Means for plating

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CPC
H01L2224/76189

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/76189Means for plating

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 7,955,873
- Issue date Jun 7, 2011
- Infineon Technologies AG
- Manfred Mengel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
- Publication number 20100248475
- Publication date Sep 30, 2010
- INFINEON TECHNOLOGIES AG
- Manfred Mengel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR