Means for applying energy

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CPC
H01L2224/7825

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/7825Means for applying energy

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods of forming wire interconnect structures and related wire bo...
- Patent number 12,057,431
- Issue date Aug 6, 2024
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frame feeder
- Patent number 11,315,808
- Issue date Apr 26, 2022
- Shinkawa Ltd.
- Kazuaki Nagano
- F24 - HEATING RANGES VENTILATING
Information Patent Grant
Bonding process with rotating bonding stage
- Patent number 11,273,515
- Issue date Mar 15, 2022
- KAIJO CORPORATION
- Yuji Komagino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus with rotating bonding stage
- Patent number 11,173,567
- Issue date Nov 16, 2021
- KAIJO CORPORATION
- Yuji Komagino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wedge bonding tools, wedge bonding systems, and related methods
- Patent number 10,987,753
- Issue date Apr 27, 2021
- Kulicke and Soffa Industries, Inc.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 10,896,892
- Issue date Jan 19, 2021
- Fuji Electric Co., Ltd.
- Fumihiko Momose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Clamping system, wire bonding machine, and method for bonding wires
- Patent number 10,770,423
- Issue date Sep 8, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Qi Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,737,356
- Issue date Aug 11, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Curtain airbag device mounting structure and curtain airbag deploym...
- Patent number 10,723,306
- Issue date Jul 28, 2020
- Toyota Jidosha Kabushiki Kaisha
- Takamichi Komura
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,610,976
- Issue date Apr 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method
- Patent number 10,600,754
- Issue date Mar 24, 2020
- Kaijo Corporation
- Hideki Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of operating a wire bonding machine to improve clamping of...
- Patent number 10,541,223
- Issue date Jan 21, 2020
- Kulicke and Soffa Industries, Inc.
- Wong Hing Kuong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,525,555
- Issue date Jan 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wedge bonding tools, wedge bonding systems, and related methods
- Patent number 10,449,627
- Issue date Oct 22, 2019
- Kulicke and Soffa Industries, Inc.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,414,002
- Issue date Sep 17, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding methods and systems incorporating metal nanoparticles
- Patent number 10,283,482
- Issue date May 7, 2019
- Lockheed Martin Corporation
- Randall Mark Stoltenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,137,534
- Issue date Nov 27, 2018
- Nippon Micrometal Corporation
- Takashi Yamada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Wedge bonding tools, wedge bonding systems, and related methods
- Patent number 9,931,709
- Issue date Apr 3, 2018
- Orthodyne Electronics Corporation
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding methods and systems incorporating metal nanoparticles
- Patent number 9,881,895
- Issue date Jan 30, 2018
- Lockheed Martin Corporation
- Randall Mark Stoltenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antioxidant gas blow-off unit
- Patent number 9,415,456
- Issue date Aug 16, 2016
- Shinkawa Ltd.
- Toru Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Antioxidant gas blow-off unit
- Patent number 9,362,251
- Issue date Jun 7, 2016
- Shinkawa Ltd.
- Mitsuaki Sakakura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-functional detachable and replaceable wire bonding heating plate
- Patent number 9,165,903
- Issue date Oct 20, 2015
- PRAM TECHNOLOGY INC.
- Wen-Long Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 9,112,059
- Issue date Aug 18, 2015
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal compression bonding of semiconductor chips
- Patent number 8,967,452
- Issue date Mar 3, 2015
- ASM Technology Singapore Pte. Ltd.
- Yiu Ming Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frame feeding system and frame feeding method
- Patent number 8,965,572
- Issue date Feb 24, 2015
- Hitachi High-Tech Instruments Co., Ltd.
- Tatsuyuki Ohkubo
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of manufacturing semiconductor device, and wire bonder
- Patent number 8,881,966
- Issue date Nov 11, 2014
- Renesas Electronics Corporation
- Kazuyuki Misumi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device with copper wire ball-bonded to electrode pad...
- Patent number 8,692,370
- Issue date Apr 8, 2014
- Semiconductor Components Industries, LLC
- Takashi Kitazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with lead extensions and related methods
- Patent number 8,674,487
- Issue date Mar 18, 2014
- Advanced Semiconductor Engineering, Inc.
- Lin-Wang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for forming wire bonds
- Patent number 8,444,044
- Issue date May 21, 2013
- Micron Technology, Inc.
- Low Peng Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus and method using the same
- Patent number 8,245,902
- Issue date Aug 21, 2012
- Samsung Electronics Co., Ltd.
- Yong-Je Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20250022837
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Doojin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS, WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20240395765
