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H05K2201/09136
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ELECTRICITY
H05
Electric techniques
H05K
PRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00
Indexing scheme relating to printed circuits covered by H05K1/00
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H05K2201/09136
Means for correcting warpage
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Patents Grants
last 30 patents
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Patent Grant
Vacuum-assisted BGA joint formation
Patent number
11,963,307
Issue date
Apr 16, 2024
International Business Machines Corporation
Matthew Doyle
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic component, electric device including the same
Patent number
11,877,485
Issue date
Jan 16, 2024
Samsung Display Co., Ltd.
Chung-seok Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect substrate
Patent number
11,792,927
Issue date
Oct 17, 2023
Shinko Electric Industries Co., Ltd.
Rie Mizutani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor memory system
Patent number
11,705,444
Issue date
Jul 18, 2023
Kioxia Corporation
Hayato Masubuchi
G11 - INFORMATION STORAGE
Information
Patent Grant
Manufacturing method of circuit carrier board structure
Patent number
11,678,441
Issue date
Jun 13, 2023
Unimicron Technology Corp.
Wei-Ti Lin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Component carrier and method of manufacturing the same
Patent number
11,622,443
Issue date
Apr 4, 2023
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Artan Baftiri
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Opening in the pad for bonding integrated passive device in InFO pa...
Patent number
11,612,057
Issue date
Mar 21, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Hsien Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabricating an asymmetric printed circuit board with minimized warpage
Patent number
11,523,519
Issue date
Dec 6, 2022
International Business Machines Corporation
Bruce J. Chamberlin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Opening in the pad for bonding integrated passive device in InFO pa...
Patent number
11,470,720
Issue date
Oct 11, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Hsien Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structures and methods
Patent number
11,304,290
Issue date
Apr 12, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device, and method and system for compensating stress-se...
Patent number
11,140,771
Issue date
Oct 5, 2021
XI'AN ZHONGXING NEW SOFTWARE CO., LTD
Fengpeng Liu
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Active control of electronic package warpage
Patent number
11,121,096
Issue date
Sep 14, 2021
International Business Machines Corporation
Katsuyuki Sakuma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component embedded by laminate sheet
Patent number
11,116,083
Issue date
Sep 7, 2021
AT&S (China) Co. Ltd.
Annie Tay
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package comprising a decoupling layer structure
Patent number
11,083,081
Issue date
Aug 3, 2021
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Mikael Tuominen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Polyphenylene ether resin composition, prepreg, metal-clad laminate...
Patent number
11,066,548
Issue date
Jul 20, 2021
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Hiroaki Umehara
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Semiconductor memory system
Patent number
11,063,031
Issue date
Jul 13, 2021
TOSHIBA MEMORY CORPORATION
Hayato Masubuchi
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Grant
Electronic component, electric device including the same
Patent number
11,031,454
Issue date
Jun 8, 2021
SAMSUNG DISPLAY CO., LTD.
Chung-seok Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Opening in the pad for bonding integrated passive device in InFO pa...
Patent number
10,939,551
Issue date
Mar 2, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Hsien Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Using a partially uncured component carrier body for manufacturing...
Patent number
10,905,016
Issue date
Jan 26, 2021
AT & Austria Technologie & Systemtechnik Aktiengesellschaft
Gernot Grober
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed wiring board, printed circuit board, and electronic device
Patent number
10,897,820
Issue date
Jan 19, 2021
Canon Kabushiki Kaisha
Koji Noguchi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuit carrier board structure and manufacturing method thereof
Patent number
10,888,001
Issue date
Jan 5, 2021
Unimicron Technology Corp.
Wei-Ti Lin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of manufacturing a semiconductor device
Patent number
10,867,956
Issue date
Dec 15, 2020
Amkor Technology Singapore Holding Pte Ltd.
Won Chul Do
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer printed wiring board and method for producing multilayer...
Patent number
10,785,868
Issue date
Sep 22, 2020
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Kenichi Toshimitsu
D03 - WEAVING
Information
Patent Grant
Printed circuit board
Patent number
10,701,799
Issue date
Jun 30, 2020
Hewlett-Packard Development Company, L.P.
Stewart R. Wyatt
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Printed wiring board and camera module
Patent number
10,674,601
Issue date
Jun 2, 2020
Taiyo Yuden Co., Ltd.
Yuichi Sugiyama
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Printed circuit board, semiconductor package including the printed...
Patent number
10,672,694
Issue date
Jun 2, 2020
Samsung Electronics Co., Ltd.
Dong-suk Kim
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Image display device
Patent number
10,663,793
Issue date
May 26, 2020
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Yasuhiro Kumamoto
F21 - LIGHTING
Information
Patent Grant
Electronic component, electric device including the same
Patent number
10,651,260
Issue date
May 12, 2020
Samsung Display Co., Ltd.
Chung-seok Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor memory system
Patent number
10,607,979
Issue date
Mar 31, 2020
TOSHIBA MEMORY CORPORATION
Hayato Masubuchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of reducing warpage of an organic substrate
Patent number
10,595,399
Issue date
Mar 17, 2020
International Business Machines Corporation
Sayuri Hada
G01 - MEASURING TESTING
Patents Applications
last 30 patents
Information
Patent Application
METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER
Publication number
20230422403
Publication date
Dec 28, 2023
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
Hsien-Wen Liu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR MEMORY SYSTEM
Publication number
20230307433
Publication date
Sep 28, 2023
Kioxia Corporation
Hayato MASUBUCHI
G11 - INFORMATION STORAGE
Information
Patent Application
PRINTED CIRCUIT BOARD
Publication number
20230189452
Publication date
Jun 15, 2023
Samsung Electro-Mechanics Co., Ltd.
