Measuring geometric parameters of semiconductor structures

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G01B2210/56

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GPHYSICS G01Measuring instruments G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS G01B2210/00Aspects not specifically covered by any group under G01B

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G01B2210/56Measuring geometric parameters of semiconductor structures

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Dimension measurement apparatus, semiconductor manufacturing appara...
- Patent number 12,320,630
- Issue date Jun 3, 2025
- HITACHI HIGH-TECH CORPORATION
- Pushe Zhao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Full beam metrology for x-ray scatterometry systems
- Patent number 12,320,763
- Issue date Jun 3, 2025
- KLA Corporation
- Antonio Arion Gellineau
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for evaluating semiconductor wafer, method for selecting sem...
- Patent number 12,300,553
- Issue date May 13, 2025
- Shin-Etsu Handotai Co., Ltd.
- Junya Suzuki
- C30 - CRYSTAL GROWTH
Information Patent Grant
Characterizing and measuring in small boxes using XPS with multiple...
- Patent number 12,281,893
- Issue date Apr 22, 2025
- NOVA MEASURING INSTRUMENTS INC.
- Heath Pois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Measuring apparatus
- Patent number 12,264,908
- Issue date Apr 1, 2025
- Disco Corporation
- Keiji Nomaru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus to characterize substrates and films
- Patent number 12,235,091
- Issue date Feb 25, 2025
- Onto Innovation Inc.
- Jian Ding
- G01 - MEASURING TESTING
Information Patent Grant
Metrology and process control for semiconductor manufacturing
- Patent number 12,236,364
- Issue date Feb 25, 2025
- Nova Ltd.
- Eitan Rothstein
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor measurement apparatus
- Patent number 12,222,282
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Seoyeon Jeong
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for measurement of misregistration and ameliora...
- Patent number 12,222,199
- Issue date Feb 11, 2025
- KLA Corporation
- Roie Volkovich
- G01 - MEASURING TESTING
Information Patent Grant
Methods and systems for measurement of tilt and overlay of a structure
- Patent number 12,209,854
- Issue date Jan 28, 2025
- KLA Corporation
- Stilian Ivanov Pandev
- G01 - MEASURING TESTING
Information Patent Grant
Spatial pattern loading measurement with imaging metrology
- Patent number 12,211,717
- Issue date Jan 28, 2025
- Applied Materials, Inc.
- Eric Chin Hong Ng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for measuring wafer profile
- Patent number 12,188,761
- Issue date Jan 7, 2025
- Shin-Etsu Handotai Co., Ltd.
- Masato Ohnishi
- G01 - MEASURING TESTING
Information Patent Grant
Integrated substrate measurement system
- Patent number 12,148,647
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Patricia Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced cross sectional features measurement methodology
- Patent number 12,123,708
- Issue date Oct 22, 2024
- Applied Materials, Inc.
- Manoj Kumar Dayyala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and a system for characterizing structures through a substrate
- Patent number 12,123,698
- Issue date Oct 22, 2024
- UNITY SEMICONDUCTOR
- Alain Courteville
- G01 - MEASURING TESTING
Information Patent Grant
Metrology apparatus and method for determining a characteristic of...
- Patent number 12,112,260
- Issue date Oct 8, 2024
- ASML Netherlands B.V.
- Lorenzo Tripodi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device feature specific edge placement error (EPE)
- Patent number 12,092,966
- Issue date Sep 17, 2024
- KLA Corporation
- Amnon Manassen
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Measuring apparatus and method of wafer geometry
- Patent number 12,072,176
- Issue date Aug 27, 2024
- Nanjing ZhongAn Semiconductor Equipment Ltd
- An Andrew Zeng
- G01 - MEASURING TESTING
Information Patent Grant
Raman spectroscopy based measurements in patterned structures
- Patent number 12,066,385
- Issue date Aug 20, 2024
- Nova Ltd.
- Gilad Barak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical metrology models for in-line film thickness measurements
- Patent number 12,062,583
- Issue date Aug 13, 2024
- Applied Materials Israel Ltd.
- Eric Chin Hong Ng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Detecting outliers and anomalies for OCD metrology machine learning
- Patent number 12,038,271
- Issue date Jul 16, 2024
- Nova Ltd.
- Eitan A. Rothstein
- G01 - MEASURING TESTING
Information Patent Grant
Hybrid metrology method and system
- Patent number 12,025,560
- Issue date Jul 2, 2024
- Gilad Barak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metrology system and method for determining a characteristic of one...
- Patent number 12,007,700
- Issue date Jun 11, 2024
- ASML Netherlands B.V.
- Patricius Aloysius Jacobus Tinnemans
- G01 - MEASURING TESTING
Information Patent Grant
Lithographic apparatus, metrology systems, phased array illuminatio...
- Patent number 11,994,808
- Issue date May 28, 2024
- ASML Holding N.V.
- Mohamed Swillam
- G01 - MEASURING TESTING
Information Patent Grant
Methods and systems for combining x-ray metrology data sets to impr...
- Patent number 11,990,380
- Issue date May 21, 2024
- KLA Corporation
- Christopher Liman
- G01 - MEASURING TESTING
Information Patent Grant
Through-focus image-based metrology device, operation method thereo...
- Patent number 11,988,495
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Kwangsoo Kim
- G01 - MEASURING TESTING
Information Patent Grant
Characterizing and measuring in small boxes using XPS with multiple...
- Patent number 11,988,502
- Issue date May 21, 2024
- NOVA MEASURING INSTRUMENTS INC.
- Heath Pois
- G01 - MEASURING TESTING
Information Patent Grant
Reducing device overlay errors
- Patent number 11,971,664
- Issue date Apr 30, 2024
- KLA-Tencor Corporation
- Liran Yerushalmi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithographic apparatus, metrology systems, phased array illuminatio...
- Patent number 11,966,169
- Issue date Apr 23, 2024
- ASML Holding N.V.
- Mohamed Swillam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical phase measurement system and method
- Patent number 11,946,875
- Issue date Apr 2, 2024
- Nova Ltd.
- Gilad Barak
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
METROLOGY AND PROCESS CONTROL FOR SEMICONDUCTOR MANUFACTURING
- Publication number 20250181941
- Publication date Jun 5, 2025
- NOVA LTD
- EITAN ROTHSTEIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DETECTION SYSTEM, COMPENSATION METHOD, AND COMPUTER READABLE MEDIUM...
- Publication number 20250172379
- Publication date May 29, 2025
- CHROMA ATE INC.
- HAO-CHIANG HU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DEVICE AND METHOD FOR DETERMINING WAFER BOW
- Publication number 20250167023
- Publication date May 22, 2025
- TOKYO ELECTRON LIMITED
- Daniel FULFORD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ANALYSING THE SURFACE QUALITY OF A SUBSTRAT...
- Publication number 20250164239
- Publication date May 22, 2025
- IMAGINE OPTIC
- Xavier Levecq
- G01 - MEASURING TESTING
Information Patent Application
DEPTH PROFILING OF SEMICONDUCTOR STRUCTURES USING MULTI-WAVELENGTH...
- Publication number 20250155235
- Publication date May 15, 2025
- APPLIED MATERIALS ISRAEL LTD.
- Ori Golani
- G01 - MEASURING TESTING
Information Patent Application
HEIGHT MEASUREMENT SENSOR
- Publication number 20250146806
- Publication date May 8, 2025
- ASML NETHERLANDS B.V.
- Mihaita POPINCIUC
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250137777
- Publication date May 1, 2025
- Fuji Electric Co., Ltd.
- Shunya HAYASHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEASUREMENT MACHINE
- Publication number 20250123097
- Publication date Apr 17, 2025
- MITUTOYO CORPORATION
- Yuki NAKAJIMA
- G01 - MEASURING TESTING
Information Patent Application
SPATIAL PATTERN LOADING MEASUREMENT WITH IMAGING METROLOGY
- Publication number 20250125171
- Publication date Apr 17, 2025
- Applied Materials, Inc.
- Eric Chin Hong Ng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RAMAN SPECTROSCOPY BASED MEASUREMENTS IN PATTERNED STRUCTURES
- Publication number 20250123210
- Publication date Apr 17, 2025
- NOVA LTD
- Gilad Barak
