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H01L2224/7501

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/7501Means for cleaning

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Laned belt for cleaner
- Patent number 11,872,600
- Issue date Jan 16, 2024
- Illinois Tool Works Inc.
- John Neiderman
- B08 - CLEANING
Information Patent Grant
Methods and apparatus for cleaning flip chip assemblies
- Patent number 11,876,005
- Issue date Jan 16, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Xiaoyan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, substrate processing method and bon...
- Patent number 11,804,466
- Issue date Oct 31, 2023
- Tokyo Electron Limited
- Toshifumi Inamasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,658,147
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Ilhyoung Koo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
- Patent number 11,626,295
- Issue date Apr 11, 2023
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Depth-adaptive mechanism for ball grid array dipping
- Patent number 11,605,610
- Issue date Mar 14, 2023
- Google LLC
- Fan Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting system
- Patent number 11,587,804
- Issue date Feb 21, 2023
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering device and a method for producing a solder connection of...
- Patent number 11,491,567
- Issue date Nov 8, 2022
- Pink GmbH Thermosysteme
- Aaron Hutzler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding with pre-deoxide process and apparatus for performing the same
- Patent number 11,342,302
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for reworking flip chip components
- Patent number 11,330,746
- Issue date May 10, 2022
- Raytheon Company
- James A. Robbins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
- Patent number 11,018,028
- Issue date May 25, 2021
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding wafers and bonding tool
- Patent number 10,872,873
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding system
- Patent number 10,840,213
- Issue date Nov 17, 2020
- Tokyo Electron Limited
- Masataka Matsunaga
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wafer to wafer bonding method and wafer to wafer bonding system
- Patent number 10,811,381
- Issue date Oct 20, 2020
- Samsung Electronics Co., Ltd.
- Joon-Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die tray with channels
- Patent number 10,796,936
- Issue date Oct 6, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting Method of a semiconductor device using a colored auxiliary...
- Patent number 10,786,876
- Issue date Sep 29, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Teppei Kojio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gas-controlled bonding platform for edge defect reduction during wa...
- Patent number 10,777,433
- Issue date Sep 15, 2020
- ELPIS TECHNOLOGIES INC.
- Wei Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for packaging components
- Patent number 10,734,349
- Issue date Aug 4, 2020
- CAPCON LIMITED
- Feng Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-selective sintering laser systems and methods thereof
- Patent number 10,722,947
- Issue date Jul 28, 2020
- Board of Regents, The University of Texas System
- Michael A. Cullinan
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Methods and systems for inhibiting bonding materials from contamina...
- Patent number 10,700,038
- Issue date Jun 30, 2020
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device processing method for material removal
- Patent number 10,600,652
- Issue date Mar 24, 2020
- Deca Technologies Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates together, and substrate bonding device
- Patent number 10,580,752
- Issue date Mar 3, 2020
- BONDTECH CO., LTD.
- Akira Yamauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for stacking devices in an integrated circuit...
- Patent number 10,515,838
- Issue date Dec 24, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jig for bonding a semiconductor chip, apparatus for bonding a semic...
- Patent number 10,410,990
- Issue date Sep 10, 2019
- Samsung Electronics Co., Ltd.
- Man-Hee Han
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die attachment apparatus and method utilizing activated forming gas
- Patent number 10,399,170
- Issue date Sep 3, 2019
- ASM Technology Singapore Pte. Ltd.
- Kui Kam Lam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 10,354,972
- Issue date Jul 16, 2019
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Advanced chip to wafer stacking
- Patent number 10,269,760
- Issue date Apr 23, 2019
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rework process and tool design for semiconductor package
- Patent number 10,269,762
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih Ting Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluxing systems, bonding machines including fluxing systems, and me...
- Patent number 10,245,668
- Issue date Apr 2, 2019
- Kulicke and Soffa Industries, Inc.
- Daniel P. Buergi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Advanced chip to wafer stacking
- Patent number 10,170,447
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...
- Publication number 20240404988
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...
