Means for controlling the bonding environment

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CPC
H01L2224/781

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/781Means for controlling the bonding environment

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing perovskite solar cell module and perovskit...
- Patent number 11,114,252
- Issue date Sep 7, 2021
- CPC CORPORATION, TAIWAN
- Kuan-Chieh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding methods and systems incorporating metal nanoparticles
- Patent number 10,283,482
- Issue date May 7, 2019
- Lockheed Martin Corporation
- Randall Mark Stoltenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming ball in bonding wire
- Patent number 10,121,764
- Issue date Nov 6, 2018
- Nippon Micrometal Corporation
- Noritoshi Araki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,972,598
- Issue date May 15, 2018
- Renesas Electronics Corporation
- Yuki Yagyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding methods and systems incorporating metal nanoparticles
- Patent number 9,881,895
- Issue date Jan 30, 2018
- Lockheed Martin Corporation
- Randall Mark Stoltenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wire bonding machine cleaning device and method
- Patent number 9,825,000
- Issue date Nov 21, 2017
- International Test Solutions, Inc.
- Alan E. Humphrey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a functional inlay
- Patent number 9,780,062
- Issue date Oct 3, 2017
- Assa Abloy AB
- Stephane Ayala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Antioxidant gas blow-off unit
- Patent number 9,415,456
- Issue date Aug 16, 2016
- Shinkawa Ltd.
- Toru Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Antioxidant gas blow-off unit
- Patent number 9,362,251
- Issue date Jun 7, 2016
- Shinkawa Ltd.
- Mitsuaki Sakakura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Antioxidant gas supply unit
- Patent number 9,044,821
- Issue date Jun 2, 2015
- Shinkawa Ltd.
- Toru Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure of multilayer copper bonding wire
- Patent number 8,836,147
- Issue date Sep 16, 2014
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,586,416
- Issue date Nov 19, 2013
- Renesas Electronics Corporation
- Masahiko Sekihara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ventilating apparatus
- Patent number 8,443,836
- Issue date May 21, 2013
- ChipMOS Technologies Inc.
- Chih-I Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ventilating apparatus
- Patent number 8,430,124
- Issue date Apr 30, 2013
- ChipMOS Technologies Inc.
- Chih-I Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding structure and method for forming same
- Patent number 8,247,911
- Issue date Aug 21, 2012
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding methods and apparatus for heat sensitive metallization...
- Patent number 6,031,216
- Issue date Feb 29, 2000
- National Semiconductor Corporation
- Inderjit Singh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gas mixture for use in control and formation of ball bonds
- Patent number 4,889,274
- Issue date Dec 26, 1989
- Texas Instruments Incorporated
- Thomas H. Ramsey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE WIRE COATING DURING WIRE BONDING
- Publication number 20240429196
- Publication date Dec 26, 2024
- Western Digital Technologies, Inc.
- Darryl Wong Jun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING
- Publication number 20240194634
- Publication date Jun 13, 2024
- ASMPT SINGAPORE PTE. LTD
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangements and Method for Providing a Bond Connection
- Publication number 20190312008
- Publication date Oct 10, 2019
- INFINEON TECHNOLOGIES AG
- Florian Eacock
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR WIRE BONDING MACHINE CLEANING DEVICE AND METHOD
- Publication number 20180308821
- Publication date Oct 25, 2018
- International Test Solutions, Inc.
- Alan E. Humphrey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING METHODS AND SYSTEMS INCORPORATING METAL NANOPARTICLES
- Publication number 20180138143
- Publication date May 17, 2018
- Lockheed Martin Corporation
- Randall Mark STOLTENBERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING BALL IN BONDING WIRE
- Publication number 20180096965
- Publication date Apr 5, 2018
- NIPPON MICROMETAL CORPORATION
- Noritoshi ARAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180082977
- Publication date Mar 22, 2018
- RENESAS ELECTRONICS CORPORATION
- Yuki YAGYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHODS AND SYSTEMS INCORPORATING METAL NANOPARTICLES
- Publication number 20170053895
- Publication date Feb 23, 2017
- Lockheed Martin Corporation
- Randall Mark STOLTENBERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A FUNCTIONAL INLAY
- Publication number 20170005066
- Publication date Jan 5, 2017
- ASSA ABLOY AB
- Stephane AYALA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ANTIOXIDANT GAS BLOW-OFF UNIT
- Publication number 20150209886
- Publication date Jul 30, 2015
- SHINKAWA LTD.
- Toru Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANTIOXIDANT GAS SUPPLY UNIT
- Publication number 20140311590
- Publication date Oct 23, 2014
- SHINKAWA LTD.
- Toru MAEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20140151341
- Publication date Jun 5, 2014
- SHINKAWA LTD.
- Katsutoshi KUNIYOSHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING STRUCTURE OF MULTILAYER COPPER BONDING WIRE
- Publication number 20130180757
- Publication date Jul 18, 2013
- Nippon Micrometal Corporation
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120302009
- Publication date Nov 29, 2012
- RENESAS ELECTRONICS CORPORATION
- Masahiko SEKIHARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VENTILATING APPARATUS
- Publication number 20110277858
- Publication date Nov 17, 2011
- Chih-I LIU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VENTILATING APPARATUS
- Publication number 20110277861
- Publication date Nov 17, 2011
- Chih-I LIU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING STRUCTURE OF BONDING WIRE AND METHOD FOR FORMING SAME
- Publication number 20100213619
- Publication date Aug 26, 2010
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding wire
- Publication number 20040245320
- Publication date Dec 9, 2004
- Mesato Fukagaya
- H01 - BASIC ELECTRIC ELEMENTS

Means for controlling the bonding environment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing perovskite solar cell module and perovskit...

Wire bonding methods and systems incorporating metal nanoparticles

Method for forming ball in bonding wire

Method of manufacturing semiconductor device

Wire bonding methods and systems incorporating metal nanoparticles

Semiconductor wire bonding machine cleaning device and method

Method of manufacturing a functional inlay

Antioxidant gas blow-off unit

Antioxidant gas blow-off unit

Antioxidant gas supply unit

Bonding structure of multilayer copper bonding wire

Method of manufacturing semiconductor device

Ventilating apparatus

Ventilating apparatus

Wire bonding structure and method for forming same

Wire bonding methods and apparatus for heat sensitive metallization...

Gas mixture for use in control and formation of ball bonds

Patents Applicationslast 30 patents

SELECTIVE WIRE COATING DURING WIRE BONDING

HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING

Arrangements and Method for Providing a Bond Connection

SEMICONDUCTOR WIRE BONDING MACHINE CLEANING DEVICE AND METHOD

WIRE BONDING METHODS AND SYSTEMS INCORPORATING METAL NANOPARTICLES

METHOD FOR FORMING BALL IN BONDING WIRE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

WIRE BONDING METHODS AND SYSTEMS INCORPORATING METAL NANOPARTICLES

METHOD OF MANUFACTURING A FUNCTIONAL INLAY

ANTIOXIDANT GAS BLOW-OFF UNIT

ANTIOXIDANT GAS SUPPLY UNIT

WIRE BONDING APPARATUS

BONDING STRUCTURE OF MULTILAYER COPPER BONDING WIRE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

VENTILATING APPARATUS

VENTILATING APPARATUS

BONDING STRUCTURE OF BONDING WIRE AND METHOD FOR FORMING SAME

Bonding wire