Means for monitoring the connection process

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CPC
H01L2224/759

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/759Means for monitoring the connection process

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,362,314
- Issue date Jul 15, 2025
- Tokyo Electron Limited
- Yuhei Matsuo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solder reflow apparatus
- Patent number 12,334,468
- Issue date Jun 17, 2025
- Samsung Electronics Co., Ltd.
- Youngja Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for model-predictive-control-based micro-assembly...
- Patent number 12,307,629
- Issue date May 20, 2025
- Xerox Corporation
- Ion Matei
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thermocompression apparatus and method for bonding electrical compo...
- Patent number 12,308,340
- Issue date May 20, 2025
- MB AUTOMATION GmbH & Co. KG
- Benjamin Holzner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses for handling microelectronic devices
- Patent number 12,251,841
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Kuan Wei Tseng
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
System for laser bonding of flip chip
- Patent number 12,237,296
- Issue date Feb 25, 2025
- PROTEC CO., LTD.
- Youn Sung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having through parts of different shapes
- Patent number 12,230,600
- Issue date Feb 18, 2025
- Fuji Electric Co., Ltd.
- Narumi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for actuating a bonding head
- Patent number 12,230,599
- Issue date Feb 18, 2025
- BESI Switzerland AG
- Markus Aebischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring electronic device
- Patent number 12,224,263
- Issue date Feb 11, 2025
- MICRAFT SYSTEM PLUS CO., LTD.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 12,199,058
- Issue date Jan 14, 2025
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING
Information Patent Grant
Reflow method and system
- Patent number 12,176,319
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Shiuan Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal compression bonder nozzle with vacuum relief features
- Patent number 12,176,318
- Issue date Dec 24, 2024
- Intel Corporation
- Mihir Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing device and manufacturing method
- Patent number 12,176,317
- Issue date Dec 24, 2024
- Shinkawa Ltd.
- Kohei Seyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,159,856
- Issue date Dec 3, 2024
- Kioxia Corporation
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 12,154,882
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Youngja Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting device and mounting method
- Patent number 12,154,811
- Issue date Nov 26, 2024
- Toray Engineering Co., Ltd.
- Yasushi Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding of bridge to multiple semiconductor chips
- Patent number 12,142,603
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control in the packaging of integrated circuits
- Patent number 12,144,065
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier for microelectronic assemblies having direct bonding
- Patent number 12,142,510
- Issue date Nov 12, 2024
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,136,604
- Issue date Nov 5, 2024
- Shinkawa Ltd.
- Hideharu Nihei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of chip transferring and device/module having gas guiding st...
- Patent number 12,106,981
- Issue date Oct 1, 2024
- MICRAFT SYSTEM PLUS CO., LTD.
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding head for mounting components and die bonder with such a bon...
- Patent number 12,046,490
- Issue date Jul 23, 2024
- Besi Switzerland AG
- Rene Kroehnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sintering device and method for manufacturing an electroni...
- Patent number 12,046,576
- Issue date Jul 23, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,978,717
- Issue date May 7, 2024
- Kioxia Corporation
- Yuuki Kuro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED with internally confined current injection area
- Patent number 11,978,825
- Issue date May 7, 2024
- Apple Inc.
- Kelly McGroddy
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Laser bonding system and laser bonding apparatus
- Patent number 11,973,053
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Geun Woo Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for transferring electronic device
- Patent number 11,973,054
- Issue date Apr 30, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method of fluidic assembly of microchips on a substrate
- Patent number 11,942,450
- Issue date Mar 26, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Melina Haupt
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRESSURE SINTERING METHOD AND CORRESPONDING PRESSURE SINTERING APPA...
- Publication number 20250239565
- Publication date Jul 24, 2025
- BOSCHMAN TECHNOLOGIES B.V.
- Franciscus Gerardus Johannes BOSCHMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING APPARATUS FOR SEMICONDUCTOR PACKAGING AND SEMICONDUCTO...
- Publication number 20250219012
- Publication date Jul 3, 2025
- SILICON BOX PTE. LTD.
- Byung Joon HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR REFLOW APPARATUS
- Publication number 20250219014
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Chaein MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING APPARATUS
- Publication number 20250201757
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Taejae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR AN EMBEDDED BRIDGING PACKAGE ARCHITECTURE
- Publication number 20250201690
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20250176105
- Publication date May 29, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING METHOD, AND RECORDING MEDIUM
- Publication number 20250118701
- Publication date Apr 10, 2025
- SHINKAWA LTD.
- Shinsuke Fukumoto
- G05 - CONTROLLING REGULATING
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Publication number 20250087625
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Young WANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REFLOW METHOD AND SYSTEM
- Publication number 20250070077
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Shiuan Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20250046750
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20250015030
- Publication date Jan 9, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE AND BONDING METHOD
- Publication number 20250015039
- Publication date Jan 9, 2025
- TORAY ENGINEERING CO., LTD.
- Tatsuya OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST-PLASMA CLEAN INFRARED IMAGE INSPECTION FOR OXIDELESS BONDING A...
- Publication number 20250006690
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Amram Eitan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMOCOMPRESSION APPARATUS AND METHOD FOR BONDING ELECTRICAL COMPO...
- Publication number 20240421118
- Publication date Dec 19, 2024
- MB Automation GmbH & Co. KG
- Benjamin Holzner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...
- Publication number 20240404988
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...
- Publication number 20240404989
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Bonding Semiconductor Devices
- Publication number 20240395766
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Tai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...
- Publication number 20240395767
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20240381531
- Publication date Nov 14, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP TRANSFERRING AND BONDING DEVICE
- Publication number 20240371664
- Publication date Nov 7, 2024
- ASTI GLOBAL INC., TAIWAN
- CHIEN-SHOU LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE DETECTION METHOD, PRESSURE DETECTION METHOD OF BONDING DEV...
- Publication number 20240313153
- Publication date Sep 19, 2024
- SAMSUNG DISPLAY CO., LTD.
- Futoshi YOSHIDA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BONDING TOOL OF FLIP CHIP LASER BONDING APPARATUS
- Publication number 20240258265
- Publication date Aug 1, 2024
- Mi Equipment Korea Co., Ltd
- Hyun Gu Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR TRANSFERRING ELECTRONIC DEVICE
- Publication number 20240213209
- Publication date Jun 27, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING
- Publication number 20240194634
- Publication date Jun 13, 2024
- ASMPT SINGAPORE PTE. LTD
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING TOOL WITH TILTABLE BOND HEAD FOR IMPROVED BONDING AND M...
- Publication number 20240194633
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Amram Eitan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION B...
- Publication number 20240186280
- Publication date Jun 6, 2024
- Intel Corporation
- Minglu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOUNTING AN ELECTRONIC COMPONENT ONTO A SUBSTRATE BY MEA...
- Publication number 20240170450
- Publication date May 23, 2024
- SAFRAN ELECTRONICS & DEFENSE
- Jean-Christophe RIOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES FOR HANDLING MICROELECTRONIC DEVICES
- Publication number 20240139940
- Publication date May 2, 2024
- Micron Technology, Inc.
- Kuan Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHO...
- Publication number 20240128230
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Sinyeop LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240072230
- Publication date Feb 29, 2024
- InnoLux Corporation
- Shun-Yuan HU
- H01 - BASIC ELECTRIC ELEMENTS