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF MEASURING FILM THICKNESS, AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250067556
- Publication date Feb 27, 2025
- TOKYO ELECTRON LIMITED
- Yuji OTSUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR OPTIMIZING OPTICAL INSPECTION OF PATTERNED ST...
- Publication number 20250054128
- Publication date Feb 13, 2025
- NOVA LTD
- Boaz BRILL
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DETECTING OUTLIERS AND ANOMALIES FOR OCD METROLOGY MACHINE LEARNING
- Publication number 20250027767
- Publication date Jan 23, 2025
- NOVA LTD
- EITAN A. ROTHSTEIN
- G01 - MEASURING TESTING
Information Patent Application
MEASURING DEVICE AND FORMING MACHINE
- Publication number 20250020448
- Publication date Jan 16, 2025
- ASAHI-SEIKI MANUFACTURING CO., LTD.
- Yasuo NAKAZAKI
- G01 - MEASURING TESTING
Information Patent Application
WAFER INSPECTION APPARATUS AND METHOD OF INSPECTING WAFER USING SAME
- Publication number 20250020445
- Publication date Jan 16, 2025
- Korea Research Institute of Standards and Science
- Chan Yong HWANG
- G01 - MEASURING TESTING
Information Patent Application
OPTICAL METROLOGY WITH INFLUENCE MAP OF UNKNOWN SECTION
- Publication number 20250012737
- Publication date Jan 9, 2025
- ONTO INNOVATION INC.
- Yiliang LIU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HYBRID METROLOGY METHOD AND SYSTEM
- Publication number 20250003882
- Publication date Jan 2, 2025
- NOVA LTD
- GILAD BARAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED CROSS SECTIONAL FEATURES MEASUREMENT METHODOLOGY
- Publication number 20250003742
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Manoj Kumar Dayyala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMBINATION OF MULTIWAVELENGTH RAMAN AND SPECTROSCOPIC ELLIPSOMETRY...
- Publication number 20240418633
- Publication date Dec 19, 2024
- KLA Corporation
- Shova Subedi
- G01 - MEASURING TESTING
Information Patent Application
Metrology Apparatus And Method For Determining A Characteristic Of...
- Publication number 20240412067
- Publication date Dec 12, 2024
- ASML NETHERLANDS B.V.
- Lorenzo Tripodi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTI-TARGET DESIGN FOR IN-SITU ANALYSIS OF SEMICONDUCTOR FABRICATI...
- Publication number 20240404851
- Publication date Dec 5, 2024
- Applied Materials, Inc.
- Yudong Hao
- G05 - CONTROLLING REGULATING
Information Patent Application
CHARACTERIZING AND MEASURING IN SMALL BOXES USING XPS WITH MULTIPLE...
- Publication number 20240401940
- Publication date Dec 5, 2024
- NOVA MEASURING INSTRUMENTS INC.
- Heath POIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM OF SAMPLE EDGE DETECTION AND SAMPLE POSITIONING F...
- Publication number 20240402093
- Publication date Dec 5, 2024
- ASML NETHERLANDS B.V.
- Xiaodong MENG
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
FULL WAFER THICKNESS MAP REFLECTOMETRY
- Publication number 20240401930
- Publication date Dec 5, 2024
- GLOBALWAFERS CO., LTD.
- Benno Orschel
- G01 - MEASURING TESTING
Information Patent Application
INSPECTION SYSTEM AND METHOD FOR ANALYZING FAULTS
- Publication number 20240393258
- Publication date Nov 28, 2024
- WICKON HIGHTECH GMBH
- Roman WIESER
- G01 - MEASURING TESTING
Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND FILM THICKNESS MEASURING METHOD
- Publication number 20240387301
- Publication date Nov 21, 2024
- TOKYO ELECTRON LIMITED
- Hirokazu KYOKANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR MEASURING OPTICAL THICKNESS
- Publication number 20240377186
- Publication date Nov 14, 2024
- PRECITEC OPTRONIK GMBH
- Stephan Weiß
- G01 - MEASURING TESTING
Information Patent Application
SUBSTRATE THICKNESS MEASURING DEVICE, SUBSTRATE PROCESSING SYSTEM,...
- Publication number 20240369339
- Publication date Nov 7, 2024
- TOKYO ELECTRON LIMITED
- Teruhiko MORIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PHASE MEASUREMENT METHOD AND SYSTEM
- Publication number 20240361253
- Publication date Oct 31, 2024
- NOVA LTD
- Gilad BARAK
- G01 - MEASURING TESTING
Information Patent Application
Methods And Systems For Measurement Of Semiconductor Structures Wit...
- Publication number 20240353760
- Publication date Oct 24, 2024
- KLA Corporation
- John J. Hench
- G01 - MEASURING TESTING