- Publication date Nov 28, 2024
- Yangtze Memory Technologies Co., Ltd.
- XuHui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...
- Publication number 20240363583
- Publication date Oct 31, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING
- Publication number 20240194634
- Publication date Jun 13, 2024
- ASMPT SINGAPORE PTE. LTD
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE-STABLE COMPOSITE OF A STRANDED WIRE HAVING A CONTACT PAD
- Publication number 20230318207
- Publication date Oct 5, 2023
- Heraeus Nexensos GmbH
- Matthias MUZIOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE CLAMP AND WIRE BONDING APPARATUS INCLUDING THE SAME
- Publication number 20230230952
- Publication date Jul 20, 2023
- Samsung Electronics Co., Ltd.
- Jaehyeok HEO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...
- Publication number 20220199570
- Publication date Jun 23, 2022
- KULICKE AND SOFFA INDUSTRIES, INC.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRAME FEEDER
- Publication number 20210242045
- Publication date Aug 5, 2021
- SHINKAWA LTD.
- Kazuaki NAGANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING METHOD AND BONDING CONTROL PROGRAM
- Publication number 20200238433
- Publication date Jul 30, 2020
- KAIJO CORPORATION
- Yuji KOMAGINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WEDGE BONDING TOOLS, WEDGE BONDING SYSTEMS, AND RELATED METHODS
- Publication number 20190375043
- Publication date Dec 12, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR WIRE PREPARATION
- Publication number 20190372294
- Publication date Dec 5, 2019
- The Charles Stark Draper Laboratory, Inc.
- Mitchell W. Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangements and Method for Providing a Bond Connection
- Publication number 20190312008
- Publication date Oct 10, 2019
- INFINEON TECHNOLOGIES AG
- Florian Eacock
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING METHOD
- Publication number 20190164928
- Publication date May 30, 2019
- KAIJO CORPORATION
- Hideki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF OPERATING A WIRE BONDING MACHINE TO IMPROVE CLAMPING OF...
- Publication number 20180323167
- Publication date Nov 8, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- Wong Hing Kuong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WEDGE BONDING TOOLS, WEDGE BONDING SYSTEMS, AND RELATED METHODS
- Publication number 20180200828
- Publication date Jul 19, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING METHODS AND SYSTEMS INCORPORATING METAL NANOPARTICLES
- Publication number 20180138143
- Publication date May 17, 2018
- Lockheed Martin Corporation
- Randall Mark STOLTENBERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLAMPING SYSTEM, WIRE BONDING MACHINE, AND METHOD FOR BONDING WIRES
- Publication number 20170301644
- Publication date Oct 19, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Qi LIU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WEDGE BONDING TOOLS, WEDGE BONDING SYSTEMS, AND RELATED METHODS
- Publication number 20170209956
- Publication date Jul 27, 2017
- ORTHODYNE ELECTRONICS CORPORATION
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING METHODS AND SYSTEMS INCORPORATING METAL NANOPARTICLES
- Publication number 20170053895
- Publication date Feb 23, 2017
- Lockheed Martin Corporation
- Randall Mark STOLTENBERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND STRENGTHENING
- Publication number 20160322329
- Publication date Nov 3, 2016
- SKYWORKS SOLUTIONS, INC.
- Aldrin Quinones GARING
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND APPARATUSES FOR SHAPING AND LOOPING BONDING WIRES THAT...
- Publication number 20160086909
- Publication date Mar 24, 2016
- MC10, Inc.
- David G. Garlock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150303166
- Publication date Oct 22, 2015
- Fuji Electric Co., Ltd.
- Fumihiko MOMOSE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD FRAME AND SEMICONDUCTOR DEVICE USING SAME
- Publication number 20140374892
- Publication date Dec 25, 2014
- Yit Meng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-functional detachable and replaceable wire bonding heating plate
- Publication number 20140319199
- Publication date Oct 30, 2014
- Pram Technology Inc.
- Wen-Long Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING ASSEMBLY AND METHOD
- Publication number 20140239473
- Publication date Aug 28, 2014
- TEXAS INSTRUMENTS INCORPORATED
- MengThee Chia
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
WIRE BONDING APPARATUS AND WIRE BONDING METHOD
- Publication number 20140054277
- Publication date Feb 27, 2014
- KAIJO CORPORATION
- Akio Sugito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL COMPRESSION BONDING OF SEMICONDUCTOR CHIPS
- Publication number 20130270230
- Publication date Oct 17, 2013
- Yiu Ming CHEUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH LEAD EXTENSIONS AND RELATED METHODS
- Publication number 20130241041
- Publication date Sep 19, 2013
- Lin-Wang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Frame Feeding System and Frame Feeding Method
- Publication number 20130017040
- Publication date Jan 17, 2013
- Hitachi High-Tech Instruments Co., Ltd.
- Tatsuyuki OHKUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATER BLOCK FOR WIRE BONDING SYSTEM
- Publication number 20120318853
- Publication date Dec 20, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Wai Keong Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Means for applying energy