- Publication number 20240404989
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR FLUXLESS THERMOCOMPRESSION BONDING
- Publication number 20240339430
- Publication date Oct 10, 2024
- ASMPT SINGAPORE PTE. LTD
- Zetao MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PROCESSING A SUBSTRATE ON A BONDING SYSTEM, AND RELATED...
- Publication number 20240332244
- Publication date Oct 3, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Wafer Oxide Removal and Reflow Treatment
- Publication number 20240282734
- Publication date Aug 22, 2024
- Air Products and Chemicals, Inc.
- Liang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW SYSTEM AND SOLDER REFLOW METHOD USING THE SAME
- Publication number 20240120310
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B08 - CLEANING
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20230378121
- Publication date Nov 23, 2023
- TOKYO ELECTRON LIMITED
- Yuhei Matsuo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LANED BELT FOR CLEANER
- Publication number 20230104821
- Publication date Apr 6, 2023
- Illinois Tool Works Inc.
- John Neiderman
- B08 - CLEANING
Information Patent Application
DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD...
- Publication number 20230090693
- Publication date Mar 23, 2023
- Fasford Technology Co., Ltd.
- Geonju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20220310551
- Publication date Sep 29, 2022
- Samsung Electronics Co., Ltd.
- ILHYOUNG KOO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Depth-Adaptive Mechanism for Ball Grid Array Dipping
- Publication number 20220020719
- Publication date Jan 20, 2022
- Google LLC
- Fan Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND BON...
- Publication number 20200273835
- Publication date Aug 27, 2020
- TOKYO ELECTRON LIMITED
- Toshifumi Inamasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT MOUNTING SYSTEM, RESIN SHAPING DEVICE, RESIN PLACING DEVI...
- Publication number 20200006099
- Publication date Jan 2, 2020
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Bonding with Pre-Deoxide Process and Apparatus for Performing the Same
- Publication number 20190326251
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUX TRANSFER TOOL AND FLUX TRANSFER METHOD
- Publication number 20190267346
- Publication date Aug 29, 2019
- Powertech Technology Inc.
- Kun-Chi Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR CLEANING FLIP CHIP ASSEMBLIES
- Publication number 20190244837
- Publication date Aug 8, 2019
- ACM Research (Shanghai) Inc.
- Xiaoyan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING WAFERS AND BONDING TOOL
- Publication number 20190148333
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Jig for Bonding a Semiconductor Chip, Apparatus for Bonding a Semic...
- Publication number 20190103376
- Publication date Apr 4, 2019
- Samsung Electronics Co., Ltd.
- Man-Hee Han
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR STACKING DEVICES IN AN INTEGRATED CIRCUIT...
- Publication number 20190088527
- Publication date Mar 21, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20190051628
- Publication date Feb 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INKJET PRINTABLE MASK APPARATUS AND METHOD FOR SOLDER ON DIE TECHNO...
- Publication number 20180315731
- Publication date Nov 1, 2018
- Intel Corporation
- Kosuke Hirota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUXILIARY JOINING AGENT AND METHOD FOR PRODUCING THE SAME
- Publication number 20180236613
- Publication date Aug 23, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- Teppei Kojio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Die tray with channels
- Publication number 20180182654
- Publication date Jun 28, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Stacking Devices in an Integrated Circuit...
- Publication number 20180130691
- Publication date May 10, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUXING SYSTEMS, BONDING MACHINES INCLUDING FLUXING SYSTEMS, AND ME...
- Publication number 20180117695
- Publication date May 3, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- Daniel P. Buergi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO-SELECTIVE SINTERING LASER SYSTEMS AND METHODS THEREOF
- Publication number 20180065186
- Publication date Mar 8, 2018
- Board of Regents, The University of Texas System
- Michael A. Cullinan
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20170358551
- Publication date Dec 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED CHIP TO WAFER STACKING
- Publication number 20170179077
- Publication date Jun 22, 2017
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BULK SOLDER REMOVAL ON PROCESSOR PACKAGING
- Publication number 20170179066
- Publication date Jun 22, 2017
- Russell S. Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Rework Process and Tool Design for Semiconductor Package
- Publication number 20170125374
- Publication date May 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih Ting Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Means for cleaning

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Laned belt for cleaner

Methods and apparatus for cleaning flip chip assemblies

Substrate processing apparatus, substrate processing method and bon...

