Means for supplying the connector to be connected in the bonding apparatus

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H01L2224/786

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/786Means for supplying the connector to be connected in the bonding apparatus

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus for bonding wire
- Patent number 12,154,883
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Daewoong Heo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
In-process wire bond testing using wire bonding apparatus
- Patent number 12,148,730
- Issue date Nov 19, 2024
- Atieva, Inc.
- Ben Carlson-Sypek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for tool mark free stitch bonding
- Patent number 12,142,595
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Aldrin Quinones Garing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus and method for manufacturing semiconductor d...
- Patent number 12,107,070
- Issue date Oct 1, 2024
- Shinkawa Ltd.
- Hiroaki Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus, method for measuring opening amount of clam...
- Patent number 12,087,725
- Issue date Sep 10, 2024
- Shinkawa Ltd.
- Toshihiko Toyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and alignment method
- Patent number 12,080,679
- Issue date Sep 3, 2024
- Shinkawa Ltd.
- Toru Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip bonding apparatus and securing assembly therefor
- Patent number 12,074,133
- Issue date Aug 27, 2024
- GUANGZHOU AIFO LIGHT COMMUNICATION TECHNOLOGY COMPANY LTD.
- Guoqiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus
- Patent number 12,057,428
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Jongeun Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic material and wire bonding capillary
- Patent number 11,964,915
- Issue date Apr 23, 2024
- Industrial Technology Research Institute
- Tien-Heng Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 11,961,819
- Issue date Apr 16, 2024
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 11,908,827
- Issue date Feb 20, 2024
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of detecting bonding between a bonding wire and a bonding l...
- Patent number 11,581,285
- Issue date Feb 14, 2023
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus
- Patent number 11,521,949
- Issue date Dec 6, 2022
- Samsung Electronics Co., Ltd.
- Jongeun Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus and manufacturing method for semiconductor a...
- Patent number 11,450,640
- Issue date Sep 20, 2022
- Shinkawa Ltd.
- Shinsuke Tei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of vertically vibrating a bonding arm
- Patent number 11,302,667
- Issue date Apr 12, 2022
- Kaijo Corporation
- Riki Jindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for calibrating wire clamp device
- Patent number 11,257,781
- Issue date Feb 22, 2022
- Shinkawa Ltd.
- Noboru Fujino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus threading system
- Patent number 11,239,197
- Issue date Feb 1, 2022
- ASM Technology Singapore Pte. Ltd.
- Keng Yew Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for establishing a wire connection as well as a c...
- Patent number 11,217,558
- Issue date Jan 4, 2022
- PAC Tech-Packaging Technologies GmbH
- Andrej Kolbasow
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus with replaceable bonding tool
- Patent number 11,205,634
- Issue date Dec 21, 2021
- ASM Technology Singapore Pte. Ltd.
- Keng Yew Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Formation of bonding wire vertical interconnects
- Patent number 11,145,620
- Issue date Oct 12, 2021
- ASM Technology Singapore Pte. Ltd.
- Mow Huat Goh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding tool including a wedge tool
- Patent number 11,121,114
- Issue date Sep 14, 2021
- Fuji Electric Co., Ltd.
- Takanori Sugiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for establishing a bonding connection and transducer therefor
- Patent number 11,007,601
- Issue date May 18, 2021
- Hesse GmbH
- Matthias Hunstig
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire clamp apparatus calibration method and wire bonding apparatus
- Patent number 11,004,822
- Issue date May 11, 2021
- Shinkawa Ltd.
- Yohei Uchida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 10,896,892
- Issue date Jan 19, 2021
- Fuji Electric Co., Ltd.
- Fumihiko Momose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive pattern printer for downhole tools
- Patent number 10,799,908
- Issue date Oct 13, 2020
- Halliburton Energy Services, Inc.
- Robert L. Reynolds
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Clamping system, wire bonding machine, and method for bonding wires
- Patent number 10,770,423
- Issue date Sep 8, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Qi Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for replacing capillary
- Patent number 10,692,834
- Issue date Jun 23, 2020
- Samsung Electronics Co., Ltd.
- Youngsik Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire having a silver alloy core, wire bonding method using...
- Patent number 10,658,326
- Issue date May 19, 2020
- Samsung Electronics Co., Ltd.
- Won-Gil Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control wire clamp and loop systems and methods
- Patent number 10,622,328
- Issue date Apr 14, 2020
- POLYGROUP MACAU LIMITED (BVI)
- Victor Hugo Ocegueda Gallaga
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Grant
Methods of operating a wire bonding machine to improve clamping of...
- Patent number 10,541,223
- Issue date Jan 21, 2020
- Kulicke and Soffa Industries, Inc.
