Means for correcting warpage

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CPC
H05K2201/09136

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09136Means for correcting warpage

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor memory system
- Patent number 12,094,866
- Issue date Sep 17, 2024
- Kioxia Corporation
- Hayato Masubuchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Heat sink integrated insulating circuit board
- Patent number 12,068,219
- Issue date Aug 20, 2024
- Mitsubishi Materials Corporation
- Toyo Ohashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 11,997,801
- Issue date May 28, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Woo Seok Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vacuum-assisted BGA joint formation
- Patent number 11,963,307
- Issue date Apr 16, 2024
- International Business Machines Corporation
- Matthew Doyle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component, electric device including the same
- Patent number 11,877,485
- Issue date Jan 16, 2024
- Samsung Display Co., Ltd.
- Chung-seok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect substrate
- Patent number 11,792,927
- Issue date Oct 17, 2023
- Shinko Electric Industries Co., Ltd.
- Rie Mizutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor memory system
- Patent number 11,705,444
- Issue date Jul 18, 2023
- Kioxia Corporation
- Hayato Masubuchi
- G11 - INFORMATION STORAGE
Information Patent Grant
Manufacturing method of circuit carrier board structure
- Patent number 11,678,441
- Issue date Jun 13, 2023
- Unimicron Technology Corp.
- Wei-Ti Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier and method of manufacturing the same
- Patent number 11,622,443
- Issue date Apr 4, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Artan Baftiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Opening in the pad for bonding integrated passive device in InFO pa...
- Patent number 11,612,057
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating an asymmetric printed circuit board with minimized warpage
- Patent number 11,523,519
- Issue date Dec 6, 2022
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Opening in the pad for bonding integrated passive device in InFO pa...
- Patent number 11,470,720
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures and methods
- Patent number 11,304,290
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, and method and system for compensating stress-se...
- Patent number 11,140,771
- Issue date Oct 5, 2021
- XI'AN ZHONGXING NEW SOFTWARE CO., LTD
- Fengpeng Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Active control of electronic package warpage
- Patent number 11,121,096
- Issue date Sep 14, 2021
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component embedded by laminate sheet
- Patent number 11,116,083
- Issue date Sep 7, 2021
- AT&S (China) Co. Ltd.
- Annie Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package comprising a decoupling layer structure
- Patent number 11,083,081
- Issue date Aug 3, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polyphenylene ether resin composition, prepreg, metal-clad laminate...
- Patent number 11,066,548
- Issue date Jul 20, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroaki Umehara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor memory system
- Patent number 11,063,031
- Issue date Jul 13, 2021
- TOSHIBA MEMORY CORPORATION
- Hayato Masubuchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Electronic component, electric device including the same
- Patent number 11,031,454
- Issue date Jun 8, 2021
- SAMSUNG DISPLAY CO., LTD.
- Chung-seok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Opening in the pad for bonding integrated passive device in InFO pa...
- Patent number 10,939,551
- Issue date Mar 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using a partially uncured component carrier body for manufacturing...
- Patent number 10,905,016
- Issue date Jan 26, 2021
- AT & Austria Technologie & Systemtechnik Aktiengesellschaft
- Gernot Grober
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, printed circuit board, and electronic device
- Patent number 10,897,820
- Issue date Jan 19, 2021
- Canon Kabushiki Kaisha
- Koji Noguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit carrier board structure and manufacturing method thereof
- Patent number 10,888,001
- Issue date Jan 5, 2021
- Unimicron Technology Corp.
- Wei-Ti Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,867,956
- Issue date Dec 15, 2020
- Amkor Technology Singapore Holding Pte Ltd.
- Won Chul Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer printed wiring board and method for producing multilayer...
- Patent number 10,785,868
- Issue date Sep 22, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kenichi Toshimitsu
- D03 - WEAVING
Information Patent Grant
Printed circuit board
- Patent number 10,701,799
- Issue date Jun 30, 2020
- Hewlett-Packard Development Company, L.P.
- Stewart R. Wyatt
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed wiring board and camera module
- Patent number 10,674,601
- Issue date Jun 2, 2020
- Taiyo Yuden Co., Ltd.
- Yuichi Sugiyama
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Printed circuit board, semiconductor package including the printed...
- Patent number 10,672,694
- Issue date Jun 2, 2020
- Samsung Electronics Co., Ltd.
- Dong-suk Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Image display device
- Patent number 10,663,793
- Issue date May 26, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yasuhiro Kumamoto
- F21 - LIGHTING

