Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB

Industry

CPC
H05K2201/10598

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10598Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB

Industries

Patents Grantslast 30 patents

Information Patent Grant
Circuit carrier arrangement and method for producing such a circuit...
- Patent number 11,961,785
- Issue date Apr 16, 2024
- Vitesco Technologies GmbH
- Jens Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for retaining fastening element solder
- Patent number 11,951,556
- Issue date Apr 9, 2024
- DTECH PRECISION INDUSTRIES CO., LTD.
- Ting-Jui Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power electronics assembly
- Patent number RE49723
- Issue date Nov 7, 2023
- Turntide Technologies, Inc.
- Peter Barrass
Information Patent Grant
Solderless BGA interconnect
- Patent number 11,811,182
- Issue date Nov 7, 2023
- Intel Corporation
- Tyler Leuten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink fastening structure
- Patent number 11,800,634
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Juhyeok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Human-machine interface assemblies
- Patent number 11,792,935
- Issue date Oct 17, 2023
- Whirlpool Corporation
- Matthew P. Ebrom
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit carrier arrangement and method for producing such a circuit...
- Patent number 11,728,240
- Issue date Aug 15, 2023
- Vitesco Technologies GmbH
- Jens Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for retaining fastening element solder
- Patent number 11,638,963
- Issue date May 2, 2023
- DTECH PRECISION INDUSTRIES CO., LTD.
- Ting-Jui Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting devices for semiconductor packages with a fixation mechanism
- Patent number 11,605,575
- Issue date Mar 14, 2023
- Mahle International GmbH
- Francisco Gonzalez Espin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multipoint contact conduction cooling of a removable device
- Patent number 11,579,668
- Issue date Feb 14, 2023
- Hewlett Packard Enterprise Development LP
- Harvey J. Lunsman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic card, method of manufacturing electronic card, and elect...
- Patent number 11,497,120
- Issue date Nov 8, 2022
- Fujitsu Limited
- Tsuyoshi So
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic sensor component and assembly
- Patent number 11,474,165
- Issue date Oct 18, 2022
- Melexis Technologies SA
- Jian Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixing device and electronic device using the same
- Patent number 11,406,019
- Issue date Aug 2, 2022
- ASUSTeK COMPUTER Inc.
- Hsu-Ching Chu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Lighting device comprising circuit board
- Patent number 11,397,001
- Issue date Jul 26, 2022
- Lumileds LLC
- Juergen Mertens
- F21 - LIGHTING
Information Patent Grant
Server microprocessor carrier with guiding alignment anti-tilt and...
- Patent number 11,291,115
- Issue date Mar 29, 2022
- Intel Corporation
- Shelby A. Ferguson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided and tool-less M.2 module design
- Patent number 11,262,813
- Issue date Mar 1, 2022
- Quanta Computer Inc.
- Yaw-Tzorng Tsorng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrical assembly
- Patent number 11,212,918
- Issue date Dec 28, 2021
- Siemens Aktiengesellschaft
- Rene Blank
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Human-machine interface assemblies
- Patent number 11,172,575
- Issue date Nov 9, 2021
- Whirlpool Corporation
- Matthew P. Ebrom
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Magnetic sensor component and assembly
- Patent number 11,067,645
- Issue date Jul 20, 2021
- Melexis Technologies SA
- Jian Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink and stiffener mount with integrated alignment
- Patent number 11,071,195
- Issue date Jul 20, 2021
- Google LLC
- Ryan Tong
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Unmanned aerial vehicle
- Patent number 10,946,961
- Issue date Mar 16, 2021
- SZ DJI Technology Co., Ltd
- Wei Wang
- G01 - MEASURING TESTING
Information Patent Grant
Press apparatus and pressing method thereof
- Patent number 10,849,237
- Issue date Nov 24, 2020
- Samsung Display Co., Ltd.
- Jae Uk Cho
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Mounting structure
- Patent number 10,827,616
- Issue date Nov 3, 2020
- Kyocera Corporation
- Seiji Hattori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power electronics assembly
- Patent number 10,736,206
- Issue date Aug 4, 2020
- Sevcon Limited
- Peter Barrass
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tool-less top service of m.2 latch on board
- Patent number 10,608,355
- Issue date Mar 31, 2020
- Quanta Computer Inc.
- Chao-Jung Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus to determine a condition of a door
- Patent number 10,550,601
- Issue date Feb 4, 2020
- Schlage Lock Company LLC
- Joseph W. Baumgarte
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Grant
Method for controlling the assembly of a printed circuit board by r...
- Patent number 10,555,431
- Issue date Feb 4, 2020
- Continental Automotive France
- Pierre Perales
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Flexible device module for fabric layer assembly and method for pro...
- Patent number 10,499,502
- Issue date Dec 3, 2019
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Margaretha Maria de Kok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector and circuit board assembly
- Patent number 10,483,668
- Issue date Nov 19, 2019
- Japan Aviation Electronics Industry, Limited
- Osamu Hashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an electronic module assembly and electronic m...
- Patent number 10,462,921
- Issue date Oct 29, 2019
- Infineon Technologies AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELF-EQUALIZING FRAME FOR THERMAL MANAGEMENT DEVICE PRELOAD
- Publication number 20240121932
- Publication date Apr 11, 2024
- Cisco Technology, Inc.
- Robert Gregory Twiss
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPRESSION STRUCTURES FOR IC PACKAGES
- Publication number 20240105639
- Publication date Mar 28, 2024
- Apple Inc.
- Helia Rahmani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEVER ACTUATED LOCKING MECHANISM
- Publication number 20240080987
- Publication date Mar 7, 2024
- Eaton Intelligent Power Limited
- Adarsh MISHRA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE
- Publication number 20240074042
- Publication date Feb 29, 2024
- Huawei Technologies Co., Ltd
- Yulong Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Exerting-Pressure Device and Electronic Apparatus Comprising the Same
- Publication number 20240064905
- Publication date Feb 22, 2024
- TE Connectivity Solutions GMBH
- Wei (David) Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HUMAN-MACHINE INTERFACE ASSEMBLIES
- Publication number 20230413445
- Publication date Dec 21, 2023
- Whirlpool Corporation
- MATTHEW P. EBROM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Circuit Carrier Arrangement And Method For Producing Such A Circuit...
- Publication number 20230343674
- Publication date Oct 26, 2023
- Vitesco Technologies GMBH
- Jens Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE JUMPER WITH A MOUNTING FRAME
- Publication number 20230209714
- Publication date Jun 29, 2023
- Interplex Industries, Inc.
- Richard Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOLDABLE COMPRESSION ATTACHED MEMORY MODULE (FCAMM)
- Publication number 20230120513
- Publication date Apr 20, 2023
- Intel Corporation
- Jackson Chung Peng Kong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD, ELECTRONIC DEVICE, AND MANUFACTURING METHOD
- Publication number 20220375821
- Publication date Nov 24, 2022
- Huawei Technologies Co., Ltd
- Zhaokuan LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer For Printed Circuit Boards
- Publication number 20220104361
- Publication date Mar 31, 2022
- SoftIron Limited
- Robert Drury
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTIPOINT CONTACT CONDUCTION COOLING OF A REMOVABLE DEVICE
- Publication number 20220091642
- Publication date Mar 24, 2022
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Harvey J. Lunsman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HUMAN-MACHINE INTERFACE ASSEMBLIES
- Publication number 20220046799
- Publication date Feb 10, 2022
- Whirlpool Corporation
- MATTHEW P. EBROM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FIXING DEVICE AND ELECTRONIC DEVICE USING THE SAME
- Publication number 20210068257
- Publication date Mar 4, 2021
- ASUSTEK COMPUTER INC.
- Hsu-Ching CHU
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
ELECTRONIC CARD, METHOD OF MANUFACTURING ELECTRONIC CARD, AND ELECT...
- Publication number 20210068258
- Publication date Mar 4, 2021
- Fujitsu Limited
- Tsuyoshi So
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETIC SENSOR COMPONENT AND ASSEMBLY
- Publication number 20210048489
- Publication date Feb 18, 2021
- Melexis Technologies SA
- Jian CHEN
- G01 - MEASURING TESTING
Information Patent Application
PRESS APPARATUS AND PRESSING METHOD THEREOF
- Publication number 20210045253
- Publication date Feb 11, 2021
- SAMSUNG DISPLAY CO., LTD.
- Jae Uk CHO
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT TERMINAL CONNECTI...
- Publication number 20210022246
- Publication date Jan 21, 2021
- LENOVO (SINGAPORE) PTE. LTD.
- Wenjin Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE
- Publication number 20200245464
- Publication date Jul 30, 2020
- Kyocera Corporation
- Seiji HATTORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR RETAINING FASTENING ELEMENT SOLDER
- Publication number 20200215632
- Publication date Jul 9, 2020
- DTECH PRECISION INDUSTRIES CO., LTD.
- TING-JUI WANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical Assembly
- Publication number 20200170111
- Publication date May 28, 2020
- SIEMENS AKTIENGESELLSCHAFT
- Rene Blank
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
UNMANNED AERIAL VEHICLE
- Publication number 20200140084
- Publication date May 7, 2020
- SZ DJI Technology Co., Ltd.
- Wei WANG
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Application
SOLDERLESS BGA INTERCONNECT
- Publication number 20200119467
- Publication date Apr 16, 2020
- Intel Corporation
- Tyler LEUTEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR CONTROLLING THE ASSEMBLY OF A PRINTED CIRCUIT BOARD BY R...
- Publication number 20190343014
- Publication date Nov 7, 2019
- CONTINENTAL AUTOMOTIVE FRANCE
- Pierre Perales
- B60 - VEHICLES IN GENERAL
Information Patent Application
HUMAN-MACHINE INTERFACE ASSEMBLIES
- Publication number 20190335587
- Publication date Oct 31, 2019
- Whirlpool Corporation
- MATTHEW P. EBROM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SERVER MICROPROCESSOR CARRIER WITH GUIDING ALIGNMENT ANTI-TILT AND...
- Publication number 20190306985
- Publication date Oct 3, 2019
- Shelby A. Ferguson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CONTROL DEVICE
- Publication number 20190132982
- Publication date May 2, 2019
- Hyundai Autron Co., Ltd.
- Chang Ju KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOL-LESS TOP SERVICE OF M.2 LATCH ON BOARD
- Publication number 20190074614
- Publication date Mar 7, 2019
- QUANTA COMPUTER INC.
- Chao-Jung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS ASSEMBLY
- Publication number 20180235071
- Publication date Aug 16, 2018
- SEVCON LIMITED
- Peter Barrass
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LATCH DEVICE FOR HEAT DISSIPATION UNIT
- Publication number 20170105279
- Publication date Apr 13, 2017
- Asia Vital Components Co., Ltd.
- Sheng-Huang Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit carrier arrangement and method for producing such a circuit...