Measuring geometric parameters of semiconductor structures

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Dimension measurement apparatus, semiconductor manufacturing appara...

Full beam metrology for x-ray scatterometry systems

Method for evaluating semiconductor wafer, method for selecting sem...

Characterizing and measuring in small boxes using XPS with multiple...

Measuring apparatus

Apparatus to characterize substrates and films

Metrology and process control for semiconductor manufacturing

Semiconductor measurement apparatus

Systems and methods for measurement of misregistration and ameliora...

Methods and systems for measurement of tilt and overlay of a structure

Spatial pattern loading measurement with imaging metrology

Method for measuring wafer profile

Integrated substrate measurement system

Enhanced cross sectional features measurement methodology

Method and a system for characterizing structures through a substrate

Metrology apparatus and method for determining a characteristic of...

Device feature specific edge placement error (EPE)

Measuring apparatus and method of wafer geometry

Raman spectroscopy based measurements in patterned structures

Optical metrology models for in-line film thickness measurements

Detecting outliers and anomalies for OCD metrology machine learning

Hybrid metrology method and system

Metrology system and method for determining a characteristic of one...

Lithographic apparatus, metrology systems, phased array illuminatio...

Methods and systems for combining x-ray metrology data sets to impr...

Through-focus image-based metrology device, operation method thereo...

Characterizing and measuring in small boxes using XPS with multiple...

Reducing device overlay errors

Lithographic apparatus, metrology systems, phased array illuminatio...

Optical phase measurement system and method

Patents Applicationslast 30 patents

METROLOGY AND PROCESS CONTROL FOR SEMICONDUCTOR MANUFACTURING

DETECTION SYSTEM, COMPENSATION METHOD, AND COMPUTER READABLE MEDIUM...

DEVICE AND METHOD FOR DETERMINING WAFER BOW

SYSTEMS AND METHODS FOR ANALYSING THE SURFACE QUALITY OF A SUBSTRAT...

DEPTH PROFILING OF SEMICONDUCTOR STRUCTURES USING MULTI-WAVELENGTH...

HEIGHT MEASUREMENT SENSOR

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

MEASUREMENT MACHINE

SPATIAL PATTERN LOADING MEASUREMENT WITH IMAGING METROLOGY

RAMAN SPECTROSCOPY BASED MEASUREMENTS IN PATTERNED STRUCTURES

METHOD OF MEASURING FILM THICKNESS, AND SUBSTRATE PROCESSING APPARATUS

METHOD AND SYSTEM FOR OPTIMIZING OPTICAL INSPECTION OF PATTERNED ST...

DETECTING OUTLIERS AND ANOMALIES FOR OCD METROLOGY MACHINE LEARNING

MEASURING DEVICE AND FORMING MACHINE

WAFER INSPECTION APPARATUS AND METHOD OF INSPECTING WAFER USING SAME

OPTICAL METROLOGY WITH INFLUENCE MAP OF UNKNOWN SECTION

HYBRID METROLOGY METHOD AND SYSTEM

ENHANCED CROSS SECTIONAL FEATURES MEASUREMENT METHODOLOGY

COMBINATION OF MULTIWAVELENGTH RAMAN AND SPECTROSCOPIC ELLIPSOMETRY...

Metrology Apparatus And Method For Determining A Characteristic Of...

MULTI-TARGET DESIGN FOR IN-SITU ANALYSIS OF SEMICONDUCTOR FABRICATI...

CHARACTERIZING AND MEASURING IN SMALL BOXES USING XPS WITH MULTIPLE...

METHOD AND SYSTEM OF SAMPLE EDGE DETECTION AND SAMPLE POSITIONING F...

FULL WAFER THICKNESS MAP REFLECTOMETRY

INSPECTION SYSTEM AND METHOD FOR ANALYZING FAULTS

SUBSTRATE PROCESSING SYSTEM AND FILM THICKNESS MEASURING METHOD

METHOD AND DEVICE FOR MEASURING OPTICAL THICKNESS

SUBSTRATE THICKNESS MEASURING DEVICE, SUBSTRATE PROCESSING SYSTEM,...

OPTICAL PHASE MEASUREMENT METHOD AND SYSTEM

Methods And Systems For Measurement Of Semiconductor Structures Wit...