- Wong Hing Kuong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL
- Publication number 20240379613
- Publication date Nov 14, 2024
- SHINKAWA LTD.
- Hiroshi MUNAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND SEMICONDUCTOR PACKAGE MANUFACTURED USING...
- Publication number 20240363581
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Daewoong HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE PATH PLATE HAVING ENHANCED DURABILITY FOR WIRE BONDING
- Publication number 20240347500
- Publication date Oct 17, 2024
- ASMPT Singapore Pte. Ltd.
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING
- Publication number 20240194634
- Publication date Jun 13, 2024
- ASMPT SINGAPORE PTE. LTD
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND ALIGNMENT METHOD
- Publication number 20240105673
- Publication date Mar 28, 2024
- SHINKAWA LTD.
- Toru MAEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR BONDING WIRE
- Publication number 20240038717
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Daewoong Heo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE JIG AND TABBING APPARATUS INCLUDING THE SAME
- Publication number 20230378391
- Publication date Nov 23, 2023
- Hanwha Corporation
- Min Kyo Jung
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...
- Publication number 20230282613
- Publication date Sep 7, 2023
- SHINKAWA LTD.
- Toshihiko Toyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE CLAMP AND WIRE BONDING APPARATUS INCLUDING THE SAME
- Publication number 20230230952
- Publication date Jul 20, 2023
- Samsung Electronics Co., Ltd.
- Jaehyeok HEO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
IN-PROCESS WIRE BOND TESTING
- Publication number 20230215835
- Publication date Jul 6, 2023
- Atieva, Inc.
- Ben Carlson-Sypek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF DETECTING BONDING BETWEEN A BONDING WIRE AND A BONDING L...
- Publication number 20230170325
- Publication date Jun 1, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Gary S. Gillotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR D...
- Publication number 20220328450
- Publication date Oct 13, 2022
- SHINKAWA LTD.
- Hiroaki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS, METHOD FOR MEASURING OPENING AMOUNT OF CLAM...
- Publication number 20220310552
- Publication date Sep 29, 2022
- SHINKAWA LTD.
- Toshihiko TOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEV...
- Publication number 20220208721
- Publication date Jun 30, 2022
- SHINKAWA LTD.
- Hiroaki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ceramic material and wire bonding capillary
- Publication number 20220204409
- Publication date Jun 30, 2022
- Industrial Technology Research Institute
- Tien-Heng HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR TOOL MARK FREE STITCH BONDING
- Publication number 20220199571
- Publication date Jun 23, 2022
- Skyworks Solutions, Inc.
- Aldrin Quinones GARING
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20220013491
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- JONGEUN LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS THREADING SYSTEM
- Publication number 20210159205
- Publication date May 27, 2021
- ASM Technology Singapore Pte Ltd
- Keng Yew SONG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF DETECTING BONDING BETWEEN A BONDING WIRE AND A BONDING L...
- Publication number 20200388589
- Publication date Dec 10, 2020
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF BONDING WIRE VERTICAL INTERCONNECTS
- Publication number 20200286855
- Publication date Sep 10, 2020
- ASM Technology Singapore Pte Ltd
- Mow Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND MANUFACTURING METHOD FOR SEMICONDUCTOR A...
- Publication number 20200203307
- Publication date Jun 25, 2020
- SHINKAWA LTD.
- Shinsuke TEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR ESTABLISHING A WIRE CONNECTION AS WELL AS A C...
- Publication number 20200161273
- Publication date May 21, 2020
- PAC TECH - PACKAGING TECHNOLOGIES GMBH
- ANDREJ KOLBASOW
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL HEAD CAPILLARY DESIGN FOR VERTICAL WIRE BOND
- Publication number 20200118961
- Publication date Apr 16, 2020
- Intel Corporation
- Yuhong CAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR WIRE PREPARATION
- Publication number 20190372294
- Publication date Dec 5, 2019
- The Charles Stark Draper Laboratory, Inc.
- Mitchell W. Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE CLAMP DEVICE CALIBRATION METHOD AND WIRE BONDING DEVICE
- Publication number 20190279957
- Publication date Sep 12, 2019
- SHINKAWA LTD.
- Yohei UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REPLACING CAPILLARY
- Publication number 20180294245
- Publication date Oct 11, 2018
- Samsung Electronics Co., Ltd.
- YOUNGSIK KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS
- Publication number 20180229329
- Publication date Aug 16, 2018
- Samsung Electronics Co., Ltd.
- MYUNG IL KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20180151532
- Publication date May 31, 2018
- KAIJO CORPORATION
- Riki JINDO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING METHODS AND SYSTEMS INCORPORATING METAL NANOPARTICLES
- Publication number 20180138143
- Publication date May 17, 2018
- Lockheed Martin Corporation
- Randall Mark STOLTENBERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND WIRE BONDING METHOD
- Publication number 20180090464
- Publication date Mar 29, 2018
- SHINKAWA LTD.
- Shigeru HAYATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Means for supplying the connector to be connected in the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus for bonding wire

In-process wire bond testing using wire bonding apparatus

Apparatus and methods for tool mark free stitch bonding

Wire bonding apparatus and method for manufacturing semiconductor d...

Wire bonding apparatus, method for measuring opening amount of clam...

Bonding apparatus and alignment method

Chip bonding apparatus and securing assembly therefor

Wire bonding apparatus

Ceramic material and wire bonding capillary

Wire bonding apparatus

Wire bonding apparatus

Methods of detecting bonding between a bonding wire and a bonding l...

Wire bonding apparatus

Wire bonding apparatus and manufacturing method for semiconductor a...

Method of vertically vibrating a bonding arm

Method for calibrating wire clamp device

Wire bonding apparatus threading system

Method and device for establishing a wire connection as well as a c...

Bonding apparatus with replaceable bonding tool

Formation of bonding wire vertical interconnects

Wire bonding tool including a wedge tool

Device for establishing a bonding connection and transducer therefor

Wire clamp apparatus calibration method and wire bonding apparatus

Wire bonding apparatus

Electrically conductive pattern printer for downhole tools

Clamping system, wire bonding machine, and method for bonding wires

Method for replacing capillary

Bonding wire having a silver alloy core, wire bonding method using...

Control wire clamp and loop systems and methods

Methods of operating a wire bonding machine to improve clamping of...

Patents Applicationslast 30 patents

PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL

WIRE BONDING APPARATUS AND SEMICONDUCTOR PACKAGE MANUFACTURED USING...

WIRE PATH PLATE HAVING ENHANCED DURABILITY FOR WIRE BONDING

HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING

BONDING APPARATUS AND ALIGNMENT METHOD

APPARATUS FOR BONDING WIRE

WIRE JIG AND TABBING APPARATUS INCLUDING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...

WIRE CLAMP AND WIRE BONDING APPARATUS INCLUDING THE SAME

IN-PROCESS WIRE BOND TESTING

METHODS OF DETECTING BONDING BETWEEN A BONDING WIRE AND A BONDING L...

WIRE BONDING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR D...

WIRE BONDING APPARATUS, METHOD FOR MEASURING OPENING AMOUNT OF CLAM...

WIRE BONDING APPARATUS, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEV...

Ceramic material and wire bonding capillary

APPARATUS AND METHODS FOR TOOL MARK FREE STITCH BONDING

WIRE BONDING APPARATUS

WIRE BONDING APPARATUS THREADING SYSTEM

METHODS OF DETECTING BONDING BETWEEN A BONDING WIRE AND A BONDING L...

FORMATION OF BONDING WIRE VERTICAL INTERCONNECTS

WIRE BONDING APPARATUS AND MANUFACTURING METHOD FOR SEMICONDUCTOR A...

METHOD AND DEVICE FOR ESTABLISHING A WIRE CONNECTION AS WELL AS A C...

DUAL HEAD CAPILLARY DESIGN FOR VERTICAL WIRE BOND

APPARATUS AND METHOD FOR WIRE PREPARATION

WIRE CLAMP DEVICE CALIBRATION METHOD AND WIRE BONDING DEVICE

METHOD FOR REPLACING CAPILLARY

BONDING APPARATUS

WIRE BONDING APPARATUS

WIRE BONDING METHODS AND SYSTEMS INCORPORATING METAL NANOPARTICLES

WIRE BONDING APPARATUS AND WIRE BONDING METHOD