Means for retention of a lead in a hole

Industry

CPC
H05K2201/10878

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10878Means for retention of a lead in a hole

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic assembly with thermal fuse, an electric motor and a driv...
- Patent number 11,393,650
- Issue date Jul 19, 2022
- Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Wuerzburg
- Matthias Markert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical apparatus having entrapping structure
- Patent number 11,239,582
- Issue date Feb 1, 2022
- Tyco Electronics Japan G.K.
- Daijiro Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly with thermal fuse, an electric motor and a driv...
- Patent number 10,784,067
- Issue date Sep 22, 2020
- Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Wuerzburg
- Matthias Markert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control unit having press-fit structure
- Patent number 10,727,619
- Issue date Jul 28, 2020
- Mitsubishi Electric Corporation
- Kentaro Urimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Work machine
- Patent number 10,470,350
- Issue date Nov 5, 2019
- FUJI CORPORATION
- Satoru Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plug-in contact and method for producing a plug-in contact
- Patent number 10,461,454
- Issue date Oct 29, 2019
- Phoenix Contact GmbH & Co. KG
- Ralf Geske
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for the orientation of contact terminals on an electrical co...
- Patent number 10,292,272
- Issue date May 14, 2019
- Epcos AG
- Florian Velden
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Active electrical component
- Patent number 10,199,190
- Issue date Feb 5, 2019
- TE Connectivity Germany GmbH
- Wilfried Biehl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board assembly
- Patent number 10,116,072
- Issue date Oct 30, 2018
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Martin Zebhauser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldered interconnect for a printed circuit board having an angular...
- Patent number 10,096,915
- Issue date Oct 9, 2018
- MERCURY SYSTEMS, INC.
- Darryl J. McKenney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric connecting member and LED lamp using the same
- Patent number 9,696,023
- Issue date Jul 4, 2017
- LEELEDS LIGHTING (XIAMEN) CO., LTD.
- Linhua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for solderless electrical press-fit contacting of electrical...
- Patent number 9,357,656
- Issue date May 31, 2016
- Robert Bosch GmbH
- Patrik Patzner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High aspect ratio stacked MLCC design
- Patent number 8,988,857
- Issue date Mar 24, 2015
- Kemet Electronics Corporation
- John E. McConnell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light source device, method of assembling light source device, opti...
- Patent number 8,922,859
- Issue date Dec 30, 2014
- Ricoh Company, Ltd.
- Shuji Takamatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Universal press-fit connection for printed circuit boards
- Patent number 8,900,008
- Issue date Dec 2, 2014
- International Business Machines Corporation
- James A. Day
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Eye-of-the needle pin contact
- Patent number 8,747,124
- Issue date Jun 10, 2014
- Tyco Electronics Corporation
- David Allison Trout
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting diode module and lamp
- Patent number 8,733,974
- Issue date May 27, 2014
- CHICONY POWER TECHNOLOGY CO., LTD.
- Huan-Hsiang Huang
- F21 - LIGHTING
Information Patent Grant
Heat-release configuration, bracket for supporting heat-release pla...
- Patent number 8,670,239
- Issue date Mar 11, 2014
- Ricoh Company, Ltd.
- Takahiko Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Probe card assembly and kit, and methods of making same
- Patent number 8,373,428
- Issue date Feb 12, 2013
- FormFactor, Inc.
- Benjamin N. Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light source unit, backlight unit and liquid crystal display includ...
- Patent number 7,766,499
- Issue date Aug 3, 2010
- Samsung Electronics Co., Ltd.
- Jin Hee Park
- F21 - LIGHTING
Information Patent Grant
Holding member, mounting structure in which holding member is mount...
- Patent number 7,744,408
- Issue date Jun 29, 2010
- Tyco Electronics Japan G.K.
- Seiji Komatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact carriers (tiles) for populating larger substrates with spri...
- Patent number 7,714,598
- Issue date May 11, 2010
- FormFactor, Inc.
- Benjamin N. Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connection terminal for connection hole and engagement s...
- Patent number 7,661,996
- Issue date Feb 16, 2010
- Kabushiki Kaisha Tokai Rika Denki Seisakusho
- Shinji Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Probe card assembly and kit
- Patent number 7,616,016
- Issue date Nov 10, 2009
- FormFactor, Inc.
- Benjamin N. Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic spring contact elements
- Patent number 7,579,269
- Issue date Aug 25, 2009
- FormFactor, Inc.
- Benjamin N. Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transformer hook mount
- Patent number 7,564,335
- Issue date Jul 21, 2009
- Kevin Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socket for making with electronic component, particularly semicondu...
- Patent number 7,534,654
- Issue date May 19, 2009
- FormFactor, Inc.
- David V. Pedersen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Probe card assembly and kit
- Patent number 7,352,196
- Issue date Apr 1, 2008
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact carriers (tiles) for populating larger substrates with spri...
- Patent number 7,347,702
- Issue date Mar 25, 2008
- FormFactor, Inc.
- Benjamin N. Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resilient contact structures formed and then attached to a substrate
- Patent number 7,225,538
- Issue date Jun 5, 2007
- FormFactor, Inc.
- Benjamin Niles Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LEADFRAME MOUNTING WITH LEAD INSERTION FOR LEAD WALL BONDING
- Publication number 20240090130
- Publication date Mar 14, 2024
- Semiconductor Components Industries, LLC
- Chad CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY WITH THERMAL FUSE, AN ELECTRIC MOTOR AND A DRIV...
- Publication number 20200381205
- Publication date Dec 3, 2020
- BROSE FAHRZEUGTEILE GMBH & CO. KOMMANDITGESELLSCHAFT, WUERZBURG
- MATTHIAS MARKERT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical Apparatus
- Publication number 20200153129
- Publication date May 14, 2020
- Tyco Electronics Japan G.K.
- Daijiro Iwai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROL UNIT HAVING PRESS-FIT STRUCTURE
- Publication number 20190393629
- Publication date Dec 26, 2019
- Mitsubishi Electric Corporation
- Kentaro URIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUG-IN CONTACT AND METHOD FOR PRODUCING A PLUG-IN CONTACT
- Publication number 20180331447
- Publication date Nov 15, 2018
- Phoenix Contact GmbH & Co. KG
- Ralf GESKE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device for the Orientation of Contact Terminals on an Electrical Co...
- Publication number 20180160540
- Publication date Jun 7, 2018
- EPCOS AG
- Florian VELDEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20170317439
- Publication date Nov 2, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Martin Zebhauser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SOLDERLESS ELECTRICAL PRESS-FIT CONTACTING OF ELECTRICAL...
- Publication number 20140345124
- Publication date Nov 27, 2014
- ROBERT BOSCH GmbH
- Patrik PATZNER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB connector
- Publication number 20140315398
- Publication date Oct 23, 2014
- Knuerr GmbH
- Josef FEIGL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EYE-OF-THE NEEDLE PIN CONTACT
- Publication number 20140099839
- Publication date Apr 10, 2014
- Tyco Electronics Corporation
- David Allison Trout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL PRESS-FIT CONNECTION FOR PRINTED CIRCUIT BOARDS
- Publication number 20130316551
- Publication date Nov 28, 2013
- International Business Machines Corporation
- James A. Day
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING AN ELECTRONIC COMPONENT TO A PRINTED CIRCUIT BOARD
- Publication number 20130312257
- Publication date Nov 28, 2013
- International Business Machines Corporation
- James A. Day
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT FOR CLAMPING CHOKE TO CHASSIS
- Publication number 20130293331
- Publication date Nov 7, 2013
- CONTROL TECHNIQUES LTD
- Troy WINSAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE MODULE AND LAMP
- Publication number 20130271976
- Publication date Oct 17, 2013
- Chicony Power Technology Co., Ltd.
- Huan-Hsiang Huang
- F21 - LIGHTING
Information Patent Application
HIGH ASPECT RATIO STACKED MLCC DESIGN
- Publication number 20130146347
- Publication date Jun 13, 2013
- Kemet Electronics Corporation
- John E. McConnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT SOURCE DEVICE, METHOD OF ASSEMBLING LIGHT SOURCE DEVICE, OPTI...
- Publication number 20130063798
- Publication date Mar 14, 2013
- RICOH COMPANY, LTD.
- Shuji TAKAMATSU
- G02 - OPTICS
Information Patent Application
HEAT-RELEASE CONFIGURATION, BRACKET FOR SUPPORTING HEAT-RELEASE PLA...
- Publication number 20110164386
- Publication date Jul 7, 2011
- Takahiko Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROBE CARD ASSEMBLY AND KIT, AND METHODS OF MAKING SAME
- Publication number 20090291573
- Publication date Nov 26, 2009
- FormFactor, Inc.
- Benjamin N. Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Holding Member, Mounting Structure In Which Holding Member Is Mount...
- Publication number 20090190318
- Publication date Jul 30, 2009
- Seiji Komatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Auto-cling leads of electric device
- Publication number 20090161333
- Publication date Jun 25, 2009
- Kevin Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTION TERMINAL FOR CONNECTION HOLE AND ENGAGEMENT S...
- Publication number 20080280504
- Publication date Nov 13, 2008
- KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO
- Shinji TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTACT CARRIERS (TILES) FOR POPULATING LARGER SUBSTRATES WITH SPRI...
- Publication number 20080231305
- Publication date Sep 25, 2008
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Press-fit pin and board structure
- Publication number 20080207015
- Publication date Aug 28, 2008
- Hitachi, Ltd.
- Junya Sueyoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROBE CARD ASSEMBLY AND KIT
- Publication number 20080180121
- Publication date Jul 31, 2008
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT SOURCE UNIT, BACKLIGHT UNIT AND LIQUID CRYSTAL DISPLAY INCLUD...
- Publication number 20080106898
- Publication date May 8, 2008
- Samsung Electronics Co., Ltd.
- Jin Hee PARK
- G02 - OPTICS
Information Patent Application
Socket For Making With Electronic Component, Particularly Semicondu...
- Publication number 20070285114
- Publication date Dec 13, 2007
- FormFactor, Inc.
- David V. Pedersen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary F...
- Publication number 20070228110
- Publication date Oct 4, 2007
- FormFactor, Inc.
- Benjamin N. Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Probe For Semiconductor Devices
- Publication number 20070176619
- Publication date Aug 2, 2007
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead terminal leadout type electronic component, manufacturing meth...
- Publication number 20070138373
- Publication date Jun 21, 2007
- Sharp Kabushiki Kaisha
- Hiroshi Yoshida
- G01 - MEASURING TESTING
Information Patent Application
Contact Carriers (Tiles) For Populating Larger Substrates With Spri...
- Publication number 20070075715
- Publication date Apr 5, 2007
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Means for retention of a lead in a hole

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic assembly with thermal fuse, an electric motor and a driv...

Electrical apparatus having entrapping structure

Electronic assembly with thermal fuse, an electric motor and a driv...

Control unit having press-fit structure

Work machine

Plug-in contact and method for producing a plug-in contact

Device for the orientation of contact terminals on an electrical co...

Active electrical component

Printed circuit board assembly

Soldered interconnect for a printed circuit board having an angular...

Electric connecting member and LED lamp using the same

Method for solderless electrical press-fit contacting of electrical...

High aspect ratio stacked MLCC design

Light source device, method of assembling light source device, opti...

Universal press-fit connection for printed circuit boards

Eye-of-the needle pin contact

Light emitting diode module and lamp

Heat-release configuration, bracket for supporting heat-release pla...

Probe card assembly and kit, and methods of making same

Light source unit, backlight unit and liquid crystal display includ...

Holding member, mounting structure in which holding member is mount...

Contact carriers (tiles) for populating larger substrates with spri...

Electrical connection terminal for connection hole and engagement s...

Probe card assembly and kit

Microelectronic spring contact elements

Transformer hook mount

Socket for making with electronic component, particularly semicondu...

Probe card assembly and kit

Contact carriers (tiles) for populating larger substrates with spri...

Resilient contact structures formed and then attached to a substrate

Patents Applicationslast 30 patents

LEADFRAME MOUNTING WITH LEAD INSERTION FOR LEAD WALL BONDING

ELECTRONIC ASSEMBLY WITH THERMAL FUSE, AN ELECTRIC MOTOR AND A DRIV...

Electrical Apparatus

CONTROL UNIT HAVING PRESS-FIT STRUCTURE

PLUG-IN CONTACT AND METHOD FOR PRODUCING A PLUG-IN CONTACT

Device for the Orientation of Contact Terminals on an Electrical Co...

PRINTED CIRCUIT BOARD ASSEMBLY

METHOD FOR SOLDERLESS ELECTRICAL PRESS-FIT CONTACTING OF ELECTRICAL...

PCB connector

EYE-OF-THE NEEDLE PIN CONTACT

UNIVERSAL PRESS-FIT CONNECTION FOR PRINTED CIRCUIT BOARDS

CONNECTING AN ELECTRONIC COMPONENT TO A PRINTED CIRCUIT BOARD

COMPONENT FOR CLAMPING CHOKE TO CHASSIS

LIGHT EMITTING DIODE MODULE AND LAMP

HIGH ASPECT RATIO STACKED MLCC DESIGN

LIGHT SOURCE DEVICE, METHOD OF ASSEMBLING LIGHT SOURCE DEVICE, OPTI...

HEAT-RELEASE CONFIGURATION, BRACKET FOR SUPPORTING HEAT-RELEASE PLA...

PROBE CARD ASSEMBLY AND KIT, AND METHODS OF MAKING SAME

Holding Member, Mounting Structure In Which Holding Member Is Mount...

Auto-cling leads of electric device

ELECTRICAL CONNECTION TERMINAL FOR CONNECTION HOLE AND ENGAGEMENT S...

CONTACT CARRIERS (TILES) FOR POPULATING LARGER SUBSTRATES WITH SPRI...

Press-fit pin and board structure

PROBE CARD ASSEMBLY AND KIT

LIGHT SOURCE UNIT, BACKLIGHT UNIT AND LIQUID CRYSTAL DISPLAY INCLUD...

Socket For Making With Electronic Component, Particularly Semicondu...

Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary F...

Probe For Semiconductor Devices

Lead terminal leadout type electronic component, manufacturing meth...

Contact Carriers (Tiles) For Populating Larger Substrates With Spri...