TREA

Mechanical cleaning

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  • CPC
  • H01L2224/80012
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80012Mechanical cleaning
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Die processing
    • Patent number 11,742,315
    • Issue date Aug 29, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Die processing
    • Patent number 10,985,133
    • Issue date Apr 20, 2021
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Treatment, before the bonding of a mixed Cu-oxide surface, by a pla...
    • Patent number 10,910,782
    • Issue date Feb 2, 2021
    • Commissariat a l'Energie Atomique et Aux Energies Alternatives
    • Laurent Vandroux
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Die processing
    • Patent number 10,714,449
    • Issue date Jul 14, 2020
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method for bonding substrates together, and substrate bonding device
    • Patent number 10,580,752
    • Issue date Mar 3, 2020
    • BONDTECH CO., LTD.
    • Akira Yamauchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Die processing
    • Patent number 10,515,925
    • Issue date Dec 24, 2019
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Die processing
    • Patent number 10,269,756
    • Issue date Apr 23, 2019
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer bonding process and structure
    • Patent number 10,128,209
    • Issue date Nov 13, 2018
    • Taiwan Semiconductor Manufacturing Company
    • Ping-Yin Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Hybrid bonding system and cleaning method thereof
    • Patent number 9,917,069
    • Issue date Mar 13, 2018
    • Taiwan Semiconductor Manufacturing Company Ltd.
    • Ping-Yin Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Three-dimensional integrated structure capable of detecting a tempe...
    • Patent number 8,890,276
    • Issue date Nov 18, 2014
    • STMicroelectronics (Crolles 2) SAS
    • Laurent-Luc Chapelon
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Atomic level bonding for electronics packaging
    • Patent number 8,754,512
    • Issue date Jun 17, 2014
    • Delphi Technologies, Inc.
    • Ralph S. Taylor
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    MEMS devices and methods of forming same
    • Patent number 8,742,595
    • Issue date Jun 3, 2014
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Bruce C. S. Chou
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    MEMS devices and methods of forming same
    • Patent number 8,497,148
    • Issue date Jul 30, 2013
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Bruce C. S. Chou
    • B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

  • Information Patent Application

    BONDING APPARATUS, BONDING METHOD AND ARTICLE MANUFACTURING METHOD
    • Publication number 20240421117
    • Publication date Dec 19, 2024
    • Canon Kabushiki Kaisha
    • KIYOTAKA NAKAMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIE PROCESSING
    • Publication number 20240021572
    • Publication date Jan 18, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240006301
    • Publication date Jan 4, 2024
    • nD-HI Technologies Lab, Inc.
    • Ho-Ming TONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD
    • Publication number 20230275062
    • Publication date Aug 31, 2023
    • TOKYO ELECTRON LIMITED
    • Toshifumi Inamasu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HYBRID BONDING APPARATUS AND HYBRID BONDING METHOD USING THE SAME
    • Publication number 20230087198
    • Publication date Mar 23, 2023
    • HANWHA PRECISION MACHINERY CO., LTD.
    • Tae Woo KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIE PROCESSING
    • Publication number 20210233888
    • Publication date Jul 29, 2021
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Cyprian Emeka UZOH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIE PROCESSING
    • Publication number 20200321307
    • Publication date Oct 8, 2020
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Cyprian Emeka UZOH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIE PROCESSING
    • Publication number 20190371761
    • Publication date Dec 5, 2019
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Cyprian Emeka UZOH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIE PROCESSING
    • Publication number 20190189588
    • Publication date Jun 20, 2019
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Cyprian Emeka UZOH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Die Processing
    • Publication number 20180308819
    • Publication date Oct 25, 2018
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Cyprian Emeka UZOH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BULK SOLDER REMOVAL ON PROCESSOR PACKAGING
    • Publication number 20170179066
    • Publication date Jun 22, 2017
    • Russell S. Aoki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MEMS DEVICES AND METHODS OF FORMING SAME
    • Publication number 20140151823
    • Publication date Jun 5, 2014
    • Bruce C.S. Chou
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    ATOMIC LEVEL BONDING FOR ELECTRONICS PACKAGING
    • Publication number 20140151864
    • Publication date Jun 5, 2014
    • Delphi Technologies, Inc.
    • Ralph S. TAYLOR
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    THREE-DIMENSIONAL INTEGRATED STRUCTURE CAPABLE OF DETECTING A TEMPE...
    • Publication number 20140015088
    • Publication date Jan 16, 2014
    • Laurent-Luc Chapelon
    • G01 - MEASURING TESTING
  • Information Patent Application

    TREATMENT, BEFORE THE BONDING OF A MIXED CU-OXIDE SURFACE, BY A PLA...
    • Publication number 20130153093
    • Publication date Jun 20, 2013
    • Commissariat A L'Energie Atomique et Aux Energies Alternatives
    • Laurent Vandroux
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    MEMS Devices and Methods of Forming Same
    • Publication number 20130020718
    • Publication date Jan 24, 2013
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Bruce C.S. Chou
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    Method of low temperature wafer bonding through Au/Ag diffusion
    • Publication number 20080194077
    • Publication date Aug 14, 2008
    • National Central University
    • Cheng-Yi Liu
    • H01 - BASIC ELECTRIC ELEMENTS