Mechanical cleaning

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CPC
H01L2224/80912

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80912Mechanical cleaning

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

Information Patent Application
SELF-ASSEMBLY METHOD AND EQUIPMENT
- Publication number 20250192096
- Publication date Jun 12, 2025
- Intel Corporation
- Yi SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BULK SOLDER REMOVAL ON PROCESSOR PACKAGING
- Publication number 20170179066
- Publication date Jun 22, 2017
- Russell S. Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR