Means for optical alignment

Industry

CPC
H01L2224/78753

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/78753Means for optical alignment

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding apparatus and alignment method
- Patent number 12,080,679
- Issue date Sep 3, 2024
- Shinkawa Ltd.
- Toru Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for linearly moving movable body relative to o...
- Patent number 11,410,866
- Issue date Aug 9, 2022
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for positioning first object in relation to secon...
- Patent number 11,139,193
- Issue date Oct 5, 2021
- Shinkawa Ltd.
- Tetsuya Utano
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Systems and methods of operating wire bonding machines including cl...
- Patent number 10,763,236
- Issue date Sep 1, 2020
- Kulicke and Soffa Industries, Inc.
- Peter J. Klaerner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method
- Patent number 10,600,754
- Issue date Mar 24, 2020
- Kaijo Corporation
- Hideki Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and method of estimating position of landing poin...
- Patent number 10,586,781
- Issue date Mar 10, 2020
- Shinkawa Ltd.
- Shigeru Hayata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, and alternator and power conversion device wh...
- Patent number 10,319,849
- Issue date Jun 11, 2019
- Hitachi Power Semiconductor Device, Ltd.
- Tetsuya Ishimaru
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Wire bonding apparatus and wire bonding method
- Patent number 10,262,968
- Issue date Apr 16, 2019
- Shinkawa Ltd.
- Shigeru Hayata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire-pull test location identification on a wire of a microelectron...
- Patent number 9,551,640
- Issue date Jan 24, 2017
- International Business Machines Corporation
- Mark T. W. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wedge bonder and a method of cleaning a wedge bonder
- Patent number 8,657,181
- Issue date Feb 25, 2014
- ASM Technology Singapore Pte. Ltd.
- Chi Wah Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus
- Patent number 8,651,355
- Issue date Feb 18, 2014
- Kaijo Corporation
- Akio Sugito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING APPARATUS, BONDING METHOD, AND COMPUTER READABLE STORAGE ME...
- Publication number 20240304592
- Publication date Sep 12, 2024
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...
- Publication number 20240105672
- Publication date Mar 28, 2024
- SHINKAWA LTD.
- Shigeru HAYATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND ALIGNMENT METHOD
- Publication number 20240105673
- Publication date Mar 28, 2024
- SHINKAWA LTD.
- Toru MAEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20230178510
- Publication date Jun 8, 2023
- SHINKAWA LTD.
- Shigeru HAYATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE AND METHOD FOR LINEARLY MOVING MOVABLE BODY RELATIVE TO OBJECT
- Publication number 20200411352
- Publication date Dec 31, 2020
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS OF OPERATING WIRE BONDING MACHINES INCLUDING CL...
- Publication number 20190214363
- Publication date Jul 11, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Peter J. Klaerner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING METHOD
- Publication number 20190164928
- Publication date May 30, 2019
- KAIJO CORPORATION
- Hideki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND WIRE BONDING METHOD
- Publication number 20180090464
- Publication date Mar 29, 2018
- SHINKAWA LTD.
- Shigeru HAYATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WEDGE BONDER AND A METHOD OF CLEANING A WEDGE BONDER
- Publication number 20130341377
- Publication date Dec 26, 2013
- Chi Wah CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20130256385
- Publication date Oct 3, 2013
- KAIJO CORPORATION
- Akio Sugito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Means for optical alignment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding apparatus and alignment method

Apparatus and method for linearly moving movable body relative to o...

Device and method for positioning first object in relation to secon...

Systems and methods of operating wire bonding machines including cl...

Bonding method

Bonding apparatus and method of estimating position of landing poin...

Semiconductor device, and alternator and power conversion device wh...

Wire bonding apparatus and wire bonding method

Wire-pull test location identification on a wire of a microelectron...

Wedge bonder and a method of cleaning a wedge bonder

Bonding apparatus

Patents Applicationslast 30 patents

BONDING APPARATUS, BONDING METHOD, AND COMPUTER READABLE STORAGE ME...

MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...

BONDING APPARATUS AND ALIGNMENT METHOD

WIRE BONDING APPARATUS

DEVICE AND METHOD FOR LINEARLY MOVING MOVABLE BODY RELATIVE TO OBJECT

SYSTEMS AND METHODS OF OPERATING WIRE BONDING MACHINES INCLUDING CL...

BONDING METHOD

WIRE BONDING APPARATUS AND WIRE BONDING METHOD

WEDGE BONDER AND A METHOD OF CLEANING A WEDGE BONDER

BONDING APPARATUS