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CPC
H01L2224/77703
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/77703
Mechanical holding means
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Patents Grants
last 30 patents
Information
Patent Grant
Method for electrically contacting a component by galvanic connecti...
Patent number
11,037,862
Issue date
Jun 15, 2021
Siemens Aktiengesellschaft
Hubert Baueregger
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Electrically conductive pattern printer for downhole tools
Patent number
10,799,908
Issue date
Oct 13, 2020
Halliburton Energy Services, Inc.
Robert L. Reynolds
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Patents Applications
last 30 patents