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CPC
H01L2224/75161
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/75161
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Patents Grants
last 30 patents
Patents Applications
last 30 patents
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Patent Application
DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD...
Publication number
20230090693
Publication date
Mar 23, 2023
Fasford Technology Co., Ltd.
Geonju LEE
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...
Publication number
20140231492
Publication date
Aug 21, 2014
PANASONIC CORPORATION
Tsubasa Saeki
H01 - BASIC ELECTRIC ELEMENTS