Mechanical holding means

Industry

CPC
H01L2224/75703

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75703Mechanical holding means

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor substrate alignment device and a semiconductor substr...
- Patent number 12,027,401
- Issue date Jul 2, 2024
- Samsung Electronics Co., Ltd.
- Gwanghee Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding method and wafer bonding apparatus
- Patent number 11,721,662
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Tai Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
- Patent number 11,651,983
- Issue date May 16, 2023
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-attach method to compensate for thermal expansion
- Patent number 11,430,744
- Issue date Aug 30, 2022
- Cree, Inc.
- David Seebacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and related techniques for handling aligned substrate pairs
- Patent number 11,183,401
- Issue date Nov 23, 2021
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Bonding alignment tool
- Patent number 10,847,490
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Tai Shih
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
- Patent number 10,825,705
- Issue date Nov 3, 2020
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive pattern printer for downhole tools
- Patent number 10,799,908
- Issue date Oct 13, 2020
- Halliburton Energy Services, Inc.
- Robert L. Reynolds
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Passive hydraulic load leveler for thermal compression bonding
- Patent number 10,438,919
- Issue date Oct 8, 2019
- Northrop Grumman Systems Corporation
- Victor J. Watson
- B30 - PRESSES
Information Patent Grant
Bonding alignment tool
- Patent number 10,396,054
- Issue date Aug 27, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Tai Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package alignment frame for local reflow
- Patent number 9,991,223
- Issue date Jun 5, 2018
- Intel Corporation
- Russell S. Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for molecular adhesion bonding with compensation for radi...
- Patent number 9,818,614
- Issue date Nov 14, 2017
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Gweltaz Gaudin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-step direct bonding processes and tools for performing the same
- Patent number 9,521,795
- Issue date Dec 13, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip bonder and method of correcting flatness and deformation...
- Patent number 9,406,640
- Issue date Aug 2, 2016
- Shinkawa Ltd.
- Kohei Seyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Constrained die adhesion cure process
- Patent number 9,305,894
- Issue date Apr 5, 2016
- GLOBALFOUNDRIES Inc.
- Edmund Blackshear
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for molecular adhesion bonding with compensation for radial...
- Patent number 8,475,612
- Issue date Jul 2, 2013
- Soitec
- Gweltaz Gaudin
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of manufacturing LED light bar and manufacturing equipment t...
- Patent number 8,424,744
- Issue date Apr 23, 2013
- Hon Hai Precision Industry Co., Ltd.
- Chih-Chen Lai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for removing known good die using hot shear pr...
- Patent number 5,961,026
- Issue date Oct 5, 1999
- International Business Machines Corporation
- David Charles Olson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for removing known good die using hot shear pr...
- Patent number 5,738,267
- Issue date Apr 14, 1998
- International Business Machines Corporation
- David Charles Olson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for removing known good die using hot shear pr...
- Patent number 5,707,000
- Issue date Jan 13, 1998
- International Business Machines Corporation
- David Charles Olson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for removing known good die using hot shear pr...
- Patent number 5,636,781
- Issue date Jun 10, 1997
- International Business Machines Corporation
- David C. Olson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for removing known good die using hot shear pr...
- Patent number 5,556,024
- Issue date Sep 17, 1996
- International Business Machines Corporation
- David C. Olson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR SUBSTRATE ALIGNMENT DEVICE AND A SEMICONDUCTOR SUBSTR...
- Publication number 20220068688
- Publication date Mar 3, 2022
- Samsung Electronics Co., Ltd.
- Gwanghee JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD AND WAFER BONDING APPARATUS
- Publication number 20210050324
- Publication date Feb 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Tai SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS
- Publication number 20210013079
- Publication date Jan 14, 2021
- SUSS MICROTEC LITHOGRAPHY GMBH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING ALIGNMENT TOOL
- Publication number 20190378813
- Publication date Dec 12, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Tai SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ALIGNMENT FRAME FOR LOCAL REFLOW
- Publication number 20170179067
- Publication date Jun 22, 2017
- Intel Corporation
- RUSSELL S. AOKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding Method, Storage Medium, Bonding Apparatus and Bonding System
- Publication number 20160155721
- Publication date Jun 2, 2016
- TOKYO ELECTRON LIMITED
- Kenji SUGAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOLECULAR ADHESION BONDING WITH COMPENSATION FOR RADIAL...
- Publication number 20150348933
- Publication date Dec 3, 2015
- SOITEC
- Gweltaz Gaudin
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING ALIGNMENT TOOL
- Publication number 20150340337
- Publication date Nov 26, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Tai SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONSTRAINED DIE ADHESION CURE PROCESS
- Publication number 20140359995
- Publication date Dec 11, 2014
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Two-Step Direct Bonding Processes and Tools for Performing the Same
- Publication number 20140263583
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LED LIGHT BAR
- Publication number 20130214032
- Publication date Aug 22, 2013
- HON HAI PRECISION INDUSTRY CO., LTD.
- CHIH-CHEN LAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MOLECULAR ADHESION BONDING WITH COMPENSATION FOR RADIAL...
- Publication number 20130210171
- Publication date Aug 15, 2013
- SOITEC
- Gweltaz Gaudin
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING ALIGNMENT TOOL AND METHOD
- Publication number 20130086786
- Publication date Apr 11, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Tai SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LED LIGHT BAR AND MANUFACTURING EQUIPMENT T...
- Publication number 20120175404
- Publication date Jul 12, 2012
- HON HAI Precision Industry CO., LTD.
- CHIH-CHEN LAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MOLECULAR ADHESION BONDING WITH COMPENSATION FOR RADIAL...
- Publication number 20120006463
- Publication date Jan 12, 2012
- Gweltaz Gaudin
- B32 - LAYERED PRODUCTS
Information Patent Application
Electronic assembly with detachable components
- Publication number 20110228506
- Publication date Sep 22, 2011
- Kong-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly with detachable components
- Publication number 20110222253
- Publication date Sep 15, 2011
- Kong-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly with detachable components
- Publication number 20110223695
- Publication date Sep 15, 2011
- Kong-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly with detachable components
- Publication number 20110222252
- Publication date Sep 15, 2011
- Kong-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS

