Means for transporting the components to be connected

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CPC
H01L2224/7865

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/7865Means for transporting the components to be connected

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Chip bonding apparatus and securing assembly therefor
- Patent number 12,074,133
- Issue date Aug 27, 2024
- GUANGZHOU AIFO LIGHT COMMUNICATION TECHNOLOGY COMPANY LTD.
- Guoqiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of operating a wire bonding machine to improve clamping of...
- Patent number 10,541,223
- Issue date Jan 21, 2020
- Kulicke and Soffa Industries, Inc.
- Wong Hing Kuong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conveyor apparatus and method for transporting leadframe
- Patent number 10,020,214
- Issue date Jul 10, 2018
- Texas Instruments Incorporated
- Nageswararau Krishnan
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method for assembling a microelectronic chip element on a wire elem...
- Patent number 9,953,953
- Issue date Apr 24, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module comprising a semiconductor chip
- Patent number 9,379,046
- Issue date Jun 28, 2016
- Infineon Technologies AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Frame feeding system and frame feeding method
- Patent number 8,965,572
- Issue date Feb 24, 2015
- Hitachi High-Tech Instruments Co., Ltd.
- Tatsuyuki Ohkubo
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of manufacturing semiconductor device, and wire bonder
- Patent number 8,881,966
- Issue date Nov 11, 2014
- Renesas Electronics Corporation
- Kazuyuki Misumi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Module comprising a semiconductor chip
- Patent number 8,633,102
- Issue date Jan 21, 2014
- Infineon Technologies AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 8,368,191
- Issue date Feb 5, 2013
- Renesas Electronics Corporation
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module comprising a semiconductor chip
- Patent number 8,237,268
- Issue date Aug 7, 2012
- Infineon Technologies AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and device for producing a bondable area region on a carrier
- Patent number 8,167,187
- Issue date May 1, 2012
- Infineon Technologies AG
- Reinhold Bayerer
- B24 - GRINDING POLISHING
Information Patent Grant
Bonding apparatus and wire bonding method
- Patent number 7,975,901
- Issue date Jul 12, 2011
- Shinkawa Ltd.
- Toru Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for manufacturing semiconductor package for wide lead fra...
- Patent number 7,934,632
- Issue date May 3, 2011
- STS Semiconductor & Telecommunications Co., Ltd.
- Sun Ha Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and method for cleaning tip of a bonding tool
- Patent number 7,893,383
- Issue date Feb 22, 2011
- Kabushiki Kaisha Shinkawa
- Kazuo Fujita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 7,847,376
- Issue date Dec 7, 2010
- Renesas Electronics Corporation
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device and method for a bonding apparatus
- Patent number 7,848,022
- Issue date Dec 7, 2010
- Kabushiki Kaisha Shinkawa
- Shigeru Hayata
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and an information management system therefor
- Patent number 7,832,648
- Issue date Nov 16, 2010
- Oki Semiconductor Co., Ltd.
- Isao Kudo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device handler for a bonding apparatus
- Patent number 7,677,431
- Issue date Mar 16, 2010
- ASM Technology Singapore Pte. Ltd.
- Yam Mo Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and method
- Patent number 7,576,297
- Issue date Aug 18, 2009
- Kabushiki Kaisha Shinkawa
- Kazuo Fujita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and an information management system therefor
- Patent number 7,503,479
- Issue date Mar 17, 2009
- Oki Electric Industry Co., Ltd.
- Isao Kudo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wire bonding apparatus and method for clamping a wire
- Patent number 7,481,351
- Issue date Jan 27, 2009
- Samsung Electronics Co., Ltd.
- Tae-Hyun Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,364,950
- Issue date Apr 29, 2008
- Kabushiki Kaisha Toshiba
- Norihide Funato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and an information management system therefor
- Patent number 7,299,973
- Issue date Nov 27, 2007
- Oki Electric Industry Co., Ltd.
- Isao Kudo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,230,322
- Issue date Jun 12, 2007
- Kabushiki Kaisha Toshiba
- Norihide Funato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device having resin package and method of producing the same
- Patent number 7,144,754
- Issue date Dec 5, 2006
- Fujitsu Limited
- Yoshiyuki Yoneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged IC using insulated wire
- Patent number 7,138,328
- Issue date Nov 21, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and an information management system therefore
- Patent number 7,137,557
- Issue date Nov 21, 2006
- Oki Electric Industry Co., Ltd.
- Isao Kudo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 6,903,450
- Issue date Jun 7, 2005
- Kabushiki Kaisha Toshiba
- Norihide Funato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and an information management system thereof
- Patent number 6,896,186
- Issue date May 24, 2005
- Oki Electric Industry Co. Ltd.
- Isao Kudo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device having a multilayer wiring structure and pad e...
