Means for venting or for letting gases escape

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CPC
H05K2203/1178

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/1178Means for venting or for letting gases escape

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Oxygen and humidity control in storage device
- Patent number 12,193,164
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shen-Min Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support pin for supporting a substrate in a placement area of a pla...
- Patent number 12,028,983
- Issue date Jul 2, 2024
- ASMPT GMBH & CO. KG
- Martin Neusser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board structure including a closed cavity
- Patent number 11,967,758
- Issue date Apr 23, 2024
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxygen and humidity control in storage device
- Patent number 11,723,152
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shen-Min Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board structure including a closed cavity
- Patent number 11,527,819
- Issue date Dec 13, 2022
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic wave shield film, printed wiring board using same,...
- Patent number 11,497,152
- Issue date Nov 8, 2022
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Masahiro Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic wave shield film, printed wiring board using same,...
- Patent number 11,317,548
- Issue date Apr 26, 2022
- Tatsuta Electric Wire & Cable Co., Ltd.
- Masahiro Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing an electric circuit comprising a circuit carri...
- Patent number 11,056,460
- Issue date Jul 6, 2021
- Siemens Aktiengesellschaft
- Stefan Pfefferlein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Removing unwanted flux from an integrated circuit package
- Patent number 10,939,559
- Issue date Mar 2, 2021
- Schlage Lock Company LLC
- Russell L. Steiner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat curable resin composition, and circuit board with electronic c...
- Patent number 10,870,725
- Issue date Dec 22, 2020
- San-ei Kagaku Co., Ltd.
- Yasuhiro Takase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for void reduction in solder joints
- Patent number 10,843,284
- Issue date Nov 24, 2020
- ZKW GROUP GMBH
- Erik Edlinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plated opening with vent path
- Patent number 10,834,817
- Issue date Nov 10, 2020
- NXP USA, INC.
- Michael B. Vincent
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Circuit board, electronic component and display apparatus
- Patent number 10,779,410
- Issue date Sep 15, 2020
- Beijing BOE Optoelectronics Technology Co., Ltd
- Lingguo Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic wave shield film, printed wiring board using same,...
- Patent number 10,757,849
- Issue date Aug 25, 2020
- Tatsuta Electric Wire & Cable Co., Ltd.
- Masahiro Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component-containing module
- Patent number 10,707,403
- Issue date Jul 7, 2020
- Murata Manufacturing Co., Ltd.
- Yoshiharu Suemori
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Printed circuit board structure including a closed cavity
- Patent number 10,700,424
- Issue date Jun 30, 2020
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,600,728
- Issue date Mar 24, 2020
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Voiding control using solid solder preforms embedded in solder paste
- Patent number 10,537,030
- Issue date Jan 14, 2020
- Indium Corporation
- Zhenxi Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Removing unwanted flux from an integrated circuit package
- Patent number 10,512,167
- Issue date Dec 17, 2019
- Schlage Lock Company LLC
- Russell L. Steiner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing same
- Patent number 10,492,306
- Issue date Nov 26, 2019
- Kuraray Co., Ltd.
- Takeshi Takahashi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Power tube connection structure of power amplifier and power amplifier
- Patent number 10,426,036
- Issue date Sep 24, 2019
- Huawei Technologies Co., Ltd.
- Songlin Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Filling method of conductive paste and manufacturing method of mult...
- Patent number 10,321,578
- Issue date Jun 11, 2019
- Nippon Mektron, Ltd.
- Shoji Takano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Touch sensing unit and display device
- Patent number 10,283,347
- Issue date May 7, 2019
- Samsung Display Co., Ltd.
- Choon-Hyop Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wiring board assembly and method for producing same
- Patent number 10,237,971
- Issue date Mar 19, 2019
- Fujikura Ltd.
- Ryotaro Takagi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power tube connection structure of power amplifier and power amplifier
- Patent number 10,165,687
- Issue date Dec 25, 2018
- Huawei Technologies Co., Ltd.
- Songlin Li
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,014,244
- Issue date Jul 3, 2018
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit board
- Patent number 9,888,583
- Issue date Feb 6, 2018
- Minebea Co., Ltd.
- Dohaku Inamori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, and electronic device
- Patent number 9,883,589
- Issue date Jan 30, 2018
- Kyocera Corporation
- Kouichi Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pin connector structure and method
- Patent number 9,775,242
- Issue date Sep 26, 2017
- Intel Corporation
- Tsung-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board package structure and manufacturing method th...
- Patent number 9,743,523
- Issue date Aug 22, 2017
- TRIPOD TECHNOLOGY CORPORATION
- Bo-Shiung Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OXYGEN AND HUMIDITY CONTROL IN STORAGE DEVICE
- Publication number 20250081356