Mechanical holding means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor substrate alignment device and a semiconductor substr...

Wafer bonding method and wafer bonding apparatus

Apparatus, system, and method for handling aligned wafer pairs

Die-attach method to compensate for thermal expansion

System and related techniques for handling aligned substrate pairs

Method for electrically contacting a component by galvanic connecti...

Bonding alignment tool

Apparatus, system, and method for handling aligned wafer pairs

Electrically conductive pattern printer for downhole tools

Passive hydraulic load leveler for thermal compression bonding

Bonding alignment tool

Semiconductor package alignment frame for local reflow

Apparatus for molecular adhesion bonding with compensation for radi...

Two-step direct bonding processes and tools for performing the same

Flip chip bonder and method of correcting flatness and deformation...

Constrained die adhesion cure process

Method for molecular adhesion bonding with compensation for radial...

Method of manufacturing LED light bar and manufacturing equipment t...

Apparatus and method for removing known good die using hot shear pr...

Apparatus and method for removing known good die using hot shear pr...

Apparatus and method for removing known good die using hot shear pr...

Apparatus and method for removing known good die using hot shear pr...

Apparatus and method for removing known good die using hot shear pr...

Patents Applicationslast 30 patents

SEMICONDUCTOR SUBSTRATE ALIGNMENT DEVICE AND A SEMICONDUCTOR SUBSTR...

WAFER BONDING METHOD AND WAFER BONDING APPARATUS

APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS

BONDING ALIGNMENT TOOL

SEMICONDUCTOR PACKAGE ALIGNMENT FRAME FOR LOCAL REFLOW

Bonding Method, Storage Medium, Bonding Apparatus and Bonding System

METHOD FOR MOLECULAR ADHESION BONDING WITH COMPENSATION FOR RADIAL...

BONDING ALIGNMENT TOOL

CONSTRAINED DIE ADHESION CURE PROCESS

Two-Step Direct Bonding Processes and Tools for Performing the Same

METHOD OF MANUFACTURING LED LIGHT BAR

METHOD FOR MOLECULAR ADHESION BONDING WITH COMPENSATION FOR RADIAL...

BONDING ALIGNMENT TOOL AND METHOD

METHOD OF MANUFACTURING LED LIGHT BAR AND MANUFACTURING EQUIPMENT T...

METHOD FOR MOLECULAR ADHESION BONDING WITH COMPENSATION FOR RADIAL...

Electronic assembly with detachable components

Electronic assembly with detachable components

Electronic assembly with detachable components

Electronic assembly with detachable components