Lead terminal leadout type electronic component, manufacturing method therefor and electronic equipment

Abstract

The lead terminal leadout type electronic component of the present invention has a component main body and a plurality of lead terminals led out of the component main body and is mounted on a mount board in a floating state in which the lead terminals are inserted into corresponding insertion holes of the mount board partway along lengths thereof. At least two lead terminals of the plurality of lead terminals are more largely deformed than opening dimensions of the corresponding insertion holes mutually oppositely in a direction along a surface of the mount board in a natural state. When the plurality of lead terminals are inserted into the corresponding insertion holes, the electronic component stands upright with respect to the mount board due to spring forces of said at least two lead terminals which is going to return to the natural state.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will become more fully understood from the detailed description given hereinbelow and the accompanying drawings which are given by way of illustration only, and thus are not limitative of the present invention, and wherein:

FIG. 1A is a left side view of a lead frame type remote control photodetection unit of one embodiment of the present invention;

FIG. 1B is a front view of the remote control photodetection unit;

FIG. 1C is a bottom view of the remote control photodetection unit;

FIG. 1D is an enlarged view of the lead terminal of FIG. 1A;

FIG. 1E is an enlarged view of the lead terminal of FIG. 1B;

FIG. 1F is an enlarged view of the lead terminal of FIG. 1C;

FIG. 2 is a schematic view showing the lead frame type remote control photodetection unit of the present invention mounted on a mount board;

FIGS. 3A through 3C are schematic views showing various embodiments of the present invention;

FIGS. 4A through 4C are schematic views showing further various embodiments of the present invention;

FIG. 5 is a view (after a wire bonding step) showing the structure of a general lead frame type remote control photodetection unit;

FIG. 6 is a view (after a packaging step) showing the structure of the general lead frame type remote control photodetection unit;

FIGS. 7A through 7E are a left side view, a front view, a right side view, a top view and a bottom view, respectively, of a prior art lead frame type remote control photodetection unit;

FIG. 8A is a view showing the front face of general equipment equipped with a remote control photodetection unit viewed from the front; and

FIG. 8B is a view showing the inside of the equipment viewed from the right side.

Claims

1. A lead terminal leadout type electronic component comprising: a component main body; anda plurality of lead terminals led out of the component main body, whereinthe electronic component is to be mounted on a mount board in a floating state in which the lead terminals are inserted into corresponding insertion holes of the mount board partway along lengths of the lead terminals, respectively, andat least two lead terminals of the plurality of lead terminals are more largely deformed than opening dimensions of the corresponding insertion holes mutually oppositely in a direction along a surface of the mount board in a natural state so that, when the plurality of lead terminals are inserted into the corresponding insertion holes, the electronic component stands upright with respect to the mount board due to spring forces of said at least two lead terminals which is going to return to the natural state.

2. The lead terminal leadout type electronic component as claimed in claim 1, wherein deformations of said at least two lead terminals in the natural state are comprised of bent portions which are formed mutually oppositely in a back-and-forth direction partway along lengths of the lead terminals, respectively.

3. The lead terminal leadout type electronic component as claimed in claim 2, wherein portions located on a terminal end side with respect to the bent portions of said at least two lead terminals are bent with respect to the bent portions so as to approach the corresponding insertion holes.

4. The lead terminal leadout type electronic component as claimed in claim 2, wherein the bent portions have an approximate dogleg-like shape, an approximate bracket-like shape or an approximate U-figured shape.

5. The lead terminal leadout type electronic component as claimed in claim 2, wherein the bent portions serve as insertion limiting positions of the lead terminals in the insertion holes when the plurality of lead terminals are inserted into the respective corresponding insertion holes.

6. A lead terminal leadout type electronic component mounting method for mounting the lead terminal leadout type electronic component of claim 2 on the mount board in a state in which the lead terminals are inserted in the corresponding insertion holes of the mount board partway along lengths of the lead terminals, respectively, wherein, by adjusting a distance between the bent portion and the component main body when the bent portion is formed on said at least two lead terminals, a height position of the component main body from the mount board after mounting is variably set.

7. The lead terminal leadout type electronic component as claimed in claim 1, wherein a portion of a width greater than that of a remaining part of each of the lead terminals is provided partway along the length of the lead terminal, and the portion serve as an insertion limiting position of the lead terminal in the insertion hole.

8. The lead terminal leadout type electronic component as claimed in claim 1, wherein a portion of a thickness greater than that of a remaining part of each of the lead terminals is provided partway along the length of the lead terminal, and the portion serve as an insertion limiting position of the lead terminal in the insertion hole.

9. Electronic equipment equipped with the lead terminal leadout type electronic component claimed in claim 1.