- Publication date Mar 6, 2025
- Semiconductor Manufacturing Co., Lid.
- Shen-Min YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board And Method For Soldering A Chip Housing In A...
- Publication number 20240292514
- Publication date Aug 29, 2024
- LISA DRAXLMAIER GMBH
- Andreas Brinkmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUPPORT PIN FOR SUPPORTING A SUBSTRATE IN A PLACEMENT AREA OF A PLA...
- Publication number 20240114671
- Publication date Apr 4, 2024
- ASMPT GmbH & Co. KG
- Martin NEUSSER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OXYGEN AND HUMIDITY CONTROL IN STORAGE DEVICE
- Publication number 20230337365
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shen-Min YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUPPORT PIN FOR SUPPORTING A SUBSTRATE IN A PLACEMENT AREA OF A PLA...
- Publication number 20230088276
- Publication date Mar 23, 2023
- ASM Assembly Systems GmbH & Co. KG
- Martin NEUSSER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Carrier Having an Installation Place for Electronic Compone...
- Publication number 20210351151
- Publication date Nov 11, 2021
- SIEMENS AKTIENGESELLSCHAFT
- Robby Urbahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXYGEN AND HUMIDITY CONTROL IN STORAGE DEVICE
- Publication number 20210235583
- Publication date Jul 29, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shen-Min YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REMOVING UNWANTED FLUX FROM AN INTEGRATED CIRCUIT PACKAGE
- Publication number 20200236793
- Publication date Jul 23, 2020
- SCHLAGE LOCK COMPANY LLC
- Russell L. Steiner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING AN ELECTRIC CIRCUIT
- Publication number 20190393187
- Publication date Dec 26, 2019
- SIEMENS AKTIENGESELLSCHAFT
- STEFAN PFEFFERLEIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER TUBE CONNECTION STRUCTURE OF POWER AMPLIFIER AND POWER AMPLIFIER
- Publication number 20190223293
- Publication date Jul 18, 2019
- Huawei Technologies Co., Ltd
- Songlin LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, ELECTRONIC COMPONENT AND DISPLAY APPARATUS
- Publication number 20190208635
- Publication date Jul 4, 2019
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Lingguo WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electromagnetic Wave Shield Film, Printed Wiring Board Using Same,...
- Publication number 20190150331
- Publication date May 16, 2019
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Masahiro WATANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20180277471
- Publication date Sep 27, 2018
- DAI NIPPON PRINTING CO., LTD.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Producing Laminated Body, and Laminated Body
- Publication number 20180279487
- Publication date Sep 27, 2018
- JX NIPPON MINING & METALS CORPORATION
- Masayuki Takamori
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
ESCAPE ROUTES
- Publication number 20140312479
- Publication date Oct 23, 2014
- FLEXTRONICS AP, LLC
- Omar Garcia Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD PACKAGE STRUCTURE AND MANUFACTURING METHOD TH...
- Publication number 20140266549
- Publication date Sep 18, 2014
- TRIPOD TECHNOLOGY CORPORATION
- Bo-Shiung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRCUIT BOARD
- Publication number 20140251659
- Publication date Sep 11, 2014
- Kabushiki Kaisha Toyota Jidoshokki
- Hiroaki Asano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Shielding Structures Including Frequency Selective Surfaces
- Publication number 20140209373
- Publication date Jul 31, 2014
- Laird Technologies, Inc.
- John Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20140151106
- Publication date Jun 5, 2014
- Kabushiki Kaisha Toyota Jidoshokki
- Kiminori Ozaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT
- Publication number 20140133120
- Publication date May 15, 2014
- Tatsuro SAWATARI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLANAR ELECTRONIC DEVICE HAVING A MAGNETIC COMPONENT
- Publication number 20140116758
- Publication date May 1, 2014
- TYCO ELECTRONICS SERVICES GMBH
- HAIYING LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPACT ABSORPTION MEMBER AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20140029173
- Publication date Jan 30, 2014
- Jae-Chun PARK
- G02 - OPTICS
Information Patent Application
PIN CONNECTOR STRUCTURE AND METHOD
- Publication number 20130342986
- Publication date Dec 26, 2013
- Tsung-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20130328214
- Publication date Dec 12, 2013
- DAI NIPPON PRINTING CO., LTD.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE AND METHOD FOR PRODUCING SUCH A CIRCUIT MODULE
- Publication number 20130208433
- Publication date Aug 15, 2013
- ROBERT BOSCH GmbH
- Stephan Mazingue-Desailly
- B60 - VEHICLES IN GENERAL
Information Patent Application
GROOVED PLATE FOR IMPROVED SOLDER BONDING
- Publication number 20130087813
- Publication date Apr 11, 2013
- LedEngin, Inc.
- Xiantao Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM FOR REFLOW SOLDERING
- Publication number 20130083489
- Publication date Apr 4, 2013
- STMicroelectronics S.r.l
- Matteo Sebastiano Dimauro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM IN PACKAGE, PRINTED CIRCUIT BOARD PROVIDED WITH SUCH SYSTEM...
- Publication number 20130048360
- Publication date Feb 28, 2013
- Option
- Stijn Vandebril
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM IN PACKAGE, PRINTED CIRCUIT BOARD PROVIDED WITH SUCH SYSTEM...
- Publication number 20130044435
- Publication date Feb 21, 2013
- Option
- Stijn Vandebril
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONTACT ARRANGEMENT
- Publication number 20130005163
- Publication date Jan 3, 2013
- Phoenix Contact GmbH & Co., KG
- Dieter Holste
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Means for venting or for letting gases escape