Semiconductor manufacturing apparatus

Method of applying conductive adhesive and manufacturing device usi...

Depth-adaptive mechanism for ball grid array dipping

Component mounting system

Soldering device and a method for producing a solder connection of...

Bonding with pre-deoxide process and apparatus for performing the same

Device and method for reworking flip chip components

Method of applying conductive adhesive and manufacturing device usi...

Method for bonding wafers and bonding tool

Bonding system

Wafer to wafer bonding method and wafer to wafer bonding system

Die tray with channels

Mounting Method of a semiconductor device using a colored auxiliary...

Gas-controlled bonding platform for edge defect reduction during wa...

Apparatus and method for packaging components

Micro-selective sintering laser systems and methods thereof

Methods and systems for inhibiting bonding materials from contamina...

Semiconductor device processing method for material removal

Method for bonding substrates together, and substrate bonding device

Method and apparatus for stacking devices in an integrated circuit...

Jig for bonding a semiconductor chip, apparatus for bonding a semic...

Die attachment apparatus and method utilizing activated forming gas

Hybrid bonding systems and methods for semiconductor wafers

Advanced chip to wafer stacking

Rework process and tool design for semiconductor package

Fluxing systems, bonding machines including fluxing systems, and me...

Advanced chip to wafer stacking

Patents Applicationslast 30 patents

FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...

PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...

SYSTEM AND METHOD FOR FLUXLESS THERMOCOMPRESSION BONDING

METHODS OF PROCESSING A SUBSTRATE ON A BONDING SYSTEM, AND RELATED...

Apparatus and Method for Wafer Oxide Removal and Reflow Treatment

SOLDER REFLOW SYSTEM AND SOLDER REFLOW METHOD USING THE SAME

BONDING APPARATUS AND BONDING METHOD

LANED BELT FOR CLEANER

DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD...

SEMICONDUCTOR MANUFACTURING APPARATUS

Depth-Adaptive Mechanism for Ball Grid Array Dipping

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND BON...

COMPONENT MOUNTING SYSTEM, RESIN SHAPING DEVICE, RESIN PLACING DEVI...

Bonding with Pre-Deoxide Process and Apparatus for Performing the Same

FLUX TRANSFER TOOL AND FLUX TRANSFER METHOD

METHODS AND APPARATUS FOR CLEANING FLIP CHIP ASSEMBLIES

METHOD FOR BONDING WAFERS AND BONDING TOOL

Jig for Bonding a Semiconductor Chip, Apparatus for Bonding a Semic...

METHOD AND APPARATUS FOR STACKING DEVICES IN AN INTEGRATED CIRCUIT...

Hybrid Bonding Systems and Methods for Semiconductor Wafers

INKJET PRINTABLE MASK APPARATUS AND METHOD FOR SOLDER ON DIE TECHNO...

AUXILIARY JOINING AGENT AND METHOD FOR PRODUCING THE SAME

Die tray with channels

Method and Apparatus for Stacking Devices in an Integrated Circuit...

FLUXING SYSTEMS, BONDING MACHINES INCLUDING FLUXING SYSTEMS, AND ME...

MICRO-SELECTIVE SINTERING LASER SYSTEMS AND METHODS THEREOF

Hybrid Bonding Systems and Methods for Semiconductor Wafers

ADVANCED CHIP TO WAFER STACKING

BULK SOLDER REMOVAL ON PROCESSOR PACKAGING

Rework Process and Tool Design for Semiconductor Package