- Patent number 6,890,857
- Issue date May 10, 2005
- Renesas Technology Corp.
- Shigeru Harada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL
- Publication number 20240379613
- Publication date Nov 14, 2024
- SHINKAWA LTD.
- Hiroshi MUNAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING
- Publication number 20240194634
- Publication date Jun 13, 2024
- ASMPT SINGAPORE PTE. LTD
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20180229329
- Publication date Aug 16, 2018
- Samsung Electronics Co., Ltd.
- MYUNG IL KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conveyor Apparatus And Method For Transporting Leadframe
- Publication number 20170309506
- Publication date Oct 26, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Nageswararau Krishnan
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Module Comprising a Semiconductor Chip
- Publication number 20140110829
- Publication date Apr 24, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Frame Feeding System and Frame Feeding Method
- Publication number 20130017040
- Publication date Jan 17, 2013
- Hitachi High-Tech Instruments Co., Ltd.
- Tatsuyuki OHKUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module Comprising a Semiconductor Chip
- Publication number 20120276693
- Publication date Nov 1, 2012
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20110068450
- Publication date Mar 24, 2011
- Renesas Electronics Corporation
- NORIYUKI TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND WIRE BONDING METHOD
- Publication number 20100294435
- Publication date Nov 25, 2010
- SHINKAWA LTD.
- Toru MAEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND WIRE BONDER
- Publication number 20100203681
- Publication date Aug 12, 2010
- RENEASAS TECHNOLOGY CORP.
- KAZUYUKI MISUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for Manufacturing Semiconductor Package for Wide Lead Fra...
- Publication number 20090269889
- Publication date Oct 29, 2009
- STS SEMICONDUCTOR AND TELECOMMUNICATIONS CO., LTD.
- Sun Ha HWANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Imaging device and method for a bonding apparatus
- Publication number 20090124028
- Publication date May 14, 2009
- KABUSHIKI KAISHA SHINKAWA
- Shigeru Hayata
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Imaging device and method for a bonding apparatus
- Publication number 20090059361
- Publication date Mar 5, 2009
- KABUSHIKI KAISHA SHINKAWA
- Shigeru Hayata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20090020860
- Publication date Jan 22, 2009
- RENESAS TECHNOLOGY CORP.
- Noriyuki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module comprising a semiconductor chip
- Publication number 20080230928
- Publication date Sep 25, 2008
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICE HANDLER FOR A BONDING APPARATUS
- Publication number 20080093004
- Publication date Apr 24, 2008
- ASM Technology Singapore Pte Ltd
- Yam Mo WONG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND AN INFORMATION MANAGEMENT SYSTEM THEREFOR
- Publication number 20080083996
- Publication date Apr 10, 2008
- Oki Electric Industry Co., Ltd.
- Isao Kudo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Bonding apparatus and method for cleaning tip of a bonding tool
- Publication number 20080023028
- Publication date Jan 31, 2008
- KABUSHIKI KAISHA SHINKAWA
- Kazuo Fujita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND AN INFORMATION MANAGEMENT SYSTEM THEREFOR
- Publication number 20080017700
- Publication date Jan 24, 2008
- Oki Electric Industry Co., Ltd.
- Isao Kudo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR HAVING A BONDING WIRE AND PROCESS
- Publication number 20070284415
- Publication date Dec 13, 2007
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20070052075
- Publication date Mar 8, 2007
- Norihide Funato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding apparatus and method
- Publication number 20070000878
- Publication date Jan 4, 2007
- KABUSHIKI KAISHA SHINKAWA
- Kazuo Fujita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and device for producing a bondable area region on a carrier
- Publication number 20060261133
- Publication date Nov 23, 2006
- eupec Europaische Gesellschaft fur Leistungshalbleiter mbH
- Reinhold Bayerer
- B24 - GRINDING POLISHING
Information Patent Application
Apparatus and method for indexing of substrates and lead frames
- Publication number 20050284915
- Publication date Dec 29, 2005
- David T. Beatson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20050212101
- Publication date Sep 29, 2005
- Norihide Funato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser cleaning system for a wire bonding machine
- Publication number 20050184133
- Publication date Aug 25, 2005
- Kulicke & Soffa Investments, Inc.
- Horst Clauberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonding apparatus and method for clamping a wire
- Publication number 20050133563
- Publication date Jun 23, 2005
- Tae-Hyun Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and an information management system therefor
- Publication number 20040256463
- Publication date Dec 23, 2004
- ISAO KUDO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Device having resin package and method of producing the same
- Publication number 20040219719
- Publication date Nov 4, 2004
- FUJITSU LIMITED
- Yoshiyuki Yoneda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Packaged IC using insulated wire
- Publication number 20040217458
- Publication date Nov 4, 2004
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS

