Means for applying permanent coating

Industry

CPC
H01L2224/7515

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/7515Means for applying permanent coating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Hybrid nanosilver/liquid metal ink composition and uses thereof
- Patent number 12,096,554
- Issue date Sep 17, 2024
- Xerox Corporation
- Naveen Chopra
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Hybrid nanosilver/liquid metal ink composition and uses thereof
- Patent number 11,510,314
- Issue date Nov 22, 2022
- Xerox Corporation
- Naveen Chopra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,985,132
- Issue date Apr 20, 2021
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,756,046
- Issue date Aug 25, 2020
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Conductive paste having dilatancy, electrode connection structure i...
- Patent number 10,651,143
- Issue date May 12, 2020
- SHARP KABUSHIKI KAISHA
- Tomotoshi Satoh
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Hybrid nanosilver/liquid metal ink composition and uses thereof
- Patent number 10,492,297
- Issue date Nov 26, 2019
- Xerox Corporation
- Naveen Chopra
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,438,920
- Issue date Oct 8, 2019
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for forming solder deposits
- Patent number 10,118,240
- Issue date Nov 6, 2018
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting method
- Patent number 9,609,760
- Issue date Mar 28, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tsubasa Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding system
- Patent number 9,607,869
- Issue date Mar 28, 2017
- Tokyo Electron Limited
- Masataka Matsunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for device packaging
- Patent number 9,120,169
- Issue date Sep 1, 2015
- ORION SYSTEMS INTEGRATION PTE LTD
- Hwee Seng Chew
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure manufacturing method, heating and melting treatme...
- Patent number 9,119,336
- Issue date Aug 25, 2015
- Ayumi Industry Co., Ltd.
- Hideyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure manufacturing method, heating and melting treatme...
- Patent number 8,757,474
- Issue date Jun 24, 2014
- Ayumi Industry Co., Ltd.
- Hideyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a flip chip package and apparatus to attach...
- Patent number 8,697,494
- Issue date Apr 15, 2014
- Samsung Electronics Co., Ltd.
- Chang-Seong Jeon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for manufacturing tight pitch, flip chip integrated circuit...
- Patent number 8,371,497
- Issue date Feb 12, 2013
- QUALCOMM Incorporated
- Christopher James Healy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus, inspecting apparatus, inspecting method, and mo...
- Patent number 7,817,263
- Issue date Oct 19, 2010
- Sony Corporation
- Yoshihiro Ibayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting method for semiconductor parts on circuit substrate
- Patent number 7,674,651
- Issue date Mar 9, 2010
- International Business Machines Corporation
- Yukifumi Oyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Paste coater and PoP automatic mounting apparatus employing the same
- Patent number 7,497,365
- Issue date Mar 3, 2009
- International Business Machines Corporation
- Hideo Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Head assembly, disk unit, and bonding method and apparatus
- Patent number 7,347,347
- Issue date Mar 25, 2008
- Fujitsu Limited
- Hidehiko Kira
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Apparatus and method for mounting electronic components
- Patent number 7,296,727
- Issue date Nov 20, 2007
- Matsushita Electric Industrial Co., Ltd.
- Shunji Onobori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Head assembly having integrated circuit chip covered by layer which...
- Patent number 6,885,522
- Issue date Apr 26, 2005
- Fujitsu Limited
- Hidehiko Kira
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device with gold bumps, and method and apparatus of p...
- Patent number 6,495,441
- Issue date Dec 17, 2002
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with gold bumps, and method and apparatus of p...
- Patent number 6,344,690
- Issue date Feb 5, 2002
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with gold bumps, and method and apparatus of p...
- Patent number 6,333,554
- Issue date Dec 25, 2001
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HYBRID NANOSILVER/LIQUID METAL INK COMPOSITION AND USES THEREOF
- Publication number 20220418104
- Publication date Dec 29, 2022
- Xerox Corporation
- Naveen CHOPRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID NANOSILVER/LIQUID METAL INK COMPOSITION AND USES THEREOF
