Means for controlling the bonding environment

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H01L2224/771

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/771Means for controlling the bonding environment

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Patents Grantslast 30 patents

Information Patent Grant
Providing multifunctional shutter disk above the workpiece in the m...
- Patent number 11,920,237
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hao Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Shutter disk having lamp, power, and/or gas modules arranged at the...
- Patent number 11,492,700
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Co.
- Wen-Hao Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing perovskite solar cell module and perovskit...
- Patent number 11,114,252
- Issue date Sep 7, 2021
- CPC CORPORATION, TAIWAN
- Kuan-Chieh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curtain airbag device mounting structure and curtain airbag deploym...
- Patent number 10,723,306
- Issue date Jul 28, 2020
- Toyota Jidosha Kabushiki Kaisha
- Takamichi Komura
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
MULTI-FUNCTIONAL SHUTTER DISK FOR THIN FILM DEPOSITION CHAMBER
- Publication number 20240167149
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Hao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-FUNCTIONAL SHUTTER DISK FOR THIN FILM DEPOSITION CHAMBER
- Publication number 20220356562
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Hao Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...