Means for monitoring the connection process

Industry

CPC
H01L2224/769

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/769Means for monitoring the connection process

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Chuck design and method for wafer
- Patent number 12,148,651
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chuck design and method for wafer
- Patent number 11,587,818
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Methods for surface attachment of flipped active components
- Patent number 10,262,966
- Issue date Apr 16, 2019
- X-CELEPRINT LIMITED
- Christopher Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for surface attachment of flipped active components
- Patent number 9,603,259
- Issue date Mar 21, 2017
- Semprius, Inc.
- Christopher Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for surface attachment of flipped active components
- Patent number 9,307,652
- Issue date Apr 5, 2016
- Semprius, Inc.
- Christopher Bower
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging process tools and packaging methods for semiconductor dev...
- Patent number 9,218,999
- Issue date Dec 22, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Substrates with transferable chiplets
- Patent number 8,934,259
- Issue date Jan 13, 2015
- Semprius, Inc.
- Christopher Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for surface attachment of flipped active componenets
- Patent number 8,889,485
- Issue date Nov 18, 2014
- Semprius, Inc.
- Christopher Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging process tools and packaging methods for semiconductor dev...
- Patent number 8,809,117
- Issue date Aug 19, 2014
- Taiwain Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Chip packaging fixture using magnetic field for self-alignment
- Patent number 8,789,267
- Issue date Jul 29, 2014
- Chengdu Kiloway Electronics Inc.
- Jack Zezhong Peng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Die bonding method utilizing rotary wafer table
- Patent number 8,633,089
- Issue date Jan 21, 2014
- ASM Assembly Automation LTD
- Man Chung Ng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Chuck Design and Method for Wafer
- Publication number 20240395595
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chuck Design and Method for Wafer
- Publication number 20220359260
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
Chuck Design and Method for Wafer
- Publication number 20210020492
- Publication date Jan 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Process Tools and Packaging Methods for Semiconductor Dev...
- Publication number 20140331462
- Publication date Nov 13, 2014
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Process Tools and Packaging Methods for Semiconductor Dev...
- Publication number 20130089952
- Publication date Apr 11, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES WITH TRANSFERABLE CHIPLETS
- Publication number 20120314388
- Publication date Dec 13, 2012
- Semprius, Inc.
- Christopher Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR SURFACE ATTACHMENT OF FLIPPED ACTIVE COMPONENTS
- Publication number 20120313241
- Publication date Dec 13, 2012
- Semprius, Inc.
- Christopher Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING METHOD UTILIZING ROTARY WAFER TABLE
- Publication number 20120252161
- Publication date Oct 4, 2012
- Man Chung NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Small Chip Packaging Fixture And Method Of Using Magnetic Field Ass...
- Publication number 20110262258
- Publication date Oct 27, 2011
- Jack Zezhong Peng
- H01 - BASIC ELECTRIC ELEMENTS

Means for monitoring the connection process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chuck design and method for wafer

Chuck design and method for wafer

Methods for surface attachment of flipped active components

Methods for surface attachment of flipped active components

Methods for surface attachment of flipped active components

Packaging process tools and packaging methods for semiconductor dev...

Substrates with transferable chiplets

Methods for surface attachment of flipped active componenets

Packaging process tools and packaging methods for semiconductor dev...

Chip packaging fixture using magnetic field for self-alignment

Die bonding method utilizing rotary wafer table

Patents Applicationslast 30 patents

Chuck Design and Method for Wafer

Chuck Design and Method for Wafer

Chuck Design and Method for Wafer

Packaging Process Tools and Packaging Methods for Semiconductor Dev...

Packaging Process Tools and Packaging Methods for Semiconductor Dev...

SUBSTRATES WITH TRANSFERABLE CHIPLETS

METHODS FOR SURFACE ATTACHMENT OF FLIPPED ACTIVE COMPONENTS

DIE BONDING METHOD UTILIZING ROTARY WAFER TABLE

Small Chip Packaging Fixture And Method Of Using Magnetic Field Ass...