Means for wire tension adjustments

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H01L2224/78631

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/78631Means for wire tension adjustments

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding apparatus and manufacturing method for semiconductor a...
- Patent number 11,450,640
- Issue date Sep 20, 2022
- Shinkawa Ltd.
- Shinsuke Tei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire tensioner
- Patent number 9,865,563
- Issue date Jan 9, 2018
- Shinkawa Ltd.
- Yoshitaka Takagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bond wire feed system and method therefor
- Patent number 9,397,066
- Issue date Jul 19, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Zhijie Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRE CLAMP AND WIRE BONDING APPARATUS INCLUDING THE SAME
- Publication number 20230230952
- Publication date Jul 20, 2023
- Samsung Electronics Co., Ltd.
- Jaehyeok HEO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS AND MANUFACTURING METHOD FOR SEMICONDUCTOR A...
- Publication number 20200203307
- Publication date Jun 25, 2020
- SHINKAWA LTD.
- Shinsuke TEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE TENSIONER
- Publication number 20160365331
- Publication date Dec 15, 2016
- SHINKAWA LTD.
- Yoshitaka TAKAGI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOND WIRE FEED SYSTEM AND METHOD THEREFOR
- Publication number 20160155718
- Publication date Jun 2, 2016
- ZHIJIE WANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR