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H01L2224/7725
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/7725
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Patent Grant
Chip packaging device, chip packaging method, and package chip
Patent number
11,764,184
Issue date
Sep 19, 2023
HOSIN GLOBAL ELECTRONICS CO., LTD
Chen-Nan Lai
H01 - BASIC ELECTRIC ELEMENTS