means therefor

Industry

CPC
H05K3/187

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/187means therefor

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method for formation of electro-conductive traces on polymeric arti...
- Patent number 10,982,328
- Issue date Apr 20, 2021
- Valstybinis Moksliniu Tyrimu Institutas Fiziniu Ir Technologijos Mokslu Centras
- Karolis Ratautas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Elimination of H2S in immersion tin plating solution
- Patent number 10,774,425
- Issue date Sep 15, 2020
- MacDermid Enthone Inc.
- Cherry S. Santos
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective electroless electrochemical atomic layer deposition in an...
- Patent number 10,640,874
- Issue date May 5, 2020
- Lam Research Corporation
- Aniruddha Joi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wet type processing apparatus for resin film
- Patent number 10,640,875
- Issue date May 5, 2020
- JCU CORPORATION
- Makoto Kohtoku
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating bath composition and method for electroless plating of pall...
- Patent number 10,513,780
- Issue date Dec 24, 2019
- Atotech Deutschland GmbH
- Andreas Walter
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tin or tin alloy plating liquid
- Patent number 9,926,637
- Issue date Mar 27, 2018
- Rohm and Haas Electronic Materials LLC
- Hiroki Okada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Pre-treatment process for electroless plating
- Patent number 9,896,765
- Issue date Feb 20, 2018
- Atotech Deutschland GmbH
- Boris Alexander Janssen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Formaldehyde free electroless copper plating compositions and methods
- Patent number 9,809,883
- Issue date Nov 7, 2017
- Rohm and Haas Electronic Materials LLC
- Andy Lok-Fung Chow
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating bath composition and method for electroless plating of pall...
- Patent number 9,758,874
- Issue date Sep 12, 2017
- Atotech Deutschland GmbH
- Christof Suchentrunk
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for electroless plating of palladium phosphorus directly on...
- Patent number 9,650,719
- Issue date May 16, 2017
- UYEMURA INTERNATIONAL CORPORATION
- Jon E. Bengston
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Formaldehyde free electroless copper plating compositions and methods
- Patent number 9,611,550
- Issue date Apr 4, 2017
- Rohm and Haas Electronic Materials LLC
- Andy Lok-Fung Chow
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for copper plating
- Patent number 9,506,158
- Issue date Nov 29, 2016
- Atotech Deutschland GmbH
- Dirk Rohde
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrostatic adsorptive belt and method of manufacturing thereof,...
- Patent number 9,487,365
- Issue date Nov 8, 2016
- Canon Components, Inc.
- Osamu Kanome
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Electroless gold plating solution for forming fine gold structure,...
- Patent number 9,345,145
- Issue date May 17, 2016
- Kanto Kagaku Kabushiki Kaisha
- Ryota Iwai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Use of titania precursor composition pattern
- Patent number 9,267,206
- Issue date Feb 23, 2016
- Eastman Kodak Company
- Maria Celeste Rellamas Tria
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrostatic adsorptive belt and method of manufacturing thereof,...
- Patent number 9,233,558
- Issue date Jan 12, 2016
- Canon Components, Inc.
- Osamu Kanome
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Wiring board and light emitting device
- Patent number 9,137,890
- Issue date Sep 15, 2015
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroless deposition system
- Patent number 7,913,644
- Issue date Mar 29, 2011
- Lam Research Corporation
- Ron Rulkens
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless metal film-plating system
- Patent number 7,611,584
- Issue date Nov 3, 2009
- LG Electronics Inc.
- Myung Ho Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for deposition of metal on a surface
- Patent number 7,172,785
- Issue date Feb 6, 2007
- G. Alan Thompson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating method and apparatus
- Patent number 7,118,664
- Issue date Oct 10, 2006
- Ebara Corporation
- Junichiro Yoshioka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless copper plating machine, and multi-layer printed wiring...
- Patent number 6,900,394
- Issue date May 31, 2005
- Hitachi, Ltd.
- Takeyuki Itabashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for improving interfacial chemical reactions
- Patent number 6,805,911
- Issue date Oct 19, 2004
- J.G. Systems, Inc.
- John Grunwald
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for metallizing surfaces of substrates
- Patent number 6,773,760
- Issue date Aug 10, 2004
- Yuh Sung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating method and apparatus
- Patent number 6,716,332
- Issue date Apr 6, 2004
- Ebara Corporation
- Junichiro Yoshioka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for improving interfacial chemical reactions i...
- Patent number 6,599,563
- Issue date Jul 29, 2003
- J.G. Systems Inc.
- John Grunwald
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for producing a substrate and plating apparatus
- Patent number 6,495,211
- Issue date Dec 17, 2002
- NGK Spark Plug Co., Ltd.
- Masahiro Iba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroless metal deposition of electronic components in an enclosa...
- Patent number 6,165,912
- Issue date Dec 26, 2000
- CFMT, Inc.
- Christopher F. McConnell
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of making a three-dimensional part with buried conductors
- Patent number 5,909,012
- Issue date Jun 1, 1999
- Ford Motor Company
- Michael George Todd
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Plating method by means of an electroless gold plating solution and...
- Patent number 5,691,003
- Issue date Nov 25, 1997
- Electroplating Engineers Of Japan Limited
- Takayuki Sone