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Oxygen and humidity control in storage device

Support pin for supporting a substrate in a placement area of a pla...

Printed circuit board structure including a closed cavity

Oxygen and humidity control in storage device

Printed circuit board structure including a closed cavity

Electromagnetic wave shield film, printed wiring board using same,...

Electromagnetic wave shield film, printed wiring board using same,...

Method for producing an electric circuit comprising a circuit carri...

Removing unwanted flux from an integrated circuit package

Heat curable resin composition, and circuit board with electronic c...

Method for void reduction in solder joints

Plated opening with vent path

Circuit board, electronic component and display apparatus

Electromagnetic wave shield film, printed wiring board using same,...

Electronic component-containing module

Printed circuit board structure including a closed cavity

Through-hole electrode substrate

Voiding control using solid solder preforms embedded in solder paste

Removing unwanted flux from an integrated circuit package

Circuit board and method for manufacturing same

Power tube connection structure of power amplifier and power amplifier

Filling method of conductive paste and manufacturing method of mult...

Touch sensing unit and display device

Wiring board assembly and method for producing same

Power tube connection structure of power amplifier and power amplifier

Through-hole electrode substrate

Flexible printed circuit board

Wiring board, and electronic device

Pin connector structure and method

Printed circuit board package structure and manufacturing method th...

Patents Applicationslast 30 patents

OXYGEN AND HUMIDITY CONTROL IN STORAGE DEVICE

Printed Circuit Board And Method For Soldering A Chip Housing In A...

SUPPORT PIN FOR SUPPORTING A SUBSTRATE IN A PLACEMENT AREA OF A PLA...

OXYGEN AND HUMIDITY CONTROL IN STORAGE DEVICE

SUPPORT PIN FOR SUPPORTING A SUBSTRATE IN A PLACEMENT AREA OF A PLA...

Circuit Carrier Having an Installation Place for Electronic Compone...

OXYGEN AND HUMIDITY CONTROL IN STORAGE DEVICE

REMOVING UNWANTED FLUX FROM AN INTEGRATED CIRCUIT PACKAGE

METHOD FOR PRODUCING AN ELECTRIC CIRCUIT

POWER TUBE CONNECTION STRUCTURE OF POWER AMPLIFIER AND POWER AMPLIFIER

CIRCUIT BOARD, ELECTRONIC COMPONENT AND DISPLAY APPARATUS

Electromagnetic Wave Shield Film, Printed Wiring Board Using Same,...

THROUGH-HOLE ELECTRODE SUBSTRATE

Method of Producing Laminated Body, and Laminated Body

ESCAPE ROUTES

PRINTED CIRCUIT BOARD PACKAGE STRUCTURE AND MANUFACTURING METHOD TH...

CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRCUIT BOARD

Shielding Structures Including Frequency Selective Surfaces

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT

PLANAR ELECTRONIC DEVICE HAVING A MAGNETIC COMPONENT

IMPACT ABSORPTION MEMBER AND DISPLAY DEVICE INCLUDING THE SAME

PIN CONNECTOR STRUCTURE AND METHOD

THROUGH-HOLE ELECTRODE SUBSTRATE

CIRCUIT MODULE AND METHOD FOR PRODUCING SUCH A CIRCUIT MODULE

GROOVED PLATE FOR IMPROVED SOLDER BONDING

ELECTRONIC SYSTEM FOR REFLOW SOLDERING

SYSTEM IN PACKAGE, PRINTED CIRCUIT BOARD PROVIDED WITH SUCH SYSTEM...

SYSTEM IN PACKAGE, PRINTED CIRCUIT BOARD PROVIDED WITH SUCH SYSTEM...

ELECTRICAL CONTACT ARRANGEMENT