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20240422896
- Publication date Dec 19, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chulmun Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MEMORY SYSTEM
- Publication number 20240405010
- Publication date Dec 5, 2024
- KIOXIA Corporation
- Hayato MASUBUCHI
- G11 - INFORMATION STORAGE
Information Patent Application
METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER
- Publication number 20240389239
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wen Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BARRIER CONTACT FOR AN INTEGRATED CIRCUIT
- Publication number 20240324109
- Publication date Sep 26, 2024
- Western Digital Technologies, Inc.
- Uthayarajan A/L Rasalingam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER
- Publication number 20230422403
- Publication date Dec 28, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Hsien-Wen Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MEMORY SYSTEM
- Publication number 20230307433
- Publication date Sep 28, 2023
- Kioxia Corporation
- Hayato MASUBUCHI
- G11 - INFORMATION STORAGE
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20230189452
- Publication date Jun 15, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Woo Seok YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STIFFENER RING AND SURFACE PACKAGING ASSEMBLY
- Publication number 20230066053
- Publication date Mar 2, 2023
- Huawei Technologies Co., Ltd
- Chuncheng GONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT SUBSTRATE
- Publication number 20230054390
- Publication date Feb 23, 2023
- Shinko Electric Industries Co., Ltd.
- Rie MIZUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE COMPLEMENTARY DIELECTRIC MASK FOR PRINTED CIRCUITS, METHODS...
- Publication number 20220232705
- Publication date Jul 21, 2022
- Aviram Iancovici
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A CIRCUIT BOARD ARRANGEMENT, AND CIRCUIT BOARD...
- Publication number 20210329793
- Publication date Oct 21, 2021
- CONTINENTAL AUTOMOTIVE GMBH
- Rafael Del Rey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier and Method of Manufacturing the Same
- Publication number 20210329779
- Publication date Oct 21, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Artan Baftiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MEMORY SYSTEM
- Publication number 20210296300
- Publication date Sep 23, 2021
- Toshiba Memory Corporation
- Hayato MASUBUCHI
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME
- Publication number 20210265455
- Publication date Aug 26, 2021
- SAMSUNG DISPLAY CO., LTD.
- Chung-seok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT CARRIER BOARD STRUCTURE
- Publication number 20210076508
- Publication date Mar 11, 2021
- Unimicron Technology Corp.
- Wei-Ti Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLYPHENYLENE ETHER RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE...
- Publication number 20200283615
- Publication date Sep 10, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- Hiroaki UMEHARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME
- Publication number 20200273942
- Publication date Aug 27, 2020
- SAMSUNG DISPLAY CO., LTD.
- Chung-seok LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MEMORY SYSTEM
- Publication number 20200194414
- Publication date Jun 18, 2020
- Toshiba Memory Corporation
- Hayato MASUBUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE
- Publication number 20200163213
- Publication date May 21, 2020
- Canon Kabushiki Kaisha
- Koji Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Package Comprising a Decoupling Layer Structure
- Publication number 20200163206
- Publication date May 21, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD FOR PRODUCING MULTILAYER...
- Publication number 20200092994
- Publication date Mar 19, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- KENICHI TOSHIMITSU
- D03 - WEAVING
Information Patent Application
CIRCUIT CARRIER BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190380210
- Publication date Dec 12, 2019
- Unimicron Technology Corp.
- Wei-Ti Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MEMORY SYSTEM
- Publication number 20190326275
- Publication date Oct 24, 2019
- Toshiba Memory Corporation
- Hayato MASUBUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component Embedded by Laminate Sheet
- Publication number 20190254169
- Publication date Aug 15, 2019
- AT&S (China) Co. Ltd.
- Annie TAY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MINIMIZING PRINTED CIRCUIT BOARD WARPAGE
- Publication number 20190141841
- Publication date May 9, 2019
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Opening in the Pad for Bonding Integrated Passive Device in InFO Pa...
- Publication number 20190098756
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL MODULATOR WITH FPC AND OPTICAL TRANSMISSION DEVICE USING SAME
- Publication number 20190098744
- Publication date Mar 28, 2019
- Sumitomo Osaka Cement Co., Ltd.
- Norikazu MIYAZAKI
- G02 - OPTICS
Information Patent Application
ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME
- Publication number 20190067406
- Publication date Feb 28, 2019
- SAMSUNG DISPLAY CO., LTD.
- Chung-seok LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF REDUCING WARPAGE OF AN ORGANIC SUBSTRATE
- Publication number 20190053370
- Publication date Feb 14, 2019
- International Business Machines Corporation
- Sayuri Hada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING EL...
- Publication number 20190021167
- Publication date Jan 17, 2019
- Fujitsu Limited
- KEIICHI YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS

