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Means for blanket deposition
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CPC
H01L2224/7718
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/7718
Means for blanket deposition
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Patents Grants
last 30 patents
Information
Patent Grant
Providing multifunctional shutter disk above the workpiece in the m...
Patent number
11,920,237
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Wen-Hao Cheng
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Shutter disk having lamp, power, and/or gas modules arranged at the...
Patent number
11,492,700
Issue date
Nov 8, 2022
Taiwan Semiconductor Manufacturing Co.
Wen-Hao Cheng
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Patents Applications
last 30 patents
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Patent Application
MULTI-FUNCTIONAL SHUTTER DISK FOR THIN FILM DEPOSITION CHAMBER
Publication number
20240167149
Publication date
May 23, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Wen-Hao Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-FUNCTIONAL SHUTTER DISK FOR THIN FILM DEPOSITION CHAMBER
Publication number
20220356562
Publication date
Nov 10, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Wen-Hao Cheng
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...