- Publication number 20200015354
- Publication date Jan 9, 2020
- Xerox Corporation
- Naveen CHOPRA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE PASTE, ELECTRODE CONNECTION STRUCTURE, AND ELECTRODE CON...
- Publication number 20190157229
- Publication date May 23, 2019
- SHARP KABUSHIKI KAISHA
- Tomotoshi SATOH
- B22 - CASTING POWDER METALLURGY
Information Patent Application
INKJET PRINTABLE MASK APPARATUS AND METHOD FOR SOLDER ON DIE TECHNO...
- Publication number 20180315731
- Publication date Nov 1, 2018
- Intel Corporation
- Kosuke Hirota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID NANOSILVER/LIQUID METAL INK COMPOSITION AND USES THEREOF
- Publication number 20180242451
- Publication date Aug 23, 2018
- Xerox Corporation
- Naveen CHOPRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD AND STORAGE MEDIUM
- Publication number 20180158796
- Publication date Jun 7, 2018
- TOKYO ELECTRON LIMITED
- Yoshitaka OTSUKA
- B32 - LAYERED PRODUCTS
Information Patent Application
Method for Forming Solder Deposits
- Publication number 20170320155
- Publication date Nov 9, 2017
- Pac Tech - Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INKJET PHOTO- AND HEAT-CURABLE ADHESIVE, SEMICONDUCTOR DEVICE MANUF...
- Publication number 20170158922
- Publication date Jun 8, 2017
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BONDING SYSTEM
- Publication number 20150059985
- Publication date Mar 5, 2015
- TOKYO ELECTRON LIMITED
- Masataka Matsunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE MANUFACTURING METHOD, HEATING AND MELTING TREATME...
- Publication number 20140246481
- Publication date Sep 4, 2014
- Hideyuki ABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...
- Publication number 20140231492
- Publication date Aug 21, 2014
- PANASONIC CORPORATION
- Tsubasa Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A FLIP CHIP PACKAGE AND APPARATUS TO ATTACH...
- Publication number 20140196280
- Publication date Jul 17, 2014
- Samsung Electronics Co., Ltd.
- Chang-Seong Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...
- Publication number 20140096379
- Publication date Apr 10, 2014
- PANASONIC CORPORATION
- Tsubasa Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Structure Manufacturing Method, Heating And Melting Treatme...
- Publication number 20130105558
- Publication date May 2, 2013
- AYUMI INDUSTRY CO., LTD.
- Hideyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Device for Forming Solder Deposits
- Publication number 20130087539
- Publication date Apr 11, 2013
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A FLIP CHIP PACKAGE AND APPARATUS TO ATTACH...
- Publication number 20120100668
- Publication date Apr 26, 2012
- Samsung Electronics Co., Ltd.
- Chang-Seong Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU MELT AND REFLOW PROCESS FOR FORMING FLIP-CHIP INTERCONNECTI...
- Publication number 20110287560
- Publication date Nov 24, 2011
- ORION SYSTEMS INTEGRATION PTE LTD
- Hwee Seng Chew
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Manufacturing Tight Pitch, Flip Chip Integrated Circuit...
- Publication number 20100314433
- Publication date Dec 16, 2010
- QUALCOMM Incorporated
- Christopher James Healy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mounting apparatus, inspecting apparatus, inspecting method, and mo...
- Publication number 20090251701
- Publication date Oct 8, 2009
- SONY CORPORATION
- Yoshihiro Ibayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING METHOD FOR SEMICONDUCTOR PARTS ON CIRCUIT SUBSTRATE
- Publication number 20080150135
- Publication date Jun 26, 2008
- Yukifumi Oyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Paste Coater and PoP Automatic Mounting Apparatus Employing the Same
- Publication number 20070137559
- Publication date Jun 21, 2007
- International Business Machines Corporation
- Hideo Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for mounting electronic components
- Publication number 20050098610
- Publication date May 12, 2005
- Shunji Onobori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fluxes for flip chip assembly using water soluble polymers
- Publication number 20050067468
- Publication date Mar 31, 2005
- Daoqiang Lu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Head assembly, disk unit, and bonding method and apparatus
- Publication number 20050057856
- Publication date Mar 17, 2005
- FUJITSU LIMITED
- Hidehiko Kira
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Mounting method
- Publication number 20040007312
- Publication date Jan 15, 2004
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with gold bumps, and method and apparatus of p...
- Publication number 20020100972
- Publication date Aug 1, 2002
- Masayuki Kitajima
- H01 - BASIC ELECTRIC ELEMENTS

