Means for blanket deposition

Industry

CPC
H01L2224/7518

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/7518Means for blanket deposition

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method for exhaust gas purification device
- Patent number 12,121,858
- Issue date Oct 22, 2024
- Cataler Corporation
- Yuki Kido
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chip alignment utilizing superomniphobic surface treatment of silic...
- Patent number 10,396,050
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Eric J. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pick-and-place tool for packaging process
- Patent number 9,966,357
- Issue date May 8, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip alignment utilizing superomniphobic surface treatment of silic...
- Patent number 9,859,244
- Issue date Jan 2, 2018
- International Business Machines Corporation
- Eric J. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for chip-to-wafer integration
- Patent number 9,613,928
- Issue date Apr 4, 2017
- Agency for Science, Technology and Research
- Sunil Wickramanayaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for alignment in flip chip bonding
- Patent number 8,664,039
- Issue date Mar 4, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Chung Sung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD...
- Publication number 20230090693
- Publication date Mar 23, 2023
- Fasford Technology Co., Ltd.
- Geonju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE DIPPING STRUCTURE
- Publication number 20230023353
- Publication date Jan 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Chun Peng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INKJET PRINTABLE MASK APPARATUS AND METHOD FOR SOLDER ON DIE TECHNO...
- Publication number 20180315731
- Publication date Nov 1, 2018
- Intel Corporation
- Kosuke Hirota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ALIGNMENT UTILIZING SUPEROMNIPHOBIC SURFACE TREATMENT OF SILIC...
- Publication number 20170278817
- Publication date Sep 28, 2017
- International Business Machines Corporation
- Eric J. CAMPBELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pick-and-Place Tool for Packaging Process
- Publication number 20150333033
- Publication date Nov 19, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pick-and-Place Tool for Packaging Process
- Publication number 20140030849
- Publication date Jan 30, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods and Apparatus For Alignment In Flip Chip Bonding
- Publication number 20130095607
- Publication date Apr 18, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Chung Sung
- H01 - BASIC ELECTRIC ELEMENTS

Means for blanket deposition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method for exhaust gas purification device

Chip alignment utilizing superomniphobic surface treatment of silic...

Pick-and-place tool for packaging process

Chip alignment utilizing superomniphobic surface treatment of silic...

Method and apparatus for chip-to-wafer integration

Methods and apparatus for alignment in flip chip bonding

Patents Applicationslast 30 patents

DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD...

SEMICONDUCTOR DIE DIPPING STRUCTURE

INKJET PRINTABLE MASK APPARATUS AND METHOD FOR SOLDER ON DIE TECHNO...

CHIP ALIGNMENT UTILIZING SUPEROMNIPHOBIC SURFACE TREATMENT OF SILIC...

Pick-and-Place Tool for Packaging Process

Pick-and-Place Tool for Packaging Process

Methods and Apparatus For Alignment In Flip Chip Bonding