-
-
-
-
-
-
-
Semiconductor wafer
-
Patent number 11,929,229
-
Issue date Mar 12, 2024
-
MI2-FACTORY GMBH
-
Florian Krippendorf
-
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
-
-
-
-
-
-
Ion milling device
-
Patent number 11,894,213
-
Issue date Feb 6, 2024
-
HITACHI HIGH-TECH CORPORATION
-
Asako Kaneko
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
Permeance magnetic assembly
-
Patent number 11,854,776
-
Issue date Dec 26, 2023
-
Taiwan Semiconductor Manufacturing Co., Ltd.
-
Tsung-Jen Yang
-
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
-
-
Blanking aperture array unit
-
Patent number 11,837,429
-
Issue date Dec 5, 2023
-
NuFlare Technology, Inc.
-
Shuji Yoshino
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
Charged particle beam device
-
Patent number 11,817,289
-
Issue date Nov 14, 2023
-
HITACHI HIGH-TECH CORPORATION
-
Tsunenori Nomaguchi
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
-
-
Charged particle beam apparatus
-
Patent number 11,791,124
-
Issue date Oct 17, 2023
-
Hitachi High-Technologies Corporation
-
Yuta Kawamoto
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
Aberration corrector
-
Patent number 11,791,125
-
Issue date Oct 17, 2023
-
NuFlare Technology, Inc.
-
Yuichi Maekawa
-
H01 - BASIC ELECTRIC ELEMENTS
-
Charged particle beam apparatus
-
Patent number 11,784,023
-
Issue date Oct 10, 2023
-
Hitachi High-Technologies Corporation
-
Yuta Kawamoto
-
H01 - BASIC ELECTRIC ELEMENTS