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of forming wire interconnect structures and related wire bo...

Frame feeder

Bonding process with rotating bonding stage

Bonding apparatus with rotating bonding stage

Wedge bonding tools, wedge bonding systems, and related methods

Wire bonding apparatus

Clamping system, wire bonding machine, and method for bonding wires

Bonding wire for semiconductor device

Curtain airbag device mounting structure and curtain airbag deploym...

Bonding wire for semiconductor device

Bonding method

Methods of operating a wire bonding machine to improve clamping of...

Bonding wire for semiconductor device

Wedge bonding tools, wedge bonding systems, and related methods

Bonding wire for semiconductor device

Wire bonding methods and systems incorporating metal nanoparticles

Bonding wire for semiconductor device

Wedge bonding tools, wedge bonding systems, and related methods

Wire bonding methods and systems incorporating metal nanoparticles

Antioxidant gas blow-off unit

Antioxidant gas blow-off unit

Multi-functional detachable and replaceable wire bonding heating plate

Bonding wire for semiconductor device

Thermal compression bonding of semiconductor chips

Frame feeding system and frame feeding method

Method of manufacturing semiconductor device, and wire bonder

Semiconductor device with copper wire ball-bonded to electrode pad...

Semiconductor packages with lead extensions and related methods

Apparatus and methods for forming wire bonds

Wire bonding apparatus and method using the same

Patents Applicationslast 30 patents

WIRE BONDING APPARATUS

WIRE BONDING APPARATUS, WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE

METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...

HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING

TEMPERATURE-STABLE COMPOSITE OF A STRANDED WIRE HAVING A CONTACT PAD

WIRE CLAMP AND WIRE BONDING APPARATUS INCLUDING THE SAME

METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...

FRAME FEEDER

BONDING APPARATUS, BONDING METHOD AND BONDING CONTROL PROGRAM

WEDGE BONDING TOOLS, WEDGE BONDING SYSTEMS, AND RELATED METHODS

APPARATUS AND METHOD FOR WIRE PREPARATION

Arrangements and Method for Providing a Bond Connection

BONDING METHOD

METHODS OF OPERATING A WIRE BONDING MACHINE TO IMPROVE CLAMPING OF...

WEDGE BONDING TOOLS, WEDGE BONDING SYSTEMS, AND RELATED METHODS

WIRE BONDING METHODS AND SYSTEMS INCORPORATING METAL NANOPARTICLES

CLAMPING SYSTEM, WIRE BONDING MACHINE, AND METHOD FOR BONDING WIRES

WEDGE BONDING TOOLS, WEDGE BONDING SYSTEMS, AND RELATED METHODS

WIRE BONDING METHODS AND SYSTEMS INCORPORATING METAL NANOPARTICLES

WIRE BOND STRENGTHENING

METHODS AND APPARATUSES FOR SHAPING AND LOOPING BONDING WIRES THAT...

SEMICONDUCTOR DEVICE

LEAD FRAME AND SEMICONDUCTOR DEVICE USING SAME

Multi-functional detachable and replaceable wire bonding heating plate

WIRE BONDING ASSEMBLY AND METHOD

WIRE BONDING APPARATUS AND WIRE BONDING METHOD

THERMAL COMPRESSION BONDING OF SEMICONDUCTOR CHIPS

SEMICONDUCTOR PACKAGES WITH LEAD EXTENSIONS AND RELATED METHODS

Frame Feeding System and Frame Feeding Method

HEATER BLOCK FOR WIRE BONDING SYSTEM