Means for applying permanent coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hybrid nanosilver/liquid metal ink composition and uses thereof

Hybrid nanosilver/liquid metal ink composition and uses thereof

Bonding apparatus, bonding system, bonding method and storage medium

Bonding apparatus, bonding system, bonding method and storage medium

Conductive paste having dilatancy, electrode connection structure i...

Hybrid nanosilver/liquid metal ink composition and uses thereof

Bonding apparatus, bonding system, bonding method and storage medium

Method for forming solder deposits

Electronic component mounting method

Bonding system

Method for device packaging

Bonding structure manufacturing method, heating and melting treatme...

Bonding structure manufacturing method, heating and melting treatme...

Method of manufacturing a flip chip package and apparatus to attach...

Method for manufacturing tight pitch, flip chip integrated circuit...

Mounting apparatus, inspecting apparatus, inspecting method, and mo...

Mounting method for semiconductor parts on circuit substrate

Paste coater and PoP automatic mounting apparatus employing the same

Head assembly, disk unit, and bonding method and apparatus

Apparatus and method for mounting electronic components

Head assembly having integrated circuit chip covered by layer which...

Semiconductor device with gold bumps, and method and apparatus of p...

Semiconductor device with gold bumps, and method and apparatus of p...

Semiconductor device with gold bumps, and method and apparatus of p...

Patents Applicationslast 30 patents

HYBRID NANOSILVER/LIQUID METAL INK COMPOSITION AND USES THEREOF

HYBRID NANOSILVER/LIQUID METAL INK COMPOSITION AND USES THEREOF

CONDUCTIVE PASTE, ELECTRODE CONNECTION STRUCTURE, AND ELECTRODE CON...

INKJET PRINTABLE MASK APPARATUS AND METHOD FOR SOLDER ON DIE TECHNO...

HYBRID NANOSILVER/LIQUID METAL INK COMPOSITION AND USES THEREOF

BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD AND STORAGE MEDIUM

Method for Forming Solder Deposits

INKJET PHOTO- AND HEAT-CURABLE ADHESIVE, SEMICONDUCTOR DEVICE MANUF...

BONDING SYSTEM

BONDING STRUCTURE MANUFACTURING METHOD, HEATING AND MELTING TREATME...

ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...

METHOD OF MANUFACTURING A FLIP CHIP PACKAGE AND APPARATUS TO ATTACH...

ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...

Bonding Structure Manufacturing Method, Heating And Melting Treatme...

Method and Device for Forming Solder Deposits

METHOD OF MANUFACTURING A FLIP CHIP PACKAGE AND APPARATUS TO ATTACH...

IN-SITU MELT AND REFLOW PROCESS FOR FORMING FLIP-CHIP INTERCONNECTI...

Method for Manufacturing Tight Pitch, Flip Chip Integrated Circuit...

Mounting apparatus, inspecting apparatus, inspecting method, and mo...

MOUNTING METHOD FOR SEMICONDUCTOR PARTS ON CIRCUIT SUBSTRATE

Paste Coater and PoP Automatic Mounting Apparatus Employing the Same

Apparatus and method for mounting electronic components

Fluxes for flip chip assembly using water soluble polymers

Head assembly, disk unit, and bonding method and apparatus

Mounting method

Semiconductor device with gold bumps, and method and apparatus of p...