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H01L2224/778
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/778
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Patent Grant
Curtain airbag device mounting structure and curtain airbag deploym...
Patent number
10,723,306
Issue date
Jul 28, 2020
Toyota Jidosha Kabushiki Kaisha
Takamichi Komura
B22 - CASTING POWDER METALLURGY