALA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140374890
- Publication date Dec 25, 2014
- Renesas Electronics Corporation
- Takanori Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC WIRE BONDING WEDGE WITH MULTIPLE BONDING WIRE SLOTS
- Publication number 20140326778
- Publication date Nov 6, 2014
- Shang-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING ASSEMBLY AND METHOD
- Publication number 20140239473
- Publication date Aug 28, 2014
- TEXAS INSTRUMENTS INCORPORATED
- MengThee Chia
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
LEAD FRAME SUPPORT PLATE AND WINDOW CLAMP FOR WIRE BONDING MACHINES
- Publication number 20140217152
- Publication date Aug 7, 2014
- ASM Technology Singapore Pte Ltd
- Phui Phoong CHUANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR MANUFACTURING CHIP PACKAGE
- Publication number 20140170812
- Publication date Jun 19, 2014
- SK HYNIX INC.
- Cheol Ho JOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20140061953
- Publication date Mar 6, 2014
- RENESAS ELECTRONICS CORPORATION
- Atsushi FUJISAWA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME
- Publication number 20140048584
- Publication date Feb 20, 2014
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD FRAME SUPPORT PLATE AND WINDOW CLAMP FOR WIRE BONDING MACHINES
- Publication number 20140014708
- Publication date Jan 16, 2014
- Phui Phoong CHUANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WEDGE BONDER AND A METHOD OF CLEANING A WEDGE BONDER
- Publication number 20130341377
- Publication date Dec 26, 2013
- Chi Wah CHENG
- H01 - BASIC ELECTRIC ELEMENTS

Means for aligning

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding apparatus and alignment method

Apparatus and method for linearly moving movable body relative to o...

Frame feeder

Driving system having reduced vibration transmission

Device and method for positioning first object in relation to secon...

Wire bonding tool including a wedge tool

Wire bond clamp design and lead frame capable of engaging with same

Method of manufacturing semiconductor device and semiconductor device

Electrically conductive pattern printer for downhole tools

Clamping system, wire bonding machine, and method for bonding wires

Systems and methods of operating wire bonding machines including cl...

Curtain airbag device mounting structure and curtain airbag deploym...

Capillary jig for wire bonding and method of installing a capillary

Bonding method

Bonding apparatus and method of estimating position of landing poin...

Methods of operating a wire bonding machine to improve clamping of...

Semiconductor device, and alternator and power conversion device wh...

Wire bonding apparatus and wire bonding method

Flexible window clamp

Method for manufacturing wire bonding structure, wire bonding struc...

Methods and apparatus for improved bonding

Window clamp

Method of manufacturing semiconductor device

Method of manufacturing a functional inlay

Semiconductor device and method for manufacturing the same

Wire-pull test location identification on a wire of a microelectron...

Semiconductor device and manufacturing method thereof

Bonding device

Positioning system

Lead frame support plate and window clamp for wire bonding machines

Patents Applicationslast 30 patents

BONDING APPARATUS, BONDING METHOD, AND COMPUTER READABLE STORAGE ME...

MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...

BONDING APPARATUS AND ALIGNMENT METHOD

WIRE BONDING APPARATUS

FRAME FEEDER

DEVICE AND METHOD FOR LINEARLY MOVING MOVABLE BODY RELATIVE TO OBJECT

DRIVING SYSTEM HAVING REDUCED VIBRATION TRANSMISSION

APPARATUS AND METHOD FOR WIRE PREPARATION

CLEANING SYSTEMS FOR WIRE BONDING TOOLS, WIRE BONDING MACHINES INCL...

SYSTEMS AND METHODS OF OPERATING WIRE BONDING MACHINES INCLUDING CL...

BONDING METHOD

WEDGE TOOL AND WEDGE BONDING METHOD

Window Clamp

Window Clamp

WIRE BONDING APPARATUS AND WIRE BONDING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Capillary Jig For Wire Bonding And Method Of Installing A Capillary

METHODS AND APPARATUS FOR IMPROVED BONDING

METHOD FOR MANUFACTURING WIRE BONDING STRUCTURE, WIRE BONDING STRUC...

METHOD OF MANUFACTURING A FUNCTIONAL INLAY

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

ULTRASONIC WIRE BONDING WEDGE WITH MULTIPLE BONDING WIRE SLOTS

WIRE BONDING ASSEMBLY AND METHOD

LEAD FRAME SUPPORT PLATE AND WINDOW CLAMP FOR WIRE BONDING MACHINES

METHOD AND APPARATUS FOR MANUFACTURING CHIP PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME

LEAD FRAME SUPPORT PLATE AND WINDOW CLAMP FOR WIRE BONDING MACHINES

WEDGE BONDER AND A METHOD OF CLEANING A WEDGE BONDER