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CPC
H01L2224/7517
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/7517
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Patents Grants
last 30 patents
Information
Patent Grant
Bonding apparatus and bonding method
Patent number
12,136,604
Issue date
Nov 5, 2024
Shinkawa Ltd.
Hideharu Nihei
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
BONDING APPARATUS AND BONDING METHOD USING THE SAME
Publication number
20230057934
Publication date
Feb 23, 2023
SAMSUNG DISPLAY CO., LTD.
SANGDUK LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING APPARATUS AND BONDING METHOD
Publication number
20220406747
Publication date
Dec 22, 2022
SHINKAWA LTD.
Hideharu NIHEI
H01 - BASIC ELECTRIC ELEMENTS