Means for monitoring the connection process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding apparatus and bonding method

Solder reflow apparatus

System and method for model-predictive-control-based micro-assembly...

Thermocompression apparatus and method for bonding electrical compo...

Apparatuses for handling microelectronic devices

System for laser bonding of flip chip

Semiconductor device having through parts of different shapes

Method for actuating a bonding head

Method for transferring electronic device

Selective micro device transfer to receiver substrate

Reflow method and system

Thermal compression bonder nozzle with vacuum relief features

Semiconductor device manufacturing device and manufacturing method

Method for manufacturing semiconductor device

Solder reflow apparatus and method of manufacturing an electronic d...

Mounting device and mounting method

Bonding of bridge to multiple semiconductor chips

Warpage control in the packaging of integrated circuits

Tools and systems for processing semiconductor devices, and methods...

Carrier for microelectronic assemblies having direct bonding

Bonding apparatus and bonding method

Method of chip transferring and device/module having gas guiding st...

Selective transfer of micro devices

Bonding head for mounting components and die bonder with such a bon...

Pressure sintering device and method for manufacturing an electroni...

Semiconductor manufacturing apparatus

LED with internally confined current injection area

Laser bonding system and laser bonding apparatus

Method for transferring electronic device

Device and method of fluidic assembly of microchips on a substrate

Patents Applicationslast 30 patents

PRESSURE SINTERING METHOD AND CORRESPONDING PRESSURE SINTERING APPA...

CHIP BONDING APPARATUS FOR SEMICONDUCTOR PACKAGING AND SEMICONDUCTO...

SEMICONDUCTOR REFLOW APPARATUS

CHIP BONDING APPARATUS

SYSTEM AND METHODS FOR AN EMBEDDED BRIDGING PACKAGE ARCHITECTURE

SELECTIVE TRANSFER OF MICRO DEVICES

BONDING APPARATUS, BONDING METHOD, AND RECORDING MEDIUM

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

REFLOW METHOD AND SYSTEM

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

BONDING DEVICE AND BONDING METHOD

POST-PLASMA CLEAN INFRARED IMAGE INSPECTION FOR OXIDELESS BONDING A...

THERMOCOMPRESSION APPARATUS AND METHOD FOR BONDING ELECTRICAL COMPO...

FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...

PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...

System and Method for Bonding Semiconductor Devices

TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...

SELECTIVE TRANSFER OF MICRO DEVICES

CHIP TRANSFERRING AND BONDING DEVICE

PRESSURE DETECTION METHOD, PRESSURE DETECTION METHOD OF BONDING DEV...

BONDING TOOL OF FLIP CHIP LASER BONDING APPARATUS

METHOD FOR TRANSFERRING ELECTRONIC DEVICE

HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING

DIE BONDING TOOL WITH TILTABLE BOND HEAD FOR IMPROVED BONDING AND M...

THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION B...

METHOD FOR MOUNTING AN ELECTRONIC COMPONENT ONTO A SUBSTRATE BY MEA...

APPARATUSES FOR HANDLING MICROELECTRONIC DEVICES

SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHO...

ELECTRONIC DEVICE