Means for correcting warpage

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor memory system

Heat sink integrated insulating circuit board

Printed circuit board

Vacuum-assisted BGA joint formation

Electronic component, electric device including the same

Interconnect substrate

Semiconductor memory system

Manufacturing method of circuit carrier board structure

Component carrier and method of manufacturing the same

Opening in the pad for bonding integrated passive device in InFO pa...

Fabricating an asymmetric printed circuit board with minimized warpage

Opening in the pad for bonding integrated passive device in InFO pa...

Semiconductor structures and methods

Electronic device, and method and system for compensating stress-se...

Active control of electronic package warpage

Electronic component embedded by laminate sheet

Electronic package comprising a decoupling layer structure

Polyphenylene ether resin composition, prepreg, metal-clad laminate...

Semiconductor memory system

Electronic component, electric device including the same

Opening in the pad for bonding integrated passive device in InFO pa...

Using a partially uncured component carrier body for manufacturing...

Printed wiring board, printed circuit board, and electronic device

Circuit carrier board structure and manufacturing method thereof

Method of manufacturing a semiconductor device

Multilayer printed wiring board and method for producing multilayer...

Printed circuit board

Printed wiring board and camera module

Printed circuit board, semiconductor package including the printed...

Image display device

Patents Applicationslast 30 patents

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

SEMICONDUCTOR MEMORY SYSTEM

METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER

SOLDER BARRIER CONTACT FOR AN INTEGRATED CIRCUIT

METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER

SEMICONDUCTOR MEMORY SYSTEM

PRINTED CIRCUIT BOARD

STIFFENER RING AND SURFACE PACKAGING ASSEMBLY

INTERCONNECT SUBSTRATE

SURFACE COMPLEMENTARY DIELECTRIC MASK FOR PRINTED CIRCUITS, METHODS...

METHOD FOR PRODUCING A CIRCUIT BOARD ARRANGEMENT, AND CIRCUIT BOARD...

Component Carrier and Method of Manufacturing the Same

SEMICONDUCTOR MEMORY SYSTEM

ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME

MANUFACTURING METHOD OF CIRCUIT CARRIER BOARD STRUCTURE

POLYPHENYLENE ETHER RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE...

ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME

SEMICONDUCTOR MEMORY SYSTEM

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE

Electronic Package Comprising a Decoupling Layer Structure

MULTILAYER PRINTED WIRING BOARD AND METHOD FOR PRODUCING MULTILAYER...

CIRCUIT CARRIER BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR MEMORY SYSTEM

Electronic Component Embedded by Laminate Sheet

MINIMIZING PRINTED CIRCUIT BOARD WARPAGE

Opening in the Pad for Bonding Integrated Passive Device in InFO Pa...

OPTICAL MODULATOR WITH FPC AND OPTICAL TRANSMISSION DEVICE USING SAME

ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME

METHOD OF REDUCING WARPAGE OF AN ORGANIC SUBSTRATE

WIRING BOARD, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING EL...