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR SELECTIVE METALLISATION OF INORGANIC DIELECTRICS OR SEMI...
- Publication number 20240407107
- Publication date Dec 5, 2024
- Valstybinis Moksliniu Tyrimu Institutas Fiziniu Ir Technologijos Mokslu Centras
- Karolis RATAUTAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMATION of ELECTRO-CONDUCTIVE TRACES ON POLYMERIC ARTI...
- Publication number 20190360104
- Publication date Nov 28, 2019
- Valstybinis Moksliniu Tyrimu Institutas Fiziniu Ir Technologijos Mokslu Centras
- Karolis RATAUTAS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WET TYPE PROCESSING APPARATUS FOR RESIN FILM
- Publication number 20190024238
- Publication date Jan 24, 2019
- JCU CORPORATION
- Makoto KOHTOKU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PRODUCING ELECTROCONDUCTIVE LAMINATE, LAMINATE, AND ELEC...
- Publication number 20190010608
- Publication date Jan 10, 2019
- FUJIFILM CORPORATION
- Kohei HIGASHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Elimination of H2S in Immersion Tin Plating Solution
- Publication number 20180347038
- Publication date Dec 6, 2018
- MacDermid Enthone Inc.
- Cherry S. Santos
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALL...
- Publication number 20180340261
- Publication date Nov 29, 2018
- Atotech Deutschland GmbH
- Andreas WALTER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WASHING SOLUTION FOR SURFACE OF ELECTROLESS TIN PLATING FILM, REPLE...
- Publication number 20170342566
- Publication date Nov 30, 2017
- MEC COMPANY LTD.
- Yuko SHIBANUMA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HORIZONTAL METHOD OF ELECTROLESS METAL PLATING OF SUBSTRATES WITH I...
- Publication number 20170251557
- Publication date Aug 31, 2017
- Rohm and Haas Electronic Materials L.L.C.
- Feng Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ENVIRONMENTALLY FRIENDLY STABLE CATALYSTS FOR ELECTROLESS METALLIZA...
- Publication number 20170171988
- Publication date Jun 15, 2017
- Rohm and Haas Electronic Materials L.L.C.
- Donald E. Cleary
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR ELECTROLESS PLATING OF PALLADIUM PHOSPHORUS DIRECTLY ON...
- Publication number 20170145567
- Publication date May 25, 2017
- UYEMURA INTERNATIONAL CORPORATION
- JON E. BENGSTON
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PRODUCING PLATED COMPONENT
- Publication number 20170135222
- Publication date May 11, 2017
- Hitachi Maxell, Ltd.
- Akiko KITO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MICROELECTRONIC BUILD-UP LAYERS AND METHODS OF FORMING THE SAME
- Publication number 20160374210
- Publication date Dec 22, 2016
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-TREATMENT PROCESS FOR ELECTROLESS PLATING
- Publication number 20160348246
- Publication date Dec 1, 2016
- Atotech Deutschland GmbH
- Boris Alexander JANSSEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160316558
- Publication date Oct 27, 2016
- IBIDEN CO., LTD.
- Shunsuke SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20160278206
- Publication date Sep 22, 2016
- SIERRA CIRCUITS, INC.
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMALDEHYDE FREE ELECTROLESS COPPER PLATING COMPOSITIONS AND METHODS
- Publication number 20150376795
- Publication date Dec 31, 2015
- Rohm and Haas Electronic Materials L.L.C.
- Andy Lok-Fung Chow
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
EMBEDDED TRACES
- Publication number 20150334825
- Publication date Nov 19, 2015
- Kenneth S. Bahl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
USE OF TITANIA PRECURSOR COMPOSITION PATTERN
- Publication number 20150197856
- Publication date Jul 16, 2015
- Maria Celeste Rellamas Tria
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRING BOARD AND LIGHT EMITTING DEVICE
- Publication number 20140226346
- Publication date Aug 14, 2014
- Shinko Electric Industries Co., Ltd.
- Kazutaka KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIN OR TIN ALLOY PLATING LIQUID
- Publication number 20140183050
- Publication date Jul 3, 2014
- Hiroki OKADA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FORMALDEHYDE FREE ELECTROLESS COPPER PLATING COMPOSITIONS AND METHODS
- Publication number 20140178572
- Publication date Jun 26, 2014
- Rohm and Haas Electronic Materials L.L.C.
- Andy Lok-Fung CHOW
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR COPPER PLATING
- Publication number 20140102910
- Publication date Apr 17, 2014
- Atotech Deutschland GmbH
- Dirk Rohde
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
BASKET JIG FOR ELECTROLESS PLATING APPARATUS AND ELECTROLESS PLATIN...
- Publication number 20140099433
- Publication date Apr 10, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Hyo Seung NAM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND DEVICE FOR THE WET-CHEMICAL TREATMENT OF MATERIAL TO BE...
- Publication number 20120298515
- Publication date Nov 29, 2012
- Atotech Deutschland GmbH
- Andreas Skupin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLESS GOLD PLATING SOLUTION FOR FORMING FINE GOLD STRUCTURE,...
- Publication number 20120119352
- Publication date May 17, 2012
- Kanto Kagaku Kabushiki Kaisha
- Ryota Iwai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroless Deposition System
- Publication number 20110135824
- Publication date Jun 9, 2011
- Ron Rulkens
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEVICE FOR FABRICATING FLEXIBLE FILM
- Publication number 20100038239
- Publication date Feb 18, 2010
- Min Keun Seo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLESS DEPOSITION SYSTEM
- Publication number 20090288593
- Publication date Nov 26, 2009
- BLUE 29, LLC
- Ron Rulkens
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of Applying Catalytic Solution for Use in Electroless Deposi...
- Publication number 20090238979
- Publication date Sep 24, 2009
- William Decesare
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED WIRING BOARD MANUFACTURING APPARATUS, PRINTED WIRING BOARD,...
- Publication number 20080118681
- Publication date May 22, 2008
- Yukihiro UENO
- B32 - LAYERED PRODUCTS