Woo Seok YANG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
STIFFENER RING AND SURFACE PACKAGING ASSEMBLY
Publication number
20230066053
Publication date
Mar 2, 2023
Huawei Technologies Co., Ltd
Chuncheng GONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT SUBSTRATE
Publication number
20230054390
Publication date
Feb 23, 2023
Shinko Electric Industries Co., Ltd.
Rie MIZUTANI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SURFACE COMPLEMENTARY DIELECTRIC MASK FOR PRINTED CIRCUITS, METHODS...
Publication number
20220232705
Publication date
Jul 21, 2022
Aviram Iancovici
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR PRODUCING A CIRCUIT BOARD ARRANGEMENT, AND CIRCUIT BOARD...
Publication number
20210329793
Publication date
Oct 21, 2021
CONTINENTAL AUTOMOTIVE GMBH
Rafael Del Rey
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Component Carrier and Method of Manufacturing the Same
Publication number
20210329779
Publication date
Oct 21, 2021
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Artan Baftiri
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR MEMORY SYSTEM
Publication number
20210296300
Publication date
Sep 23, 2021
Toshiba Memory Corporation
Hayato MASUBUCHI
G11 - INFORMATION STORAGE
Information
Patent Application
ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME
Publication number
20210265455
Publication date
Aug 26, 2021
SAMSUNG DISPLAY CO., LTD.
Chung-seok LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF CIRCUIT CARRIER BOARD STRUCTURE
Publication number
20210076508
Publication date
Mar 11, 2021
Unimicron Technology Corp.
Wei-Ti Lin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
POLYPHENYLENE ETHER RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE...
Publication number
20200283615
Publication date
Sep 10, 2020
Panasonic Intellectual Property Management Co., Ltd.
Hiroaki UMEHARA
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME
Publication number
20200273942
Publication date
Aug 27, 2020
SAMSUNG DISPLAY CO., LTD.
Chung-seok LEE
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR MEMORY SYSTEM
Publication number
20200194414
Publication date
Jun 18, 2020
Toshiba Memory Corporation
Hayato MASUBUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE
Publication number
20200163213
Publication date
May 21, 2020
Canon Kabushiki Kaisha
Koji Noguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic Package Comprising a Decoupling Layer Structure
Publication number
20200163206
Publication date
May 21, 2020
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Mikael Tuominen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD FOR PRODUCING MULTILAYER...
Publication number
20200092994
Publication date
Mar 19, 2020
Panasonic Intellectual Property Management Co., Ltd.
KENICHI TOSHIMITSU
D03 - WEAVING
Information
Patent Application
CIRCUIT CARRIER BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20190380210
Publication date
Dec 12, 2019
Unimicron Technology Corp.
Wei-Ti Lin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR MEMORY SYSTEM
Publication number
20190326275
Publication date
Oct 24, 2019
Toshiba Memory Corporation
Hayato MASUBUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic Component Embedded by Laminate Sheet
Publication number
20190254169
Publication date
Aug 15, 2019
AT&S (China) Co. Ltd.
Annie TAY
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MINIMIZING PRINTED CIRCUIT BOARD WARPAGE
Publication number
20190141841
Publication date
May 9, 2019
International Business Machines Corporation
Bruce J. Chamberlin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Opening in the Pad for Bonding Integrated Passive Device in InFO Pa...
Publication number
20190098756
Publication date
Mar 28, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Hsien Hsieh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
OPTICAL MODULATOR WITH FPC AND OPTICAL TRANSMISSION DEVICE USING SAME
Publication number
20190098744
Publication date
Mar 28, 2019
Sumitomo Osaka Cement Co., Ltd.
Norikazu MIYAZAKI
G02 - OPTICS
Information
Patent Application
ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME
Publication number
20190067406
Publication date
Feb 28, 2019
SAMSUNG DISPLAY CO., LTD.
Chung-seok LEE
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF REDUCING WARPAGE OF AN ORGANIC SUBSTRATE
Publication number
20190053370
Publication date
Feb 14, 2019
International Business Machines Corporation
Sayuri Hada
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRING BOARD, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING EL...
Publication number
20190021167
Publication date
Jan 17, 2019
Fujitsu Limited
KEIICHI YAMAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE, AND METHOD AND SYSTEM FOR COMPENSATING STRESS-SE...
Publication number
20190014658
Publication date
Jan 10, 2019
ZTE CORPORATION
Fengpeng LIU
G01 - MEASURING TESTING
Information
Patent Application
COMPOSITE CARRIER FOR WARPAGE MANAGEMENT
Publication number
20190013280
Publication date
Jan 10, 2019
Dyi-Chung HU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POLYPHENYLENE ETHER RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE...
Publication number
20180312683
Publication date
Nov 1, 2018
Panasonic Intellectual Property Management Co., Ltd.
HIROAKI UMEHARA
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Using a Partially Uncured Component Carrier for Manufacturing Compo...
Publication number
20180310419
Publication date
Oct 25, 2018
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Gernot Grober
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR