TREA

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  • CPC
  • H01L2224/7895
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/7895Means for forming additional members
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Wire Bonding For Semiconductor Devices
    • Publication number 20220052014
    • Publication date Feb 17, 2022
    • Western Digital Technologies, Inc.
    • Yang Lei
    • H01 - BASIC ELECTRIC ELEMENTS