Method for retaining fastening element solder

Power electronics assembly

Solderless BGA interconnect

Heat sink fastening structure

Human-machine interface assemblies

Circuit carrier arrangement and method for producing such a circuit...

Structure for retaining fastening element solder

Mounting devices for semiconductor packages with a fixation mechanism

Multipoint contact conduction cooling of a removable device

Electronic card, method of manufacturing electronic card, and elect...

Magnetic sensor component and assembly

Fixing device and electronic device using the same

Lighting device comprising circuit board

Server microprocessor carrier with guiding alignment anti-tilt and...

Double-sided and tool-less M.2 module design

Electrical assembly

Human-machine interface assemblies

Magnetic sensor component and assembly

Heatsink and stiffener mount with integrated alignment

Unmanned aerial vehicle

Press apparatus and pressing method thereof

Mounting structure

Power electronics assembly

Tool-less top service of m.2 latch on board

Method and apparatus to determine a condition of a door

Method for controlling the assembly of a printed circuit board by r...

Flexible device module for fabric layer assembly and method for pro...

Connector and circuit board assembly

Method for producing an electronic module assembly and electronic m...

Patents Applicationslast 30 patents

SELF-EQUALIZING FRAME FOR THERMAL MANAGEMENT DEVICE PRELOAD

COMPRESSION STRUCTURES FOR IC PACKAGES

LEVER ACTUATED LOCKING MECHANISM

CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE

Exerting-Pressure Device and Electronic Apparatus Comprising the Same

HUMAN-MACHINE INTERFACE ASSEMBLIES

Circuit Carrier Arrangement And Method For Producing Such A Circuit...

FLEXIBLE JUMPER WITH A MOUNTING FRAME

FOLDABLE COMPRESSION ATTACHED MEMORY MODULE (FCAMM)

BOARD, ELECTRONIC DEVICE, AND MANUFACTURING METHOD

Interposer For Printed Circuit Boards

MULTIPOINT CONTACT CONDUCTION COOLING OF A REMOVABLE DEVICE

HUMAN-MACHINE INTERFACE ASSEMBLIES

FIXING DEVICE AND ELECTRONIC DEVICE USING THE SAME

ELECTRONIC CARD, METHOD OF MANUFACTURING ELECTRONIC CARD, AND ELECT...

MAGNETIC SENSOR COMPONENT AND ASSEMBLY

PRESS APPARATUS AND PRESSING METHOD THEREOF

METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT TERMINAL CONNECTI...

MOUNTING STRUCTURE

STRUCTURE AND METHOD FOR RETAINING FASTENING ELEMENT SOLDER

Electrical Assembly

UNMANNED AERIAL VEHICLE

SOLDERLESS BGA INTERCONNECT

METHOD FOR CONTROLLING THE ASSEMBLY OF A PRINTED CIRCUIT BOARD BY R...

HUMAN-MACHINE INTERFACE ASSEMBLIES

SERVER MICROPROCESSOR CARRIER WITH GUIDING ALIGNMENT ANTI-TILT AND...

ELECTRONIC CONTROL DEVICE

TOOL-LESS TOP SERVICE OF M.2 LATCH ON BOARD

POWER ELECTRONICS ASSEMBLY

LATCH DEVICE FOR HEAT DISSIPATION UNIT