Means for transporting the components to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip bonding apparatus and securing assembly therefor

Methods of operating a wire bonding machine to improve clamping of...

Conveyor apparatus and method for transporting leadframe

Method for assembling a microelectronic chip element on a wire elem...

Module comprising a semiconductor chip

Frame feeding system and frame feeding method

Method of manufacturing semiconductor device, and wire bonder

Module comprising a semiconductor chip

Semiconductor device and manufacturing method of the same

Module comprising a semiconductor chip

Method and device for producing a bondable area region on a carrier

Bonding apparatus and wire bonding method

Apparatus for manufacturing semiconductor package for wide lead fra...

Bonding apparatus and method for cleaning tip of a bonding tool

Semiconductor device and manufacturing method of the same

Imaging device and method for a bonding apparatus

Semiconductor device and an information management system therefor

Electronic device handler for a bonding apparatus

Bonding apparatus and method

Semiconductor device and an information management system therefor

Wire bonding apparatus and method for clamping a wire

Semiconductor device and method of manufacturing the same

Semiconductor device and an information management system therefor

Semiconductor device and method of manufacturing the same

Device having resin package and method of producing the same

Packaged IC using insulated wire

Semiconductor device and an information management system therefore

Semiconductor device and method of manufacturing the same

Semiconductor device and an information management system thereof

Semiconductor device having a multilayer wiring structure and pad e...

Patents Applicationslast 30 patents

PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL

HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING

BONDING APPARATUS

Conveyor Apparatus And Method For Transporting Leadframe

Module Comprising a Semiconductor Chip

Frame Feeding System and Frame Feeding Method

Module Comprising a Semiconductor Chip

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

BONDING APPARATUS AND WIRE BONDING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND WIRE BONDER

Apparatus for Manufacturing Semiconductor Package for Wide Lead Fra...

Imaging device and method for a bonding apparatus

Imaging device and method for a bonding apparatus

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Module comprising a semiconductor chip

ELECTRONIC DEVICE HANDLER FOR A BONDING APPARATUS

SEMICONDUCTOR DEVICE AND AN INFORMATION MANAGEMENT SYSTEM THEREFOR

Bonding apparatus and method for cleaning tip of a bonding tool

SEMICONDUCTOR DEVICE AND AN INFORMATION MANAGEMENT SYSTEM THEREFOR

SEMICONDUCTOR HAVING A BONDING WIRE AND PROCESS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Bonding apparatus and method

Method and device for producing a bondable area region on a carrier

Apparatus and method for indexing of substrates and lead frames

Semiconductor device and method of manufacturing the same

Laser cleaning system for a wire bonding machine

Wire bonding apparatus and method for clamping a wire

Semiconductor device and an information management system therefor

Device having resin package and method of producing the same

Packaged IC using insulated wire