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Means for transporting the components to be connected
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CPC
H01L2224/7765
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/7765
Means for transporting the components to be connected
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last 30 patents
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Patent Grant
Chip bonding apparatus and securing assembly therefor
Patent number
12,074,133
Issue date
Aug 27, 2024
GUANGZHOU AIFO LIGHT COMMUNICATION TECHNOLOGY COMPANY LTD.
Guoqiang Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Clip bond semiconductor packages and assembly tools
Patent number
11,676,934
Issue date
Jun 13, 2023
UTAC HEADQUARTERS PTE. LTD.
Albert Louis Bove
H01 - BASIC ELECTRIC ELEMENTS