means therefor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for formation of electro-conductive traces on polymeric arti...

Elimination of H2S in immersion tin plating solution

Selective electroless electrochemical atomic layer deposition in an...

Wet type processing apparatus for resin film

Plating bath composition and method for electroless plating of pall...

Tin or tin alloy plating liquid

Pre-treatment process for electroless plating

Formaldehyde free electroless copper plating compositions and methods

Plating bath composition and method for electroless plating of pall...

Method for electroless plating of palladium phosphorus directly on...

Formaldehyde free electroless copper plating compositions and methods

Method for copper plating

Electrostatic adsorptive belt and method of manufacturing thereof,...

Electroless gold plating solution for forming fine gold structure,...

Use of titania precursor composition pattern

Electrostatic adsorptive belt and method of manufacturing thereof,...

Wiring board and light emitting device

Electroless deposition system

Electroless metal film-plating system

Process for deposition of metal on a surface

Plating method and apparatus

Electroless copper plating machine, and multi-layer printed wiring...

Method and apparatus for improving interfacial chemical reactions

Method for metallizing surfaces of substrates

Plating method and apparatus

Method and apparatus for improving interfacial chemical reactions i...

Process for producing a substrate and plating apparatus

Electroless metal deposition of electronic components in an enclosa...

Method of making a three-dimensional part with buried conductors

Plating method by means of an electroless gold plating solution and...

Patents Applicationslast 30 patents

METHOD FOR SELECTIVE METALLISATION OF INORGANIC DIELECTRICS OR SEMI...

METHOD FOR FORMATION of ELECTRO-CONDUCTIVE TRACES ON POLYMERIC ARTI...

WET TYPE PROCESSING APPARATUS FOR RESIN FILM

METHOD FOR PRODUCING ELECTROCONDUCTIVE LAMINATE, LAMINATE, AND ELEC...

Elimination of H2S in Immersion Tin Plating Solution

PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALL...

WASHING SOLUTION FOR SURFACE OF ELECTROLESS TIN PLATING FILM, REPLE...

HORIZONTAL METHOD OF ELECTROLESS METAL PLATING OF SUBSTRATES WITH I...

ENVIRONMENTALLY FRIENDLY STABLE CATALYSTS FOR ELECTROLESS METALLIZA...

METHOD FOR ELECTROLESS PLATING OF PALLADIUM PHOSPHORUS DIRECTLY ON...

METHOD FOR PRODUCING PLATED COMPONENT

MICROELECTRONIC BUILD-UP LAYERS AND METHODS OF FORMING THE SAME

PRE-TREATMENT PROCESS FOR ELECTROLESS PLATING

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD

FORMALDEHYDE FREE ELECTROLESS COPPER PLATING COMPOSITIONS AND METHODS

EMBEDDED TRACES

USE OF TITANIA PRECURSOR COMPOSITION PATTERN

WIRING BOARD AND LIGHT EMITTING DEVICE

TIN OR TIN ALLOY PLATING LIQUID

FORMALDEHYDE FREE ELECTROLESS COPPER PLATING COMPOSITIONS AND METHODS

METHOD FOR COPPER PLATING

BASKET JIG FOR ELECTROLESS PLATING APPARATUS AND ELECTROLESS PLATIN...

METHOD AND DEVICE FOR THE WET-CHEMICAL TREATMENT OF MATERIAL TO BE...

ELECTROLESS GOLD PLATING SOLUTION FOR FORMING FINE GOLD STRUCTURE,...

Electroless Deposition System

DEVICE FOR FABRICATING FLEXIBLE FILM

ELECTROLESS DEPOSITION SYSTEM

Method of Applying Catalytic Solution for Use in Electroless Deposi...

PRINTED WIRING BOARD MANUFACTURING APPARATUS, PRINTED WIRING BOARD,...